IC REG BUCK ADJ 0.3A SYNC 10DFN
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | DFN |
包装说明 | HVSON, SOLCC10,.12,20 |
针数 | 10 |
制造商包装代码 | DD |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 15 V |
最小输入电压 | 2.5 V |
标称输入电压 | 10 V |
JESD-30 代码 | S-PDSO-N10 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 10 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
最大输出电流 | 0.75 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装等效代码 | SOLCC10,.12,20 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
表面贴装 | YES |
切换器配置 | BUCK |
最大切换频率 | 1550 kHz |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
LTC3103IDD#PBF | LTC3103IMSE#PBF | LTC3103EDD#TRPBF | LTC3103IDD#TRPBF | LTC3103IMSE#TRPBF | LTC3103EMSE#TRPBF | LTC3103EMSE#PBF | |
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描述 | IC REG BUCK ADJ 0.3A SYNC 10DFN | IC REG BUCK ADJ 0.3A SYNC 10MSOP | IC REG BUCK ADJ 0.3A SYNC 10DFN | IC REG BUCK ADJ 0.3A SYNC 10DFN | IC REG BUCK ADJ 0.3A SYNC 10MSOP | IC REG BUCK ADJ 0.3A SYNC 10MSOP | 可输出电流:300mA 开关工作频率:1.2MHz 输出类型:Adjustable 输出电压的路数:1 功能类型:Step-Down 输出配置:Positive 1.8μA 静态电流、15V、300mA 同步降压型 DC/DC 转换器 |
Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | DFN | MSOP | DFN | DFN | MSOP | MSOP | MSOP |
包装说明 | HVSON, SOLCC10,.12,20 | HTSSOP, TSSOP10,.19,20 | HVSON, SOLCC10,.12,20 | HVSON, SOLCC10,.12,20 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 |
针数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
制造商包装代码 | DD | MSE | DD | DD | MSE | MSE | MSE |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V | OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 13.8V |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR |
控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
最小输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称输入电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
JESD-30 代码 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | - | - |
最大输出电流 | 0.75 A | 0.75 A | 0.75 A | 0.75 A | 0.75 A | 0.75 A | 0.75 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | HTSSOP | HVSON | HVSON | HTSSOP | HTSSOP | HTSSOP |
封装等效代码 | SOLCC10,.12,20 | TSSOP10,.19,20 | SOLCC10,.12,20 | SOLCC10,.12,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm | 1.1 mm |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
切换器配置 | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK |
最大切换频率 | 1550 kHz | 1550 kHz | 1450 kHz | 1550 kHz | 1550 kHz | 1450 kHz | 1450 kHz |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | OTHER | AUTOMOTIVE | AUTOMOTIVE | OTHER | OTHER |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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