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74FST3383DW: 产品描述10−Bit Low Power Bus Exchange; 产品类别逻辑逻辑; 文件大小212KB，共8页; 制造商ON Semiconductor(安森美); 官网地址http://www.onsemi.cn

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74FST3383DW概述

10−Bit Low Power Bus Exchange

74FST3383DW规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	ON Semiconductor(安森美)
零件包装代码	SOIC
包装说明	SOP, SOP24,.4
针数	24
Reach Compliance Code	not_compliant
Factory Lead Time	1 week
系列	CBT/FST/QS/5C/B
JESD-30 代码	R-PDSO-G24
JESD-609代码	e0
长度	15.395 mm
逻辑集成电路类型	BUS EXCHANGER
湿度敏感等级	1
位数	10
功能数量	1
端口数量	4
端子数量	24
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP24,.4
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
电源	5 V
传播延迟（tpd）	6.5 ns
认证状态	Not Qualified
座面最大高度	2.65 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	7.5 mm
Base Number Matches	1

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74FST3383

10−Bit Low Power

Bus Exchange

The ON Semiconductor 74FST3383 is a 10−bit low power bus

exchange. The device is CMOS TTL compatible when operating

between 4 and 5.5 Volts. The device exhibits extremely low R

and

adds nearly zero propagation delay. The device adds no noise or

ground bounce to the system.

Features

http://onsemi.com

MARKING

DIAGRAMS

SOIC−24

DW SUFFIX

CASE 751E

FST3383

AWLYWW

•

Typical

Less Than 0.25 ns−Max Delay Through Switch

Nearly Zero Standby Current

No Circuit Bounce

Control Inputs are TTL/CMOS Compatible

Pin−For−Pin Compatible With QS3383, FST3383, CBT3383

All Popular Packages: SOIC−24, TSSOP−24, QSOP−24

All Devices in Package TSSOP are Inherently Pb−Free*

GND

FST

3383

ALYW

TSSOP−24

DT SUFFIX

CASE 948H

QSOP−24

QS SUFFIX

CASE 492B

L, WL

Y, YY

W, WW

FST3383

AWLYYWW

Figure 1. 24−Lead Pinout

TRUTH TABLE

−A

HIGH−Z State

−C

−D

−B

HIGH−Z State

−D

−C

Function

Disconnect

Connect

Exchange

Assembly Location

Wafer Lot

Year

Work Week

PIN NAMES

−A

, B

−B

−C

, D

−D

Description

Bus Switch Enable

Bus Exchange

Buses A, B

Buses C, D

NOTE: H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2006

June, 2006

−

Rev. 6

Publication Order Number:

74FST3383/D

74FST3383DW相似产品对比

	74FST3383DW	74FST3383DTR2	74FST3383QSR	74FST3383DWR2	74FST3383_06	74FST3383DT	74FST3383	74FST3383QS
描述	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange	10−Bit Low Power Bus Exchange
是否Rohs认证	不符合	符合	不符合	不符合	-	符合	-	不符合
厂商名称	ON Semiconductor(安森美)	ON Semiconductor(安森美)	ON Semiconductor(安森美)	ON Semiconductor(安森美)	-	ON Semiconductor(安森美)	-	ON Semiconductor(安森美)
零件包装代码	SOIC	TSSOP	SOIC	SOIC	-	TSSOP	-	SOIC
包装说明	SOP, SOP24,.4	TSSOP, TSSOP24,.25	SSOP, SSOP24,.24	SOP, SOP24,.4	-	TSSOP, TSSOP24,.25	-	SSOP, SSOP24,.24
针数	24	24	24	24	-	24	-	24
Reach Compliance Code	not_compliant	unknown	not_compliant	not_compliant	-	unknown	-	not_compliant
Factory Lead Time	1 week	1 week	1 week	1 week	-	1 week	-	1 week
系列	CBT/FST/QS/5C/B	-	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B	-	CBT/FST/QS/5C/B	-	CBT/FST/QS/5C/B
JESD-30 代码	R-PDSO-G24	-	R-PDSO-G24	R-PDSO-G24	-	R-PDSO-G24	-	R-PDSO-G24
JESD-609代码	e0	-	e0	e0	-	e4	-	e0
长度	15.395 mm	-	8.65 mm	15.395 mm	-	7.8 mm	-	8.65 mm
逻辑集成电路类型	BUS EXCHANGER	-	BUS EXCHANGER	BUS EXCHANGER	-	BUS EXCHANGER	-	BUS EXCHANGER
湿度敏感等级	1	-	1	1	-	1	-	1
位数	10	-	10	10	-	10	-	10
功能数量	1	-	1	1	-	1	-	1
端口数量	4	-	4	4	-	4	-	4
端子数量	24	-	24	24	-	24	-	24
最高工作温度	85 °C	-	85 °C	85 °C	-	85 °C	-	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-	-40 °C
输出特性	3-STATE	-	3-STATE	3-STATE	-	3-STATE	-	3-STATE
输出极性	TRUE	-	TRUE	TRUE	-	TRUE	-	TRUE
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	SOP	-	SSOP	SOP	-	TSSOP	-	SSOP
封装等效代码	SOP24,.4	-	SSOP24,.24	SOP24,.4	-	TSSOP24,.25	-	SSOP24,.24
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR
封装形式	SMALL OUTLINE	-	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, SHRINK PITCH
电源	5 V	-	5 V	5 V	-	5 V	-	5 V
传播延迟（tpd）	6.5 ns	-	6.5 ns	6.5 ns	-	6.5 ns	-	6.5 ns
认证状态	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified
座面最大高度	2.65 mm	-	1.73 mm	2.65 mm	-	1.2 mm	-	1.73 mm
最大供电电压 (Vsup)	5.5 V	-	5.5 V	5.5 V	-	5.5 V	-	5.5 V
最小供电电压 (Vsup)	4 V	-	4 V	4 V	-	4 V	-	4 V
标称供电电压 (Vsup)	5 V	-	5 V	5 V	-	5 V	-	5 V
表面贴装	YES	-	YES	YES	-	YES	-	YES
技术	CMOS	-	CMOS	CMOS	-	CMOS	-	CMOS
温度等级	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Tin/Lead (Sn/Pb)
端子形式	GULL WING	-	GULL WING	GULL WING	-	GULL WING	-	GULL WING
端子节距	1.27 mm	-	0.635 mm	1.27 mm	-	0.65 mm	-	0.635 mm
端子位置	DUAL	-	DUAL	DUAL	-	DUAL	-	DUAL
宽度	7.5 mm	-	3.9 mm	7.5 mm	-	4.4 mm	-	3.9 mm
Base Number Matches	1	1	1	1	-	1	-	1

74FST3383DW

74FST3383DW概述

74FST3383DW规格参数

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74FST3383DW相似产品对比

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