SMD2190-25000
Datasheet revision 1.3
www.chipquik.com
Sn63/Pb37 Solder Spheres for BGAs
Product Highlights
Chip Quik® BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or
repairing BGA packages. Chip Quik® BGA solder spheres also exceed both the IPC and MIL standards for purity levels and
size tolerances. Nominal sizes are available from 8 to 30 mil.
Product Specifications
Part Number
SMD2140
SMD2140‐25000
SMD2150
SMD2150‐25000
SMD2165
SMD2165‐25000
SMD2170
SMD2170‐25000
SMD2180
SMD2180‐25000
SMD2185
SMD2185‐25000
SMD2190
SMD2190‐25000
SMD2195
SMD2195‐25000
SMD2200
SMD2200‐25000
SMD2205
SMD2205‐25000
SMD2215
SMD2215‐25000
Alloy
Melting Point
Diameter
0.008" (0.2mm)
0.010" (0.25mm)
0.012" (0.3mm)
0.014" (0.35mm)
0.016" (0.4mm)
Sn63/Pb37
183°C (361°F)
0.018" (0.45mm)
0.020" (0.5mm)
0.022" (0.55mm)
0.024" (0.6mm)
0.025" (0.63mm)
0.030" (0.76mm)
Quantity (by weight)
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
Shelf Life:
Test Results
Test J-STD-004 or other
requirements as stated
Conflict Minerals Compliance
REACH Compliance
>24 months
Test Requirement
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
Compliant
Contains Lead (Pb) CAS# 7439-92-1
No other SVHC present
Conforms to the following Industry Standards:
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
No
1
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