74LVC1G3157GX/SOT1255/X2SON6
参数名称 | 属性值 |
Brand Name | Nexperia |
厂商名称 | Nexperia |
包装说明 | , |
制造商包装代码 | SOT1255 |
Reach Compliance Code | compliant |
Factory Lead Time | 13 weeks |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PXSS-X6 |
长度 | 1 mm |
湿度敏感等级 | 1 |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 6 |
标称断态隔离度 | 42 dB |
最大通态电阻 (Ron) | 195 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SPECIAL SHAPE |
峰值回流温度(摄氏度) | 260 |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | NO |
最长断开时间 | 11.7 ns |
最长接通时间 | 22 ns |
温度等级 | AUTOMOTIVE |
端子形式 | UNSPECIFIED |
端子位置 | UNSPECIFIED |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 0.8 mm |
Base Number Matches | 1 |
74LVC1G3157GXZ | 74LVC1G3157GM,132 | 74LVC1G3157GF,132 | 74LVC1G3157GN,132 | 74LVC1G3157GV,125 | PRA100C7-264RDLN | 74LVC1G3157GM,115 | 935277228132 | |
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描述 | 74LVC1G3157GX/SOT1255/X2SON6 | 74LVC1G3157 - 2-channel analog multiplexer/demultiplexer SON 6-Pin | IC MUX/DEMUX 2X1 6XSON | IC MUX/DEMUX 2X1 6XSON | Array/Network Resistor, Bussed, Thin Film, 0.1W, 264ohm, 50V, 0.5% +/-Tol, -10,10ppm/Cel, 2806, | 逻辑类型:单刀双开 额外特性:- | Single-Ended Multiplexer | |
包装说明 | , | VSON, | VSON, | VQCCN, | TSSOP, | SMT, 2806 | VSON, | , |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | - | Nexperia | - |
制造商包装代码 | SOT1255 | SOT886 | SOT891 | SOT1115 | SOT457 | - | SOT886 | - |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PXSS-X6 | R-PDSO-N6 | S-PDSO-N6 | R-PBCC-N6 | R-PDSO-G6 | - | R-PDSO-N6 | - |
长度 | 1 mm | 1.45 mm | 1 mm | 1 mm | 2.9 mm | - | 1.45 mm | - |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
信道数量 | 2 | 2 | 2 | 2 | 2 | - | 2 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
端子数量 | 6 | 6 | 6 | 6 | 6 | 14 | 6 | - |
标称断态隔离度 | 42 dB | 42 dB | - | 42 dB | 42 dB | - | 42 dB | - |
最大通态电阻 (Ron) | 195 Ω | 38 Ω | 38 Ω | 38 Ω | 38 Ω | - | 38 Ω | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C | - |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
封装形式 | SPECIAL SHAPE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMT | SMALL OUTLINE, VERY THIN PROFILE | - |
峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 | - | 260 | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | - |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V | - |
标称供电电压 (Vsup) | 1.8 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | - |
表面贴装 | NO | YES | YES | YES | YES | - | YES | - |
最长断开时间 | 11.7 ns | 5 ns | - | 5 ns | 5 ns | - | 5 ns | - |
最长接通时间 | 22 ns | 6 ns | - | 6 ns | 6 ns | - | 6 ns | - |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | - |
端子形式 | UNSPECIFIED | NO LEAD | NO LEAD | NO LEAD | GULL WING | - | NO LEAD | - |
端子位置 | UNSPECIFIED | DUAL | DUAL | BOTTOM | DUAL | - | DUAL | - |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 | - | 30 | - |
宽度 | 0.8 mm | 1 mm | 1 mm | 0.9 mm | 1.5 mm | - | 1 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
零件包装代码 | - | SON | SON | SON | TSOP | - | SON | - |
针数 | - | 6 | 6 | 6 | 6 | - | 6 | - |
Samacsys Confidence | - | 2 | 2 | 2 | 2 | - | 2 | - |
Samacsys Status | - | Released | Released | Released | Released | - | Released | - |
Samacsys PartID | - | 1263850 | 978223 | 699958 | 699962 | - | 699959 | - |
Samacsys Pin Count | - | 6 | 6 | 6 | 6 | - | 6 | - |
Samacsys Part Category | - | Integrated Circuit | Integrated Circuit | Integrated Circuit | Integrated Circuit | - | Integrated Circuit | - |
Samacsys Package Category | - | Other | Other | Other | SOT23 (6-Pin) | - | Other | - |
Samacsys Footprint Name | - | SOT886 | SOT891 | XSON6 (SOT1115) | SOT457 (SC-74) | - | SOT886 | - |
Samacsys Released Date | - | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | - | 2018-08-30 10:36:47 | - |
Is Samacsys | - | N | N | N | N | - | N | - |
JESD-609代码 | - | e3 | e3 | e3 | e3 | e2 | e3 | e3 |
封装代码 | - | VSON | VSON | VQCCN | TSSOP | - | VSON | - |
座面最大高度 | - | 0.5 mm | 0.5 mm | 0.35 mm | 1.1 mm | - | 0.5 mm | - |
技术 | - | CMOS | CMOS | - | CMOS | THIN FILM | CMOS | - |
端子面层 | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier | Tin (Sn) | Tin (Sn) |
端子节距 | - | 0.5 mm | 0.35 mm | 0.3 mm | 0.95 mm | - | 0.5 mm | - |
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