solid state relay that uses optically coupled MOSFET
technology to provide 3750V
rms
of input to output
isolation. Its optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
The PLA132 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching in
a more compact surface mount or thru-hole package.
PLA132
Features
•
Low Input Control Current: 2mA
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
PLA132
PLA132S
PLA132STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Applications
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
•
Automotive
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
DS-PLA132-R04
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PLA132
Ratings
60
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
DC Configuration, Continuous
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
t≤10ms
I
L
=600mA
I
L
=1A
V
L
=60V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.2
0.9
-
-
-
-
-
0.85
-
-
-
-
25
-
-
1.2
-
3
600
1.2
±2
1
0.3
1
5
2
-
2
-
1.4
10
-
mA
rms
/ mA
DC
A
DC
A
P
A
ms
ms
pF
mA
mA
V
A
pF
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
= 5mA, V
L
= 10V
V
L
=50V, f=1MHz
I
L
= 600mA
-
I
F
= 5mA
V
R
= 5V
-
2
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
35
30
Device Count (N)
PLA132
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA
DC
)
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA
DC
)
25
20
15
10
5
0
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
Device Count (N)
0.75
0.80
0.85
0.90
0.95
1.00
1.05
0.29
0.31
Turn-On Time (ms)
0.33 0.35 0.37 0.39
Turn-Off Time (ms)
0.41
Typical I
F
for Switch Operation
(N=50, I
L
=600mA
DC
)
25
20
15
10
5
0
0.39
0.41
0.43
0.45
0.47
0.49
0.51
LED Current (mA)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=600mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
0.39
0.41
0.43
0.45
0.47
0.49
0.51
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=600mA)
Device Count (N)
Device Count (N)
0.83
0.84
0.85
0.86
0.87
0.88
0.89
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
69.0
69.5 70.0 70.5 71.0 71.5
Blocking Voltage (V
P
)
72.0
Typical LED Forward Voltage
vs. Temperature
LED Forward Voltage Drop (V)
1.6
Turn-On Time (ms)
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
I
F
=20mA
I
F
=10mA
I
F
=5mA
I
F
=2mA
I
F
=1mA
I
F
=50mA
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=80mA)
0.7
0.6
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=80mA)
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(I
L
=80mA)
I
F
=5mA
PLA132
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
I
F
=10mA
0
20
40
60
80
100
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-40
Typical Turn-Off Time
vs. Temperature
(I
L
=80mA)
1.2
1.1
On-Resistance ( )
1.0
0.9
0.8
0.7
0.6
100
-40
-20
Typical On-Resistance
vs. Temperature
(I
F
=2mA, I
L
=600mA
DC
)
Turn-On Time (ms)
Turn-Off Time (ms)
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
80
Temperature (ºC)
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
1.2
1.0
LED Current (mA)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=300mA)
1.2
1.0
LED Current (mA)
0.8
0.6
0.4
0.2
0
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=300mA)
Load Current (mA)
600
400
200
0
-200
-400
Typical Load Current
vs. Load Voltage
(I
F
=2mA)
0.8
0.6
0.4
0.2
0
-40
-20
0
60
20
40
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-600
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
Load Voltage (V)
1.3
1.2
Load Current (A)
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
-40
-20
Maximum Load Current
vs. Temperature
(I
F
=2mA)
Blocking Voltage (V
P
)
DC
Typical Blocking Voltage
vs. Temperature
72
70
Leakage ( A)
68
66
64
62
60
58
-40
-20
0
20
40
60
80
100
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(V
L
=60V)
AC/DC
0
20
40
60
80
Temperature (ºC)
100
120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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Manufacturing Information
Moisture Sensitivity
PLA132
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA132 / PLA132S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA132 / PLA132S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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