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74HCT240N,652

产品描述IC BUFFER INVERT 5.5V 20DIP
产品类别逻辑    逻辑   
文件大小113KB,共18页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74HCT240N,652概述

IC BUFFER INVERT 5.5V 20DIP

74HCT240N,652规格参数

参数名称属性值
Brand NameNXP Semiconductor
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码DIP
包装说明DIP, DIP20,.3
针数20
制造商包装代码SOT146-1
Reach Compliance Codecompliant
控制类型ENABLE LOW
系列HCT
JESD-30 代码R-PDIP-T20
JESD-609代码e4
长度26.73 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.006 A
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP20,.3
封装形状RECTANGULAR
封装形式IN-LINE
包装方法BULK PACK
峰值回流温度(摄氏度)260
电源5 V
Prop。Delay @ Nom-Sup30 ns
传播延迟(tpd)30 ns
认证状态Not Qualified
座面最大高度4.2 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级AUTOMOTIVE
端子面层NICKEL PALLADIUM GOLD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度7.62 mm
Base Number Matches1

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74HC240; 74HCT240
Octal buffer/line driver; 3-state; inverting
Rev. 03 — 2 August 2007
Product data sheet
1. General description
The 74HC240; 74HCT240 is a high-speed Si-gate CMOS device and is pin compatible
with Low-Power Schottky TTL (LSTTL).
The 74HC240; 74HCT240 is a dual octal inverting buffer/line driver with 3-state outputs.
The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on
nOE causes the outputs to assume a high impedance OFF-state.
The 74HC240; 74HCT240 is similar to the 74HC244; 74HCT244 but has inverting
outputs.
2. Features
s
s
s
s
Inverting 3-state outputs
Multiple package options
Complies with JEDEC standard no. 7 A
ESD protection:
x
HBM JESD22-A114-D exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC240
74HC240N
74HC240D
74HC240DB
74HC240PW
74HC240BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
DIP20
SO20
SSOP20
TSSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT146-1
SOT163-1
SOT339-1
Description
Version
Type number
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HCT240
74HCT240N
−40 °C
to +125
°C

74HCT240N,652相似产品对比

74HCT240N,652 74HC240DB-T 935283683115 74HC240N,652 935283684115
描述 IC BUFFER INVERT 5.5V 20DIP 缓冲器和线路驱动器 octal 3-S buffer inv HC/UH SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 IC BUFFER INVERT 6V 20DIP HCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
包装说明 DIP, DIP20,.3 SSOP, HVQCCN, DIP, DIP20,.3 HVQCCN,
Reach Compliance Code compliant unknow unknow compliant unknow
系列 HCT HC/UH HC/UH HC/UH HCT
JESD-30 代码 R-PDIP-T20 R-PDSO-G20 R-PQCC-N20 R-PDIP-T20 R-PQCC-N20
长度 26.73 mm 7.2 mm 4.5 mm 26.73 mm 4.5 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 4 4 4 4 4
功能数量 2 2 2 2 2
端口数量 2 2 2 2 2
端子数量 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SSOP HVQCCN DIP HVQCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
传播延迟(tpd) 30 ns 150 ns 150 ns 150 ns 30 ns
座面最大高度 4.2 mm 2 mm 1 mm 4.2 mm 1 mm
最大供电电压 (Vsup) 5.5 V 6 V 6 V 6 V 5.5 V
最小供电电压 (Vsup) 4.5 V 2 V 2 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 THROUGH-HOLE GULL WING NO LEAD THROUGH-HOLE NO LEAD
端子节距 2.54 mm 0.65 mm 0.5 mm 2.54 mm 0.5 mm
端子位置 DUAL DUAL QUAD DUAL QUAD
宽度 7.62 mm 5.3 mm 2.5 mm 7.62 mm 2.5 mm
是否Rohs认证 符合 符合 - 符合 -
厂商名称 NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦)
零件包装代码 DIP SSOP - DIP -
针数 20 20 - 20 -
JESD-609代码 e4 e4 - e4 -
负载电容(CL) 50 pF 50 pF - 50 pF -
峰值回流温度(摄氏度) 260 260 - 260 -
认证状态 Not Qualified Not Qualified - Not Qualified -
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - Nickel/Palladium/Gold (Ni/Pd/Au) -
处于峰值回流温度下的最长时间 30 30 - 30 -
Base Number Matches 1 1 1 1 -

 
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