128GB (x72, ECC, 3DS 4H Stack, 2 Package Ranks x 4 Logic
Ranks) 288-Pin DDR4 RDIMM
Features
DDR4 3DS SDRAM RDIMM
MTA144ASQ16G72PSZ – 128GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC4-3200, PC4-2933, or
PC4-2666
• 128GB (16 Gig x 72)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• On-die V
REFDQ
generation and calibration
• Two package ranks x four logic ranks
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 32Gb, 3DS 4-high die stack x4 package, Master/Slave
control logic. Each die with16 internal banks; 4
groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
Speed
Grade
-3S2
-2S9
-2S6
-2S3
PC4-
3200
2933
2666
2400
28 –
26
3200
–
–
–
t
RCD
t
RP
t
RC
Figure 1: 288-Pin RDIMM (MO-309, R/C-B2)
Module height: 31.25mm (1.23in)
Options
• Operating temperature
– Commercial (0°C
≤
T
OPER
≤
95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 26 (DDR4-3200)
– 0.682ns @ CL = 24 (DDR4-2933)
– 0.75ns @ CL = 22 (DDR4-2666)
Marking
None
Z
-3S2
-2S9
-2S6
25
–
2933
–
–
24
–
2933
–
–
24
2666
2666
2666
–
22
2666
2666
2666
–
22
2400
2400
2400
–
20
2400
2400
2400
2400
20
18
16
14
1600
1600
1600
1600
(ns)
13.75
14.32
14.25
15
(ns)
13.75
14.32
14.25
15
(ns)
45.75
46.32
46.25
47
2133 2133 1866
2133 2133 1866
2133 2133 1866
–
2133 1866
PDF: CCMTD-341111752-10424
asq144c16gx72psz .pdf - Rev. C 12/17 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
128GB (x72, ECC, 3DS 4H Stack, 2 Package Ranks x 4 Logic
Ranks) 288-Pin DDR4 RDIMM
Features
Table 2: Addressing
Parameter
Row address
Column address
Device bank group address
Device bank address per group
Device configuration
Logic rank address
Package rank address
128GB
128K A[16:0]
1K A[9:0]
4 BG[1:0]
4 BA[1:0]
32Gb (128 Meg x 4 x 16 banks x4 ranks)
2 C[1:0]
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 128GB Modules
Base device: MT40A8G4,
1
32Gb DDR4 4H 3DS M/S DRAM
Module
2
Part Number
Density
Configuration
MTA144ASQ16G72PSZ-3S2__
MTA144ASQ16G72PSZ-2S9__
MTA144ASQ16G72PSZ-2S6__
Notes:
128GB
128GB
128GB
16 Gig x 72
16 Gig x 72
16 Gig x 72
Module
Bandwidth
25.6 GB/s
23.47 GB/s
21.3 GB/s
Memory Clock/
Data Rate
0.62ns/3200 MT/s
0.682ns/2933 MT/s
0.75ns/2666 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
26-22-22
24-21-21
22-19-19
1. The data sheet for the base device can be found at micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA144ASQ16G72PSZ-3S2E1.
PDF: CCMTD-341111752-10424
asq144c16gx72psz .pdf - Rev. C 12/17 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
128GB (x72, ECC, 3DS 4H Stack, 2 Package Ranks x 4 Logic
Ranks) 288-Pin DDR4 RDIMM
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
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cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
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authorized representative.
PDF: CCMTD-341111752-10424
asq144c16gx72psz .pdf - Rev. C 12/17 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
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