BTA16-600SW3G,
BTA16-800SW3G
Triacs
Silicon Bidirectional Thyristors
Designed for high performance full-wave ac control applications
where high noise immunity and high commutating di/dt are required.
Features
http://onsemi.com
•
•
•
•
•
•
•
•
•
Blocking Voltage to 800 V
On-State Current Rating of 16 A RMS at 25°C
Uniform Gate Trigger Currents in Three Quadrants
High Immunity to dV/dt
−
250 V/ms minimum at 110°C
Minimizes Snubber Networks for Protection
Industry Standard TO-220AB Package
High Commutating dI/dt
−
2 A/ms minimum at 110°C
Internally Isolated (2500 V
RMS
)
These are Pb−Free Devices*
Rating
Symbol
V
DRM,
V
RRM
600
800
I
T(RMS)
I
TSM
16
170
A
A
Value
Unit
V
1
2
TRIACS
16 AMPERES RMS
600 thru 800 VOLTS
MT2
G
4
MT1
MARKING
DIAGRAM
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Peak Repetitive Off−State Voltage (Note 1)
(T
J
=
−40
to 110°C, Sine Wave,
50 to 60 Hz, Gate Open)
BTA16−600SW3G
BTA16−800SW3G
On-State RMS Current
(Full Cycle Sine Wave, 60 Hz, T
C
= 25°C)
Peak Non-Repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz,
T
C
= 25°C)
Circuit Fusing Consideration (t = 8.3 ms)
Non−Repetitive Surge Peak Off−State
Voltage (T
J
= 25°C, t = 8.3 ms)
Peak Gate Current (T
J
= 110°C, t
≤
20
ms)
Peak Gate Power
(Pulse Width
≤
20
ms,
T
C
= 80°C)
Average Gate Power (T
J
= 110°C)
Operating Junction Temperature Range
Storage Temperature Range
RMS Isolation Voltage
(t = 300 ms, R.H.
≤
30%, T
A
= 25°C)
BTA16−xSWG
AYWW
3
TO−220AB
CASE 221A
STYLE 12
x
A
Y
WW
G
= 6 or 8
= Assembly Location
= Year
= Work Week
= Pb−Free Package
I
2
t
V
DSM/
V
RSM
I
GM
P
GM
P
G(AV)
T
J
T
stg
V
iso
120
V
DSM/
V
RSM
+100
4.0
20
1.0
−40
to +110
−40
to +150
2500
A
2
sec
V
A
W
W
°C
°C
V
1
2
3
4
PIN ASSIGNMENT
Main Terminal 1
Main Terminal 2
Gate
No Connection
ORDERING INFORMATION
Device
BTA16−600SW3G
BTA16−800SW3G
Package
TO−220AB
(Pb−Free)
TO−220AB
(Pb−Free)
Shipping
50 Units / Rail
50 Units / Rail
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
*For additional information on our Pb−Free strategy and
soldering details, please download the ON Semicon-
ductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2009
September, 2009
−
Rev. 1
1
Publication Order Number:
BTA16−600SW3/D
BTA16−600SW3G, BTA16−800SW3G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Case (AC)
Junction−to−Ambient
Symbol
R
qJC
R
qJA
T
L
Value
2.13
60
260
Unit
°C/W
°C
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 seconds
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
(V
D
= Rated V
DRM
, V
RRM
; Gate Open)
ON CHARACTERISTICS
Peak On-State Voltage (Note 2)
(I
TM
=
±
22.5 A Peak)
Gate Trigger Current (Continuous dc) (V
D
= 12 V, R
L
= 30
W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
Holding Current
(V
D
= 12 V, Gate Open, Initiating Current =
±500
mA)
Latching Current (V
D
= 12 V, I
G
= 12 mA)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
Gate Trigger Voltage (V
D
= 12 V, R
L
= 30
W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
Gate Non−Trigger Voltage (T
J
= 110°C)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current, See Figure 10.
(Gate Open, T
J
= 110°C, No Snubber)
Critical Rate of Rise of On−State Current
(T
J
= 110°C, f = 120 Hz, I
G
= 20 mA, tr
≤
100 ns)
Critical Rate of Rise of Off-State Voltage
(V
D
= 0.66 x V
DRM
, Exponential Waveform, Gate Open, T
J
= 110°C)
2. Indicates Pulse Test: Pulse Width
≤
2.0 ms, Duty Cycle
≤
2%.
