IC FF D-TYPE SNGL 1BIT 8XSON
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | VSON, |
| 针数 | 8 |
| 制造商包装代码 | SOT1089 |
| Reach Compliance Code | compliant |
| Samacsys Description | 74LVC1G74 - Single D-type flip-flop with set and reset; positive edge trigger@en-us |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 1.35 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 传播延迟(tpd) | 13.4 ns |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.35 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 1 mm |
| 最小 fmax | 200 MHz |

| 74LVC1G74GF,115 | 74LVC1G74GT,115 | 74LVC1G74GS,115 | 74LVC1G74GD/C4H | 74LVC1G74GD/S470,1 | 74LVC1G74GM,125 | 935274973125 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC FF D-TYPE SNGL 1BIT 8XSON | IC FF D-TYPE SNGL 1BIT 8XSON | IC FF D-TYPE SNGL 1BIT 8XSON | IC FF D-TYPE SNGL 1BIT 8XSON | IC FF D-TYPE SNGL 1BIT 8XSON | IC FF D-TYPE SNGL 1BIT 8XQFN | D Flip-Flop |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | 正边沿 | 正边沿 | POSITIVE EDGE | POSITIVE EDGE |
| Brand Name | Nexperia | Nexperia | Nexperia | - | - | Nexperia | - |
| 零件包装代码 | SON | SON | SON | - | - | QFN | - |
| 包装说明 | VSON, | VSON, | VSON, | - | - | VQCCN, | VSSOP, |
| 针数 | 8 | 8 | 8 | - | - | 8 | - |
| 制造商包装代码 | SOT1089 | SOT833-1 | SOT1203 | - | - | SOT902-2 | - |
| Reach Compliance Code | compliant | compliant | compliant | - | - | compliant | compliant |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | - | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | - | - | S-PQCC-N8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | - | - | e4 | e4 |
| 长度 | 1.35 mm | 1.95 mm | 1.35 mm | - | - | 1.6 mm | 2.3 mm |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - | D FLIP-FLOP | D FLIP-FLOP |
| 湿度敏感等级 | 1 | 1 | 1 | - | - | 1 | 1 |
| 位数 | 1 | 1 | 1 | - | - | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | - | - | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | - | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | VSON | VSON | - | - | VQCCN | VSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - | - | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 传播延迟(tpd) | 13.4 ns | 13.4 ns | 13.4 ns | - | - | 13.4 ns | 13.4 ns |
| 座面最大高度 | 0.5 mm | 0.5 mm | 0.35 mm | - | - | 0.5 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | - | - | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | - | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | - | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | - | - | NO LEAD | GULL WING |
| 端子节距 | 0.35 mm | 0.5 mm | 0.35 mm | - | - | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | - | QUAD | DUAL |
| 宽度 | 1 mm | 1 mm | 1 mm | - | - | 1.6 mm | 2 mm |
| 最小 fmax | 200 MHz | 200 MHz | 200 MHz | - | - | 200 MHz | 200 MHz |
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