Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | HCT |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 8 |
| Number of Inputs per Chip | 8 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 8 |
| Number of Output Enables per Chip | 1 Low/1 High |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 22@4.5V |
| Absolute Propagation Delay Time (ns) | 45 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| 输出类型 Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 6 |
| Maximum High Level Output Current (mA) | -6 |
| Minimum Operating Supply Voltage (V) | 4.5 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Quiescent Current (uA) | 8 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Package | SO |
| Pin Count | 20 |
| Mounting | Surface Mount |
| Package Height | 2.45(Max) |
| Package Length | 13(Max) |
| Package Width | 7.6(Max) |
| PCB changed | 20 |
| 74HCT241D,653 | 74HCT241PW,118 | 74HCT241PW,112 | 74HCT241D,652 | |
|---|---|---|---|---|
| 描述 | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP Bulk | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk |
| 欧盟限制某些有害物质的使用 | Compliant | Compliant | - | Compliant |
| ECCN (US) | EAR99 | EAR99 | - | EAR99 |
| Part Status | Active | Active | - | LTB |
| HTS | 8542.39.00.01 | 8542.39.00.01 | - | 8542.39.00.01 |
| Logic Family | HCT | HCT | - | HCT |
| Logic Function | Buffer/Line Driver | Buffer/Line Driver | - | Buffer/Line Driver |
| Number of Elements per Chip | 2 | 2 | - | 2 |
| Number of Channels per Chip | 8 | 8 | - | 8 |
| Number of Inputs per Chip | 8 | 8 | - | 8 |
| Number of Outputs per Chip | 8 | 8 | - | 8 |
| Number of Output Enables per Chip | 1 Low/1 High | 1 Low/1 High | - | 1 Low/1 High |
| Bus Hold | No | No | - | No |
| Polarity | Non-Inverting | Non-Inverting | - | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 22@4.5V | 22@4.5V | - | 22@4.5V |
| Absolute Propagation Delay Time (ns) | 45 | 45 | - | 45 |
| Process Technology | CMOS | CMOS | - | CMOS |
| Input Signal Type | Single-Ended | Single-Ended | - | Single-Ended |
| 输出类型 Output Type |
3-State | 3-State | - | 3-State |
| Maximum Low Level Output Current (mA) | 6 | 6 | - | 6 |
| Maximum High Level Output Current (mA) | -6 | -6 | - | -6 |
| Minimum Operating Supply Voltage (V) | 4.5 | 4.5 | - | 4.5 |
| Typical Operating Supply Voltage (V) | 5 | 5 | - | 5 |
| Maximum Operating Supply Voltage (V) | 5.5 | 5.5 | - | 5.5 |
| Maximum Quiescent Current (uA) | 8 | 8 | - | 8 |
| Propagation Delay Test Condition (pF) | 50 | 50 | - | 50 |
| Minimum Operating Temperature (°C) | -40 | -40 | - | -40 |
| Maximum Operating Temperature (°C) | 125 | 125 | - | 125 |
| Supplier Package | SO | TSSOP | - | SO |
| Pin Count | 20 | 20 | - | 20 |
| Mounting | Surface Mount | Surface Mount | - | Surface Mount |
| Package Height | 2.45(Max) | 0.95(Max) | - | 2.45(Max) |
| Package Length | 13(Max) | 6.6(Max) | - | 13(Max) |
| Package Width | 7.6(Max) | 4.5(Max) | - | 7.6(Max) |
| PCB changed | 20 | 20 | - | 20 |
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