IC EEPROM 2K I2C 1MHZ 8SOIC
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 7 weeks |
| 其他特性 | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.925 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| AT24HC02C-SSHM-T | AT24HC02C-XHM-T | AT24HC02C-XHM-B | AT24HC02C-SSHM-B | AT24HC02C-PUM | |
|---|---|---|---|---|---|
| 描述 | IC EEPROM 2K I2C 1MHZ 8SOIC | EEPROM 2K 2-WIRE 8 TSSOP PB HALOFREE NiPdAu 1.7V | EEPROM 2K 2-WIRE 8 TSSOP PB HALOFREE NiPdAu 1.7V | EEPROM 2K 2-WIRE 8 SOIC PB HALOFREE NiPdAu 1.7V | IC EEPROM 2K I2C 1MHZ 8DIP |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 7 weeks | 6 weeks | 7 weeks | 7 weeks | 12 weeks |
| 其他特性 | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY | ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e3 |
| 长度 | 4.925 mm | 4.4 mm | 4.4 mm | 4.925 mm | 9.271 mm |
| 内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | SOP | DIP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | NOT APPLICABLE |
| 电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm | 5.33 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000001 A | 0.000006 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | NOT APPLICABLE |
| 宽度 | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 3 | 1 | 1 | 3 | - |
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