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74VCX16240

产品描述Low−Voltage 1.8/2.5/3.3V 16−Bit Buffer
文件大小214KB,共9页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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74VCX16240概述

Low−Voltage 1.8/2.5/3.3V 16−Bit Buffer

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74VCX16240
Low−Voltage 1.8/2.5/3.3V
16−Bit Buffer
With 3.6 V−Tolerant Inputs and Outputs
(3−State, Inverting)
The 74VCX16240 is an advanced performance, inverting 16−bit
buffer. It is designed for very high−speed, very low−power operation
in 1.8 V, 2.5 V or 3.3 V systems.
When operating at 2.5 V (or 1.8 V) the part is designed to tolerate
voltages it may encounter on either inputs or outputs when interfacing
to 3.3 V busses. It is guaranteed to be over−voltage tolerant to 3.6 V.
The 74VCX16240 is nibble controlled with each nibble functioning
identically, but independently. The control pins may be tied together to
obtain full 16−bit operation. The 3−state outputs are controlled by an
Output Enable (OEn) input for each nibble. When OEn is LOW, the
outputs are on. When OEn is HIGH, the outputs are in the high
impedance state.
Features
http://onsemi.com
MARKING DIAGRAM
48
48
1
VCX16240
AWLYYWW
TSSOP−48
DT SUFFIX
CASE 1201
A
WL
YY
WW
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
Designed for Low Voltage Operation: V
CC
= 1.65 V
3.6 V
3.6V Tolerant Inputs and Outputs
High Speed Operation: 2.5 ns max for 3.0 V to 3.6 V
3.0 ns max for 2.3 V to 2.7 V
6.0 ns max for 1.65 V to 1.95 V
Static Drive:
±24
mA Drive at 3.0 V
±18
mA Drive at 2.3 V
±6
mA Drive at 1.65 V
Supports Live Insertion and Withdrawal
I
OFF
Specification Guarantees High Impedance When V
CC
= 0 V
Near Zero Static Supply Current in All Three Logic States (20
mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds
±250
mA @ 125°C
ESD Performance: Human Body Model >2000 V;
Machine Model >200 V
All Devices in Package TSSOP are Inherently Pb−Free*
ORDERING INFORMATION
Device
74VCX16240DT
74VCX16240DTR
Package
TSSOP
(Pb−Free)
TSSOP
(Pb−Free)
Shipping
39 / Rail
2500 / Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
June, 2006
Rev. 5
1
Publication Order Number:
74VCX16240/D

74VCX16240相似产品对比

74VCX16240 74VCX16240DT 74VCX16240DTR
描述 Low−Voltage 1.8/2.5/3.3V 16−Bit Buffer Low−Voltage 1.8/2.5/3.3V 16−Bit Buffer Low−Voltage 1.8/2.5/3.3V 16−Bit Buffer
是否Rohs认证 - 不符合 不符合
厂商名称 - ON Semiconductor(安森美) ON Semiconductor(安森美)
零件包装代码 - TSSOP TSSOP
包装说明 - TSSOP, TSSOP48,.3,20 TSSOP, TSSOP48,.3,20
针数 - 48 48
Reach Compliance Code - not_compliant not_compliant
控制类型 - ENABLE LOW ENABLE LOW
系列 - ALVC/VCX/A ALVC/VCX/A
JESD-30 代码 - R-PDSO-G48 R-PDSO-G48
JESD-609代码 - e0 e0
长度 - 12.5 mm 12.5 mm
负载电容(CL) - 30 pF 30 pF
逻辑集成电路类型 - BUS DRIVER BUS DRIVER
最大I(ol) - 0.018 A 0.018 A
湿度敏感等级 - 1 1
位数 - 4 4
功能数量 - 4 4
端口数量 - 2 2
端子数量 - 48 48
最高工作温度 - 85 °C 85 °C
最低工作温度 - -40 °C -40 °C
输出特性 - 3-STATE 3-STATE
输出极性 - INVERTED INVERTED
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - TSSOP TSSOP
封装等效代码 - TSSOP48,.3,20 TSSOP48,.3,20
封装形状 - RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 - RAIL TAPE AND REEL
电源 - 3.3 V 3.3 V
Prop。Delay @ Nom-Sup - 2.5 ns 2.5 ns
传播延迟(tpd) - 6 ns 6 ns
认证状态 - Not Qualified Not Qualified
座面最大高度 - 1.1 mm 1.1 mm
最大供电电压 (Vsup) - 3.6 V 3.6 V
最小供电电压 (Vsup) - 1.65 V 1.65 V
标称供电电压 (Vsup) - 3.3 V 3.3 V
表面贴装 - YES YES
技术 - CMOS CMOS
温度等级 - INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - GULL WING GULL WING
端子节距 - 0.5 mm 0.5 mm
端子位置 - DUAL DUAL
宽度 - 6.1 mm 6.1 mm
Base Number Matches - 1 1

 
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