(dI/dt)
c
dI/dt
dV/dt
2.0
−
250
−
−
−
−
50
−
A/ms
A/ms
V/ms
V
TM
I
GT
−
−
1.55
V
mA
2.0
2.0
2.0
−
−
−
−
−
10
10
10
20
mA
mA
−
−
−
0.5
0.5
0.5
0.2
0.2
0.2
−
−
−
−
−
−
−
−
−
25
30
25
V
1.3
1.3
1.3
V
−
−
−
T
J
= 25°C
T
J
= 110°C
I
DRM
/
I
RRM
mA
−
−
−
−
0.005
2.0
Symbol
Min
Typ
Max
Unit
I
H
I
L
V
GT
V
GD
http://onsemi.com
2
BTA16−600SW3G, BTA16−800SW3G
Voltage Current Characteristic of Triacs
(Bidirectional Device)
+ Current
Quadrant 1
MainTerminal 2 +
Symbol
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
Parameter
Peak Repetitive Forward Off State Voltage
Peak Forward Blocking Current
Peak Repetitive Reverse Off State Voltage
Peak Reverse Blocking Current
Maximum On State Voltage
Holding Current
Quadrant 3
MainTerminal 2
−
I
H
V
TM
I
RRM
at V
RRM
on state
I
H
V
TM
off state
+ Voltage
I
DRM
at V
DRM
Quadrant Definitions for a Triac
MT2 POSITIVE
(Positive Half Cycle)
+
(+) MT2
(+) MT2
Quadrant II
(−) I
GT
GATE
MT1
REF
(+) I
GT
GATE
MT1
REF
Quadrant I
I
GT
−
(−) MT2
(−) MT2
+ I
GT
Quadrant III
(−) I
GT
GATE
MT1
REF
(+) I
GT
GATE
MT1
REF
−
MT2 NEGATIVE
(Negative Half Cycle)
Quadrant IV
All polarities are referenced to MT1.
With in−phase signals (using standard AC lines) quadrants I and III are used.
http://onsemi.com
3
BTA16−600SW3G, BTA16−800SW3G
110
105
PAV, AVERAGE POWER (WATTS)
TC, CASE TEMPERATURE (
°
C)
100
95
90
85
80
75
70
65
60
55
0
2
6
8
10
12
I
T(RMS)
, RMS ON‐STATE CURRENT (AMP)
4
14
16
120°
180°
DC
30°
60°
90°
24
22
20
18
16
14
12
10
8
6
4
2
0
30°
0
2
4
6
8
10
12
14
I
T(AV)
, AVERAGE ON‐STATE CURRENT (AMP)
16
60°
90°
180°
120°
DC
Figure 1. Typical RMS Current Derating
Figure 2. On-State Power Dissipation
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1000
1
0.1
100
I T, INSTANTANEOUS ON‐STATE CURRENT (AMP)
0.01
0.1
1
10
100
t, TIME (ms)
1000
1 · 10
4
Figure 4. Thermal Response
10
25
20
15
MT2 POSITIVE
10
MT2 NEGATIVE
5
0
−40 −25 −10
1
T
J
= 110°C
T
J
= 25°C
T
J
= -40°C
0.1
0
0.5
1
1.5
2
2.5
3
3.5
V
T
, INSTANTANEOUS ON-STATE VOLTAGE (V)
4
I
H
, HOLD CURRENT (mA)
5
20
35
50
65
80
95 110
T
J
, JUNCTION TEMPERATURE (°C)
Figure 3. On-State Characteristics
Figure 5. Typical Hold Current Variation
http://onsemi.com
4
BTA16−600SW3G, BTA16−800SW3G
20
I
GT
, GATE TRIGGER CURRENT (mA)
Q3
V
GT
, GATE TRIGGER VOLTAGE (V)
18
16
14
12
10
8
6
4
2
0
−40 −25 −10
5
20
35
50
65
80
95
110
Q2
Q1
V
D
= 12 V
R
L
= 30
W
2.0
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
−40 −25 −10
5
20
35
50
65
80
95
110
Q2
Q3
Q1
V
D
= 12 V
R
L
= 30
W
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 6. Typical Gate Trigger Current Variation
Figure 7. Typical Gate Trigger Voltage Variation
40
I
L
, LATCHING CURRENT (mA)
35
30
25
20
15
10
5
0
−40 −25 −10
5
20
35
50
65
80
95
110
Q3
Q1
Q2
V
D
= 12 V
R
L
= 30
W
T
J
, JUNCTION TEMPERATURE (°C)
Figure 8. Typical Latching Current Variation
L
L
200 V
RMS
ADJUST FOR
I
TM
, 60 Hz V
AC
TRIGGER
CHARGE
CONTROL
TRIGGER CONTROL
MEASURE
I
1N4007
-
+
MT2
1N914 51
W
G
MT1
CHARGE
200 V
NON‐POLAR
C
L
Note: Component values are for verification of rated (di/dt)
c
. See AN1048 for additional information.
Figure 9. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)
c
http://onsemi.com
5
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
