IC ACCELERATOR I2C HOTSWAP 8MSOP
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | MSOP |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| 制造商包装代码 | MS8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 内置保护 | UNDER VOLTAGE |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出电流流向 | SINK |
| 标称输出峰值电流 | 0.05 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大压摆率 | 11 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| LTC4307CMS8-1#PBF | LTC4307CDD-1#PBF | LTC4307IMS8-1#PBF | LTC4307CDD-1#TRPBF | LTC4307CMS8-1#TRPBF | LTC4307IDD-1#PBF | LTC4307IDD-1#TRPBF | LTC4307IMS8-1#TRPBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC ACCELERATOR I2C HOTSWAP 8MSOP | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | MSOP | DFN | MSOP | DFN | MSOP | DFN | DFN | MSOP |
| 包装说明 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | MS8 | DD | MS8 | DD | MS8 | DD | DD | MS8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 内置保护 | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 输出电流流向 | SINK | SINK | SINK | SINK | SINK | SINK | SINK | SINK |
| 标称输出峰值电流 | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVSON | TSSOP | HVSON | TSSOP | HVSON | HVSON | TSSOP |
| 封装等效代码 | TSSOP8,.19 | SOLCC8,.11,20 | TSSOP8,.19 | SOLCC8,.11,20 | TSSOP8,.19 | SOLCC8,.11,20 | SOLCC8,.11,20 | TSSOP8,.19 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm |
| 最大压摆率 | 11 mA | 11 mA | 11 mA | 11 mA | 11 mA | 11 mA | 11 mA | 11 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
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