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IS43R86400D-4TL

产品描述DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66
产品类别存储   
文件大小987KB,共34页
制造商Integrated Silicon Solution ( ISSI )
标准  
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IS43R86400D-4TL概述

DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66

IS43R86400D-4TL规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Integrated Silicon Solution ( ISSI )
零件包装代码TSOP2
包装说明TSOP2,
针数66
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
访问模式FOUR BANK PAGE BURST
最长访问时间0.7 ns
其他特性AUTO/SELF REFRESH
JESD-30 代码R-PDSO-G66
JESD-609代码e3
长度22.22 mm
内存密度536870912 bit
内存集成电路类型DDR DRAM
内存宽度8
湿度敏感等级3
功能数量1
端口数量1
端子数量66
字数67108864 words
字数代码64000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64MX8
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.2 mm
自我刷新YES
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度10.16 mm
Base Number Matches1

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IS43/46R86400D
IS43/46R16320D, IS43/46R32160D
16Mx32, 32Mx16, 64Mx8 
512Mb DDR SDRAM
FEATURES
VDD and VDDQ: 2.5V ± 0.2V (-5, -6)
VDD and VDDQ: 2.5V ± 0.1V (-4)
SSTL_2 compatible I/O
Double-data rate architecture; two data transfers
per clock cycle
Bidirectional, data strobe (DQS) is transmitted/
received with data, to be used in capturing data
at the receiver
DQS is edge-aligned with data for READs and
centre-aligned with data for WRITEs
Differential clock inputs (CK and CK)
DLL aligns DQ and DQS transitions with CK
transitions
Commands entered on each positive CK edge;
data and data mask referenced to both edges of
DQS
Four internal banks for concurrent operation
Data Mask for write data. DM masks write data
at both rising and falling edges of data strobe
Burst Length: 2, 4 and 8
Burst Type: Sequential and Interleave mode
Programmable CAS latency: 2, 2.5 and 3
Auto Refresh and Self Refresh Modes
Auto Precharge
PRELIMINARY INFORMATION
SEPTEMBER 2010
DEVICE OVERVIEW
ISSI’s 512-Mbit DDR SDRAM achieves high speed data
transfer using pipeline architecture and two data word
accesses per clock cycle. The 536,870,912-bit memory
array is internally organized as four banks of 128Mb to
allow concurrent operations. The pipeline allows Read
and Write burst accesses to be virtually continuous, with
the option to concatenate or truncate the bursts. The
programmable features of burst length, burst sequence
and CAS latency enable further advantages. The device
is available in 8-bit, 16-bit and 32-bit data word size
Input data is registered on the I/O pins on both edges
of Data Strobe signal(s), while output data is referenced
to both edges of Data Strobe and both edges of CLK.
Commands are registered on the positive edges of CLK.
An Auto Refresh mode is provided, along with a Self
Refresh mode. All I/Os are SSTL_2 compatible.
ADDRESS TABLE
Parameter
Configuration
16M x 32
4M x 32 x 4
banks
32M x 16
8M x 16 x 4
banks
BA0, BA1
A10/AP
64M x 8
16M x 8 x 4
banks
BA0, BA1
A10/AP
Bank Address BA0, BA1
Pins
Autoprecharge A8/AP
Pins
Row Address
Column
Address
8K(A0 – A12)
512(A0 – A7,
A9)
8K(A0 – A12) 8K(A0 – A12)
1K(A0 – A9)
8K / 64ms
8K / 16ms
2K(A0 – A9,
A11)
8K / 64ms
8K / 16ms
OPTIONS
• Configuration(s): 16Mx32, 32Mx16, and 64Mx8
• Package(s): 144 Ball BGA (x32), 66-pin TSOP-II
(x8, x16), and 60 Ball BGA (x8, x16)
• Lead-free package
• Temperature Range:
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Automotive, A1 (-40°C to +85°C)
Automotive, A2 (-40°C to +105°C)
Refresh Count
Com./Ind./A1 8K / 64ms
A2
8K / 16ms
KEY TIMING PARAMETERS
Speed Grade 
-4 
-5 
x8, x16 only   
F
ck
Max CL = 3
250 200
F
ck
Max CL = 2.5
167
F
ck
Max CL = 2
133
-6 
Units 
MHz
MHz
MHz
167
167
133
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can rea-
sonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applica-
tions unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev.  00B
08/13/10
1

IS43R86400D-4TL相似产品对比

IS43R86400D-4TL IS43R86400D-4BL
描述 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 13 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-60
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
零件包装代码 TSOP2 BGA
包装说明 TSOP2, TBGA,
针数 66 60
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST FOUR BANK PAGE BURST
最长访问时间 0.7 ns 0.7 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-PDSO-G66 R-PBGA-B60
JESD-609代码 e3 e1
长度 22.22 mm 13 mm
内存密度 536870912 bit 536870912 bit
内存集成电路类型 DDR DRAM DDR DRAM
内存宽度 8 8
功能数量 1 1
端口数量 1 1
端子数量 66 60
字数 67108864 words 67108864 words
字数代码 64000000 64000000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 64MX8 64MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TBGA
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE
峰值回流温度(摄氏度) 260 260
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm
自我刷新 YES YES
最大供电电压 (Vsup) 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 GULL WING BALL
端子节距 0.65 mm 1 mm
端子位置 DUAL BOTTOM
处于峰值回流温度下的最长时间 40 40
宽度 10.16 mm 8 mm

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