Dual Low Capacitance TVS Array for
Telecom Linecard Applications
PROTECTION PRODUCTS
Description
The LC04-6 has been specifically designed to protect
sensitive components which are connected to high-
speed telecommunications lines from over voltages
caused by
lightning,
electrostatic discharge
(ESD),
cable discharge events
(CDE),
and electrical fast
transients
(EFT).
The device is in a JEDEC SO-16 NB package. It is
designed to provide metallic surge protection for two
tip and ring line pairs. The low capacitance topology
means signal integrity is preserved on high-speed lines.
The high surge capability (1000W, t
p
=10/1000µs)
makes the LC04-6 suitable for telecommunications
systems operating in harsh transient environments.
The LC04-6 is designed to meet the lightning surge
requirements of Bellcore GR-1089 (Intra-building) , FCC
Part 68, ITU K.20, and IEC 61000-4-5. The features of
the LC04-6 are ideal for protecting T1/E1 transceivers
in WAN applications.
LC04-6
Features
Transient protection for high-speed data lines to
Bellcore GR-1089 I
PP
=70A (10/1000µs)
Bellcore GR 1089 I
PP
=100A (2/10µs)
ITU K.20 I
PP
=100A (5/310µs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 100A (8/20µs)
Protects two tip and ring line pairs
Low capacitance for high-speed interfaces
High surge capability
Low clamping voltage
Solid-state silicon avalanche technology
Mechanical Characteristics
JEDEC SO-16 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Applications
T1/E1 Line Cards
Base Stations
WAN Equipment
CSU/DSU
Multiplexers
Routers
ISP Equipment
Customer Premise Equipment
Circuit Diagram
Pin 1 - 4
Schematic & PIN Configuration
TIP
RING
Pin 13 - 16
SO-16 (Top View)
Revision 04/12/05
1
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LC04-6
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Two
High-Speed Line Pairs
The LC04-6 is designed to protect four high-speed data
lines (two differential pairs) from transient over-volt-
ages which result from lightning and ESD. Protection
of two line pairs is achieved by connecting the device
as follows: Pins 1-4 are connected to line 1 of the first
pair (i.e. Tip 1) and pins 13-16 are connected to line 2
of the first pair (i.e. Ring 1). Pins 5-8 are connected to
line 1 of the second pair (i.e. Tip 2) and pins 9-12 are
connected to line two of the second pair (i.e. Ring 2).
All pins should be connected for best results. Minimize
parasitic inductance in the protection circuit path by
keeping the trace length between the protected line
and the LC04-6 as short as possible.
T1/E1 Linecard Protection
A typical T1/E1 linecard protection circuit is shown in
Figure 2. The LC04-6 is connected between Tip and
Ring on the transmit and receive line pairs. It provides
protection to metallic (line-to-line) lightning and ESD
surges. It is designed to meet the intra-building re-
quirements of Bellcore GR-1089. This design takes
advantage of the isolation of the transformer to
suppress common mode surges. The LC04-6 may also
be configured to meet metallic surges of FCC Part68
when used in conjunction with a 5Ω (minimum) PTC or
line feed resistor (LFR). The PTC (or LFR + fuse) are
required to meet the AC power cross requirements, but
will also reduce the effective surge current to levels
within the capability of the LC04-6 (Table 1). To com-
plete the protection circuit, the SRDA05-4 (or
SRDA3.3-4 for 3.3V supplies) is employed as the IC
side protection element. This device helps prevent the
transceiver from latching up by providing fine clamping
of transients that are coupled through the transformer.
The versatility of the LC04-6 makes it ideal for use with
combination long haul/short haul T1/E1 transceivers.
Figure 1 - Connection for Differential (Line-to-Line)
Protection of two Tip/Ring Line Pairs
TIP 1
RING 1
TIP 2
RING 2
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
2005 Semtech Corp.
4
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