ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16
ACT系列, 四 2 线 TO 1 线 多路复用器, 反向输出, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| 系列 | ACT |
| JESD-30 代码 | R-PDIP-T16 |
| 长度 | 19.305 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I(ol) | 0.024 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 8.5 ns |
| 传播延迟(tpd) | 11 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |

| 74ACT158PC | 74ACT158_05 | 74ACT158SJ | 74ACT158SC | 74ACT158MTC | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16 |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 表面贴装 | NO | Yes | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | Fairchild | - | Fairchild | Fairchild | Fairchild |
| 零件包装代码 | DIP | - | SOIC | SOIC | TSSOP |
| 包装说明 | DIP, DIP16,.3 | - | SOP, SOP16,.3 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 |
| 针数 | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | compli | - | compli | unknow | unknow |
| JESD-30 代码 | R-PDIP-T16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 19.305 mm | - | 10.2 mm | 9.902 mm | 5 mm |
| 负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I(ol) | 0.024 A | - | 0.024 A | 0.024 A | 0.024 A |
| 输入次数 | 2 | - | 2 | 2 | 2 |
| 输出次数 | 1 | - | 1 | 1 | 1 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SOP | SOP | TSSOP |
| 封装等效代码 | DIP16,.3 | - | SOP16,.3 | SOP16,.25 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | 260 | 260 | 260 |
| 电源 | 5 V | - | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 8.5 ns | - | 8.5 ns | 8.5 ns | 8.5 ns |
| 传播延迟(tpd) | 11 ns | - | 11 ns | 11 ns | 11 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 2.1 mm | 1.753 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | - | 5.3 mm | 3.9 mm | 4.4 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 |
| JESD-609代码 | - | - | e3 | e3 | e3 |
| 湿度敏感等级 | - | - | 1 | 1 | 1 |
| 端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
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