BM20/BM23
Bluetooth
®
4.1 Stereo Audio Module
Features:
Complete, Fully Certified, Embedded
2.4 GHz Bluetooth® Version 4.1
Module
Bluetooth Classic (BDR/EDR)
Bluetooth SIG Certified
Onboard embedded Bluetooth Stack
Transparent UART mode for seamless serial
data over UART interface
Easy to configure with Windows GUI or direct
by MCU
Compact surface mount module: 29 x 15 x
3
2.5 mm
Castellated surface mount pads for easy
and reliable host PCB mounting
Environmentally friendly, RoHS compliant
Perfect for Portable Battery Operated
Devices
Internal Battery Regulator Circuitry
Worldwide regulatory certifications
Audio-In / Out
2
BM23 support digital audio I S format.
BM20 support analog audio output.
Operational:
Operating voltage: 3.0V to 4.2V
Temperature range:
‐20C
to 70°C
Simple, UART interface
Integrated crystal, internal voltage
regulator, and matching circuitry
Multiple I/O pins for control and status
RF/Analog:
Frequency: 2.402 to 2.480 GHz
Receive Sensitivity:
‐91
dBm (
π/4
DQPSK
)
Power Output: class 2 / +4dBm max.
Connection Distance: >10m
(free space and no interference)
Audio processor
Support 64 kb/s A-Law or
-Law
PCM format, or
CVSD (Continuous Variable Slope Delta
Modulation) for SCO channel operation.
Noise suppression
Echo suppression
SBC and optional AAC decoding
Packet loss concealment
Build-in four languages (Chinese/ English/ Spanish/
French) voice prompts and 20 events for each one
(This function can be set up in “IS20XXS_UI” tool.)
Support SCMS-T
Audio Codec
20 bit DAC and 16 bit ADC codec
98dB SNR DAC playback
Peripherals
Built-in Lithium-ion battery charger (up to 350mA)
Integrate 3V, 1.8V configurable switching regulator and
LDO
Built-in ADC for battery monitor and voltage sense.
A line-in port for external audio input
Two LED drivers
Flexible HCI interface
High speed HCI-UART (Universal Asynchronous
Receiver Transmitter) interface (up to 921600bps)
MAC/Baseband/Higher Layer:
Secure AES128 encryption
Bluetooth profiles
- HFP v1.6
- HSP v1.1
- A2DP v1.2
- AVRCP v1.5
- SPP v1.0
- PBAP v1.0
Antenna:
Printed Antenna
Compliance:
Bluetooth SIG QDID
Module certified for the United States (FCC) and
Canada (IC), Korea (LCC), Taiwan (NCC), Japan
(MIC) and China(SRRC)
2015 Microchip Technology Inc.
Preliminary Edition
Page 1
Figure 1:
General Description:
Stereo module is a fully-certified
Bluetooth® Version 4.1 (BDR/EDR) module
for designers who want to add Bluetooth®
wireless audio and voice applications to their
products.
This Bluetooth SIG certified module
provides a complete wireless solution with
Bluetooth stack, integrated antenna, and
worldwide radio certifications in a compact
3
surface mount package, 29x15x2.5 mm .
This stereo module built-in Li-Ion charger
and BM23 contain a digital audio interface. It
supports HSP, HFP, SPP, A2DP, and
AVRCP profiles. Both AAC and SBC codecs
are supported for A2DP. Note that the
customer must connect their own external
analog CODEC/DSP/amplifier and MCU for
audio output.
Applications:
Bluetooth sound bar
Bluetooth stereo speaker phone
2015 Microchip Technology Inc.
Preliminary Edition
Page 2
Stereo Module
Table of Contents
1.
2.
3.
4.
DEVICE OVERVIEW .........................................................................................................6
APPLICATION INFORMATION .....................................................................................12
ELECTRICAL CHARACTERISTICS...............................................................................20
PRINTED ANTENNA INFORMATION ..........................................................................25
4.1.
MODULE RADIATION PATTERN
..............................................................................25
4.2. MODULE PLACEMENT RULE
..................................................................................26
5.
REFERENCE CIRCUIT ....................................................................................................27
5.1. BM20 REFERENCE CIRCUIT
................................................................................27
5.2. BM23 REFERENCE CIRCUIT
....................................................................................28
6.
7.
MODULE OUTLINE AND REFLOW PROFILE ............................................................29
PACKAGING AND STORAGE INFORMATION ..........................................................34
A.1 REGULATORY APPROVAL
.......................................................................................36
A.2 United States
.................................................................................................................36
A.2.1 LABELING AND USER INFORMATION REQUIREMENTS .............................37
A.2.2 RF EXPOSURE
.............................................................................................................38
A.2.3 HELPFUL WEB SITES
...................................................................................................38
A.3 Canada
...........................................................................................................................39
A.3.1 LABELING AND USER INFORMATION REQUIREMENTS
.............................................39
A.3.2 RF EXPOSURE
.............................................................................................................40
A.3.3 WEB SITES
.................................................................................................................40
A.4 Europe
............................................................................................................................40
A.4.1 ABELING AND USER INFORMATION REQUIREMENTS ...............................41
A.4.2 ANTENNA REQUIREMENTS ...............................................................................41
A.4.3 HELPFUL WEB SITES ...........................................................................................42
A.5 Japan
..............................................................................................................................43
A.5.1 LABELING AND USER INFORMATION REQUIREMENTS .............................43
A.5.2 HELPFUL WEB SITES ...........................................................................................44
A.6 Korea
..............................................................................................................................44
A.6.1 LABELING AND USER INFORMATION REQUIREMENTS .............................44
A.6.2 HELPFUL WEB SITES ...........................................................................................44
A.7 Taiwan
............................................................................................................................45
A.7.1 LABELING AND USER INFORMATION REQUIREMENTS .............................45
A.7.2 HELPFUL WEB SITES ...........................................................................................45
APPENDIX A: CERTIFICATION NOTICES ..........................................................................36
2015 Microchip Technology Inc.
Preliminary Edition
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Stereo Module
A.8 China
.............................................................................................................................46
A.8.1 LABELING AND USER INFORMATION REQUIREMENTS .............................46
A.9 Other Regulatory Jurisdictions
..................................................................................46
2015 Microchip Technology Inc.
Preliminary Edition
Page 4
Stereo Module
TO OUR VALUED CUSTOMERS
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Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications
will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications
Department via E-mail at
docerrors@microchip.com.
We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for
current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will
specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site;
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number)
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Abbreviations List:
HFP:
Hands-free Profile
AVRCP:
Audio Video Remote Control Profile
A2DP:
Advanced Audio Distribution Profile
PBAP:
Phone Book Access Profile
HSP:
Headset Profile
SPP:
Serial Port Profile
2015 Microchip Technology Inc.
Preliminary Edition
Page 5
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