NCP4306
Secondary Side
Synchronous Rectification
Driver for High Efficiency
SMPS Topologies
The NCP4306 is high performance driver tailored to control a
synchronous rectification MOSFET in switch mode power supplies.
Thanks to its high performance drivers and versatility, it can be used in
various topologies such as DCM or CCM flyback, quasi resonant
flyback, forward and half bridge resonant LLC.
The combination of externally or fixed adjustable minimum
off-time and on-time blanking periods helps to fight the ringing
induced by the PCB layout and other parasitic elements. A reliable and
noise less operation of the SR system is insured due to the Self
Synchronization feature. The NCP4306 also utilizes Kelvin
connection of the driver to the MOSFET to achieve high efficiency
operation at full load and utilizes a light load detection architecture to
achieve high efficiency at light load.
The precise turn−off threshold, extremely low turn−off delay time
and high sink current capability of the driver allow the maximum
synchronous rectification MOSFET conduction time and enables
maximum SMPS efficiency. The high accuracy driver and 5 V gate
clamp enables the use of GaN MOSFETs.
Features
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8
1
SOIC−8 NB
CASE 751−07
1
TSOP−6
CASE 318G−02
8
1
DFN8, 4x4
CASE 488AF
1
DFN8, 2.0x2.2, 0.5P
CASE 506BP
MARKING DIAGRAMS
8
XXXXXXXX
ALYWX
G
1
SOIC−8 NB
XXXXXX
XXXXXX
ALYWG
G
DFN8, 4x4
1
TSOP−6
1
XXXAYWG
G
•
Self−Contained Control of Synchronous Rectifier in CCM, DCM and
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
QR for Flyback or LLC Applications
Precise True Secondary Zero Current Detection
Typically 15 ns Turn off Delay from Current Sense Input to Driver
Rugged Current Sense Pin (up to 200 V)
Ultrafast Turn−off Trigger Interface / Disable Input (10.5 ns)
Adjustable or Fixed Minimum ON−Time
Adjustable or Fixed Minimum OFF-Time with Ringing Detection
Improved Robust Self Synchronization Capability
7 A / 2 A Peak Current Sink / Source Drive Capability
Operating Voltage Range up to V
CC
= 35 V
Automatic Light−load Disable Mode
GaN Transistor Driving Capability
Low Startup and Disable Current Consumption
Maximum Operation Frequency up to 1 MHz
TSOP6, SOIC8, DFN8 4x4 and DFN8 2x2.2 Packages
This is a Pb−Free Device
XXMG
G
DFN8, 2.0x2.2, 0.5P
See detailed marking information on page 2 of this
data sheet.
XXXXX
A
L
Y
W
M
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
Typical Applications
Notebook Adapters
High Power Density AC / DC Power Supplies (Cell Phone Chargers)
LCD TVs
All SMPS with High Efficiency Requirements
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2017
October, 2018
−
Rev. 4
1
Publication Order Number:
NCP4306/D
NCP4306
ORDERING INFORMATION TABLE
Table 1. AVAILABLE DEVICES
Device
NCP4306AAAZZZADR2G
NCP4306AADZZZADR2G
NCP4306AAHZZZADR2G
NCP4306DADZZDASNT1G
NCP4306DAHZZAASNT1G
NCP4306AAAZZZAMNTWG
NCP4306AADZZZAMNTWG
NCP4306AAAZZZAMN1TBG
NCP4306AADZZZAMN1TBG
Package Marking
6AAAZZZA
6AADZZZA
6AAHZZZA
6AC
6AD
4306AAAZZZA
4306AADZZZA
6A
6D
DFN−8 2x2.2 (Pb−Free)
TSOP−6
(Pb−Free)
DFN−8 4x4 (Pb−Free)
3000 / Tape and Reel
4000 / Tape and Reel
4000 / Tape and Reel
3000 / Tape and Reel
3000 / Tape and Reel
Package
SOIC−8
(Pb−Free)
Shipping
†
2500 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
R1
VCC
MIN_TOFF
C3
DRV
GND
CS
TRIG
R
MIN_TOFF
R
MIN_TON
MIN_TON
LLD
R
LLD
+V
BULK
Tr1
M1
LLC
STAGE
CONTROL
M2
N1
N2
NCP4306
+V
OUT
M3
C2
RTN
N3
C1
OK1
D1
M4
R2
DRV
VCC
MIN_TOFF GND
CS
MIN_TON
C4
R
MIN_TOFF
R
MIN_TON
LLD
TRIG
Figure 1. Typical Application Example – LLC Converter with optional LLD and Trigger Utilization
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2
R
LLD
NCP4306
NCP4306
V
BULK
C1
R3
VCC
ZCD
PRIMARY
SIDE
FLYBACK
CONTROLLER
DRV
COMP CS
R4
C5
C6
R2
D4
C3
M2
C7
M1
DRV
VCC
GND MIN_TOFF
+V
OUT
R1
C2
D3
R5
C8
TR1
C4
R3
GND
NCP4306
Figure 4. Typical Application Example – Primary Side Flyback Converter and NCP4306 in TSOP6
PIN FUNCTION DESCRIPTION
Table 2. PIN FUNCTION DESCRIPTION
TSOP6
Bxxxxxx
6
−
TSOP6
Cxxxxxx
6
5
TSOP6
Dxxxxxx
6
5
TSOP6
Exxxxxx
6
5
TSOP6
Fxxxxxx
6
−
TSOP6
Gxxxxxx
6
SOIC8,
DFN8
Axxxxxx
1
2
Pin Name
Description
VCC
MIN_TOFF
Supply voltage pin
Adjust the minimum off time
period by connecting resistor to
ground
Adjust the minimum on time
period by connecting resistor to
ground
This input modulates the driver
clamp level and / or turns the driv-
er off during light load conditions
Ultrafast turn−off input that can be
used to turn off the SR MOSFET
in CCM applications in order to
improve efficiency. Activates
disable mode if pulled−up for
more than 100
μs
Current sense pin detects if the
current flows through the SR
MOSFET and / or its body diode
Ground connection for the SR
MOSFET driver and V
CC
decoupling capacitor. Ground
connection for minimum t
ON
and
t
OFF
adjust resistors, LLD and
trigger inputs.
GND pin should be wired directly
to the SR MOSFET source
terminal / soldering point using
Kelvin connection. DFN8 exposed
flag should be connected to GND.
Driver output for the SR MOSFET
5
−
4
−
5
−
3
MIN_TON
4
4
−
−
−
4
4
LLD
−
−
−
4
4
5
5
TRIG / DIS
3
3
3
3
3
3
6
CS
2
2
2
2
2
2
7
GND
1
1
1
1
1
1
8
DRV
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4
R
MIN_TOFF
R
MIN_TON
CS
MIN_TON
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