IS61LV256-20JI概述

Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28

IS61LV256-20JI规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Integrated Silicon Solution ( ISSI )
零件包装代码	SOJ
包装说明	SOJ-28
针数	28
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
最长访问时间	20 ns
其他特性	AUTOMATIC POWER DOWN
I/O 类型	COMMON
JESD-30 代码	R-PDSO-J28
JESD-609代码	e0
内存密度	262144 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	28
字数	32768 words
字数代码	32000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	32KX8
输出特性	3-STATE
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	SOJ
封装等效代码	SOJ28,.34
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	PARALLEL
认证状态	Not Qualified
反向引出线	NO
最大待机电流	0.005 A
最大压摆率	0.09 mA
最大供电电压 (Vsup)	3.33 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	J BEND
端子位置	DUAL
Base Number Matches	1

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IS61LV256-20JI相似产品对比

	IS61LV256-20JI	IS61LV256-12T	IS61LV256-15J	IS61LV256-20NI	IS61LV256-12N	IS61LV256-15NI	IS61LV256-20J	IS61LV256-25T	IS61LV256-25NI
描述	Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 12ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, TSOP1-28	Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 32KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, TSOP-28	Standard SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
零件包装代码	SOJ	TSOP	SOJ	DIP	DIP	DIP	SOJ	TSOP	DIP
包装说明	SOJ-28	TSOP1-28	SOJ-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28	SOJ-28	0.450 INCH, PLASTIC, TSOP-28	0.300 INCH, PLASTIC, DIP-28
针数	28	28	28	28	28	28	28	28	28
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	20 ns	12 ns	15 ns	20 ns	12 ns	15 ns	20 ns	25 ns	25 ns
其他特性	AUTOMATIC POWER DOWN	AUTOMATIC POWER DOWN	AUTOMATIC POWER DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PDSO-J28	R-PDSO-G28	R-PDSO-J28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDSO-J28	R-PDSO-G28	R-PDIP-T28
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1
端子数量	28	28	28	28	28	28	28	28	28
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C
组织	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOJ	TSOP1	SOJ	DIP	DIP	DIP	SOJ	TSOP1	DIP
封装等效代码	SOJ28,.34	TSSOP28,.53,22	SOJ28,.34	DIP28,.3	DIP28,.3	DIP28,.3	SOJ28,.34	TSSOP28,.53,22	DIP28,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.005 A	0.002 A	0.002 A	0.005 A	0.002 A	0.005 A	0.002 A	0.002 A	0.005 A
最大压摆率	0.09 mA	0.1 mA	0.09 mA	0.09 mA	0.1 mA	0.1 mA	0.08 mA	0.07 mA	0.08 mA
最大供电电压 (Vsup)	3.33 V	3.33 V	3.33 V	3.465 V	3.63 V	3.465 V	3.33 V	3.63 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	2.97 V	3.135 V	3.135 V	3.135 V	2.97 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	NO	NO	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	J BEND	GULL WING	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	GULL WING	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
湿度敏感等级	3	3	3	-	-	-	3	3	-
长度	-	-	-	35.306 mm	35.306 mm	35.306 mm	-	11.8 mm	35.306 mm
端口数量	-	-	-	1	1	1	-	1	1
峰值回流温度（摄氏度）	-	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
电源	-	-	-	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V
座面最大高度	-	-	-	4.572 mm	4.572 mm	4.572 mm	-	1.2 mm	4.572 mm
最小待机电流	-	-	-	3.13 V	3.13 V	3.13 V	-	3.13 V	3.13 V
端子节距	-	-	-	2.54 mm	2.54 mm	2.54 mm	-	0.55 mm	2.54 mm
处于峰值回流温度下的最长时间	-	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
宽度	-	-	-	7.62 mm	7.62 mm	7.62 mm	-	8 mm	7.62 mm

IS61LV256-20JI

IS61LV256-20JI概述

IS61LV256-20JI规格参数

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