IC 8BIT ADDRESS LATCH 16-DHVQFN
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | 3.50 X 2.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763, DHVQFN-16 |
| 针数 | 16 |
| 制造商包装代码 | SOT763-1 |
| Reach Compliance Code | compliant |
| 其他特性 | 1:8 DMUX FOLLOWED BY LATCH |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-XQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 3.5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.006 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.1X.14,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 36 ns |
| 传播延迟（tpd） | 60 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 触发器类型 | LOW LEVEL |
| 宽度 | 2.5 mm |
| Base Number Matches | 1 |
| 74LV259BQ,115 | 74LV259PW,112 | 74LV259D,118 | 74LV259D,112 | 74LV259N,112 | 74LV259DB,118 | 74LV259DB,112 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC 8BIT ADDRESS LATCH 16-DHVQFN | IC 8BIT ADDRESSABL LATCH 16TSSOP | IC 8BIT ADDRESSABLE LATCH 16SOIC | IC 8BIT ADDRESSABLE LATCH 16SOIC | IC 8BIT ADDRESSABLE LATCH 16-DIP | IC 8BIT ADDRESSABLE LATCH 16SSOP | IC 8BIT ADDRESSABLE LATCH 16SSOP |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFN | TSSOP | SOP | SOP | DIP | SSOP1 | SSOP1 |
| 包装说明 | 3.50 X 2.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763, DHVQFN-16 | 4.40 MM, PLASTIC, MO-153, SOT403, TSSOP-16 | SOP, SOP16,.25 | 3.90 MM, PLASTIC, MS-012, SOT109, SOP-16 | 0.300 INCH, PLASTIC, SOT38, DIP-16 | 5.30 MM, PLASTIC, MO-150, SOT338, SSOP-16 | 5.30 MM, PLASTIC, MO-150, SOT338, SSOP-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | SOT763-1 | SOT403-1 | SOT109-1 | SOT109-1 | SOT38-4 | SOT338-1 | SOT338-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3.5 mm | 5 mm | 9.9 mm | 9.9 mm | 19.025 mm | 6.2 mm | 6.2 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| 最大I（ol） | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | TSSOP | SOP | SOP | DIP | SSOP | SSOP |
| 封装等效代码 | LCC16,.1X.14,20 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | DIP16,.3 | SSOP16,.3 | SSOP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns |
| 传播延迟（tpd） | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.1 mm | 1.75 mm | 1.75 mm | 4.2 mm | 2 mm | 2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 30 | 30 | 30 | 30 | 30 |
| 触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
| 宽度 | 2.5 mm | 4.4 mm | 3.9 mm | 3.9 mm | 7.62 mm | 5.3 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 |
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