Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS Automotive 20-Pin SO T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | LVC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 8 |
| Number of Inputs per Chip | 8 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 8 |
| Number of Output Enables per Chip | 2 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.9(Typ)@3.3V|3.5(Typ)@2.7V |
| Absolute Propagation Delay Time (ns) | 18.5 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| 输出类型 Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 24 |
| Maximum High Level Output Current (mA) | -24 |
| Minimum Operating Supply Voltage (V) | 1.2 |
| Typical Operating Supply Voltage (V) | 2.5|1.8|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Tolerant I/Os (V) | 5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| 系列 Packaging | Tape and Reel |
| Supplier Package | SO |
| Pin Count | 20 |
| Mounting | Surface Mount |
| Package Height | 2.45(Max) |
| Package Length | 13(Max) |
| Package Width | 7.6(Max) |
| PCB changed | 20 |
| 74LVC541AD-Q100J | 74LVC541ABQ-Q100X | 74LVC541APW-Q100J | |
|---|---|---|---|
| 描述 | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS Automotive 20-Pin SO T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS Automotive 20-Pin DHVQFN EP T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS Automotive 20-Pin TSSOP T/R |
| 欧盟限制某些有害物质的使用 | Compliant | Compliant | Compliant |
| ECCN (US) | EAR99 | EAR99 | EAR99 |
| Part Status | Active | Active | Active |
| Logic Family | LVC | LVC | LVC |
| Logic Function | Buffer/Line Driver | Buffer/Line Driver | Buffer/Line Driver |
| Number of Elements per Chip | 1 | 1 | 1 |
| Number of Channels per Chip | 8 | 8 | 8 |
| Number of Inputs per Chip | 8 | 8 | 8 |
| Number of Outputs per Chip | 8 | 8 | 8 |
| Number of Output Enables per Chip | 2 Low | 2 Low | 2 Low |
| Bus Hold | No | No | No |
| Polarity | Non-Inverting | Non-Inverting | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.9(Typ)@3.3V|3.5(Typ)@2.7V | 3.5(Typ)@2.7V|2.9(Typ)@3.3V | 2.9(Typ)@3.3V|3.5(Typ)@2.7V |
| Absolute Propagation Delay Time (ns) | 18.5 | 18.5 | 18.5 |
| Process Technology | CMOS | CMOS | CMOS |
| Input Signal Type | Single-Ended | Single-Ended | Single-Ended |
| 输出类型 Output Type |
3-State | 3-State | 3-State |
| Maximum Low Level Output Current (mA) | 24 | 24 | 24 |
| Maximum High Level Output Current (mA) | -24 | -24 | -24 |
| Minimum Operating Supply Voltage (V) | 1.2 | 1.2 | 1.2 |
| Typical Operating Supply Voltage (V) | 2.5|1.8|3.3 | 1.8|2.5|3.3 | 1.8|3.3|2.5 |
| Maximum Operating Supply Voltage (V) | 3.6 | 3.6 | 3.6 |
| Tolerant I/Os (V) | 5 | 5 | 5 |
| Typical Quiescent Current (uA) | 0.1 | 0.1 | 0.1 |
| Maximum Quiescent Current (uA) | 40 | 40 | 40 |
| Propagation Delay Test Condition (pF) | 50 | 50 | 50 |
| Maximum Power Dissipation (mW) | 500 | 500 | 500 |
| Minimum Operating Temperature (°C) | -40 | -40 | -40 |
| Maximum Operating Temperature (°C) | 125 | 125 | 125 |
| 系列 Packaging |
Tape and Reel | Tape and Reel | Tape and Reel |
| Supplier Package | SO | DHVQFN EP | TSSOP |
| Pin Count | 20 | 20 | 20 |
| Mounting | Surface Mount | Surface Mount | Surface Mount |
| Package Height | 2.45(Max) | 0.88 | 0.95(Max) |
| Package Length | 13(Max) | 4.5 | 6.6(Max) |
| Package Width | 7.6(Max) | 2.5 | 4.5(Max) |
| PCB changed | 20 | 20 | 20 |
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