电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206X154G4JACAUTO

产品描述CAP CER 0.15UF 16V U2J 1206
产品类别无源元件   
文件大小1MB,共19页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

C1206X154G4JACAUTO在线购买

供应商 器件名称 价格 最低购买 库存  
C1206X154G4JACAUTO - - 点击查看 点击购买

C1206X154G4JACAUTO概述

CAP CER 0.15UF 16V U2J 1206

C1206X154G4JACAUTO规格参数

参数名称属性值
电容.15µF
容差±2%
电压 - 额定16V
温度系数U2J
工作温度-55°C ~ 125°C
特性软端子
等级AEC-Q200
应用汽车级,Boardflex 敏感
安装类型表面贴装,MLCC
封装/外壳1206(3216 公制)
大小/尺寸0.130" 长 x 0.063" 宽(3.30mm x 1.60mm)
厚度(最大值)0.053"(1.35mm)

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric,
10 – 100 VDC (Commercial & Automotive Grade)
Overview
The KEMET Flexible Termination (FT-CAP) Multilayer
Ceramic Capacitor in U2J dielectric incorporates a unique,
flexible termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier layers
of the KEMET standard termination system in order to
establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure mode
of MLCCs — flex cracks, which are typically the result of
excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the
rigid ceramic body, therefore mitigating flex cracks which
can result in low insulation resistance (IR) or short circuit
failures. KEMET automotive grade capacitors meet the
demanding Automotive Electronics Council's AEC-Q200
qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with Flexible
Termination (FF-CAP), and KEMET Power Solutions (KPS)
product lines provide a complete portfolio of flex mitigation
solutions.
Combined with the stability of U2J dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS compliant, offer up to 5 mm of
flex-bend capability and capacitance change limited to –750
±20 ppm/°C from –55°C to +125°C. These devices are lead-
free, RoHS and REACH compliant without exception and are
capable of withstanding multiple passes through a lead-free
solder reflow profile.
Ordering Information
C
Ceramic
1206
X
104
Capacitance
Code (pF)
Two significant
digits and
number of
zeros.
J
3
J
A
C
Termination Finish
C = 100% Matte Sn
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options Table"
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
X = Flexible
Termination
Failure Rate/
Capacitance
Rated Voltage
Dielectric
1
Design
Tolerance
(VDC)
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
J = U2J
A = N/A
1
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1087_U2J_FT-CAP_SMD • 11/8/2018
1
51单片机关于温度传感器的问题,学了好久终于把程序写出来,可是不知错在哪了 求指导
下面是我的程序 #include #include #define uint unsigned int #define uchar unsigned char sbit dula=P2^6; sbit wela=P2^7; sbit dq=P1^0; uint x,y; uchar shi,ge,shifen,d; uc ......
Jzeng123 51单片机
刚收到的msp430FR2433 LaunchPad
本帖最后由 数码小叶 于 2018-1-2 14:47 编辑 上周研讨会介绍的,看到在做活动,就入了一块,20几块钱还包邮。。。快递在上海呆了两天,合肥呆了三天,今天到手。这次的Launchpad,芯片是一个 ......
数码小叶 微控制器 MCU
求51单片机驱动12864无字库液晶的头文件
//**********************LCD——12864显示程序**************//#include <reg52.h>#include <string.h>#include <math.h>#include <LCD_12864.h>#include <LCD_12864_data.h ......
zxpla 51单片机
求找有图的电子元器件书,急!
各位朋友,你们好!小弟想找一些介绍电子元器件的电子书,(有图附)。我在网上找了很久都没有找到,在这求助于你们,希望你们能帮下我,谢谢!...
zeng830929 FPGA/CPLD
单片机程序集----c+汇编(伟福公司)
单片机程序集----c+汇编(伟福公司)...
呱呱 单片机
PCB评估过程中需要关注哪些因素?
  对于PCB技术的文章来说,作者可阐述近段时间来PCB设计工程师们所面临的挑战,因为这已成为评估PCB设计不可或缺的方面。在文章中,可以探讨如何迎接这些挑战及潜在的解决方案;在解决PCB设计 ......
ESD技术咨询 PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 268  1890  2132  1006  1053  11  31  48  14  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved