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MTA9ADF1G72PZ-2G6D1

产品描述DDR4 8GB RDIMM VLP
产品类别存储    存储   
文件大小488KB,共28页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
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MTA9ADF1G72PZ-2G6D1概述

DDR4 8GB RDIMM VLP

MTA9ADF1G72PZ-2G6D1规格参数

参数名称属性值
厂商名称Micron Technology
包装说明RDIMM-288
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式SINGLE BANK PAGE BURST
其他特性AUTO/SELF REFRESH; WD-MAX
JESD-30 代码R-XDMA-N288
长度133.35 mm
内存密度77309411328 bit
内存集成电路类型DDR DRAM MODULE
内存宽度72
功能数量1
端口数量1
端子数量288
字数1073741824 words
字数代码1000000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度
组织1GX72
封装主体材料UNSPECIFIED
封装代码DIMM
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
座面最大高度18.9 mm
自我刷新YES
最大供电电压 (Vsup)1.26 V
最小供电电压 (Vsup)1.14 V
标称供电电压 (Vsup)1.2 V
表面贴装NO
技术CMOS
温度等级OTHER
端子形式NO LEAD
端子位置DUAL
宽度3.9 mm

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8GB (x72, ECC, SR) 288-Pin DDR4 VLP RDIMM
Features
DDR4 SDRAM RDIMM
MTA9ADF1G72PZ – 8GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, registered very low profile dual in-line
memory module (VLP RDIMM)
• Fast data transfer rates: PC4-3200, PC4-2666
• 8GB (1 Gig x 72)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V
REFDQ
generation and calibration
• Single-rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
PC4-
3200
2933
2666
24
3200,
2933
22
3200,
2933
2933
21
2933
2933
20 \
19
2666 \
2666
2666 \
2666
2666 \
2666
18 \
17
2400 \
2400
2400 \
2400
2400 \
2400
16 \
15
2133 \
2133
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
1600 \
1600
10 \
9
1333 \
t
RCD
t
RP
t
RC
Figure 1: 288-Pin VLP RDIMM (MO-309, R/C-G,
PCB 2355)
Module height: 18.75mm (0.738in)
Figure 2: 288-Pin VLP RDIMM (MO-309, R/C-G0,
PCB 2462, PCB 2617)
Module height: 18.75mm (0.738in)
Options
• Operating temperature
– Commercial (0°C
T
OPER
+95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.75ns @ CL = 19 (DDR4-2666)
Marking
None
Z
-3G2
-2G6
Speed
Grade
(ns)
13.75
(ns)
13.75
(ns)
45.75
-3G2
-2G9
-2G6
1333 \ 14.32
14.32
46.32
1
(13.75)
1
(45.75)
1
(13.75)
1333 \ 14.25
14.25
46.25
1
(13.75)
1
(45.75)
1
(13.75)
PDF: CCMTD-1725822587-9935
adf9c1gx72pz.pdf - Rev. E 11/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.

 
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