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MT47H16M16FG-3:B: 产品描述DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, 8 X 14 MM, FBGA-84; 产品类别存储; 文件大小9MB，共128页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/

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MT47H16M16FG-3:B概述

DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, 8 X 14 MM, FBGA-84

MT47H16M16FG-3:B规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	TFBGA, BGA84,9X15,32
针数	84
Reach Compliance Code	not_compliant
ECCN代码	EAR99
Is Samacsys	N
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.45 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	333 MHz
I/O 类型	COMMON
交错的突发长度	4,8
JESD-30 代码	R-PBGA-B84
JESD-609代码	e0
长度	14 mm
内存密度	268435456 bit
内存集成电路类型	DDR DRAM
内存宽度	16
功能数量	1
端口数量	1
端子数量	84
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	105 °C
最低工作温度	-40 °C
组织	16MX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA84,9X15,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	235
电源	1.8 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	4,8
最大待机电流	0.005 A
最大压摆率	0.32 mA
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead/Silver (Sn/Pb/Ag)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	8 mm
Base Number Matches	1

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256Mb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H64M4 – 16 Meg x 4 x 4 banks

MT47H32M8 – 8 Meg x 8 x 4 banks

MT47H16M16 – 4 Meg x 16 x 4 banks

Features

•

= +1.8V ±0.1V, V

DDQ

= +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

4 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

Automotive temperature (AT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

•

Configuration

–

64 Meg x 4 (16 Meg x 4 x 4 banks)

–

32 Meg x 8 (8 Meg x 8 x 4 banks)

–

16 Meg x 16 (4 Meg x 16 x 4 banks)

•

FBGA package (Pb-free)

–

60-ball FBGA (8mm x 12mm) x4, x8

–

84-ball FBGA (8mm x 14mm) x16

•

FBGA package (lead solder)

–

60-ball FBGA (8mm x 12mm) x4, x8

–

84-ball FBGA (8mm x 14mm) x16

•

Timing – cycle time

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

–

5.0ns @ CL = 3 (DDR2-400)

•

Self refresh

–

Standard

–

Low-power

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive (–40°C

≤

, T

≤

105°C)

•

Revision

Note:

Marking

64M4

32M8

16M16

-3

-37E

-5E

None

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-3

-37E

-5E

CL = 3

400

CL = 4

533

400

CL = 5

667

n/a

(ns)

PDF: 09005aef8117c187

256MbDDR2.pdf - Rev. M 7/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 DDR2 SDRAM

State Diagram .................................................................................................................................................. 8

Functional Description ..................................................................................................................................... 9

Industrial Temperature ................................................................................................................................ 9

Automotive Temperature ........................................................................................................................... 10

General Notes ............................................................................................................................................ 10

Functional Block Diagrams ............................................................................................................................. 11

Ball Assignments and Descriptions ................................................................................................................. 13

Packaging ...................................................................................................................................................... 17

Package Dimensions .................................................................................................................................. 17

FBGA Package Capacitance ......................................................................................................................... 19

Electrical Specifications – Absolute Ratings ..................................................................................................... 20

Temperature and Thermal Impedance ........................................................................................................ 20

Electrical Specifications – I

Parameters ........................................................................................................ 23

Specifications and Conditions ............................................................................................................... 23

DD7

Conditions .......................................................................................................................................... 23

AC Timing Operating Specifications ................................................................................................................ 26

AC and DC Operating Conditions .................................................................................................................... 37

ODT DC Electrical Characteristics ................................................................................................................... 38

Input Electrical Characteristics and Operating Conditions ............................................................................... 39

Output Electrical Characteristics and Operating Conditions ............................................................................. 42

Output Driver Characteristics ......................................................................................................................... 44

Power and Ground Clamp Characteristics ....................................................................................................... 48

AC Overshoot/Undershoot Specification ......................................................................................................... 49

Input Slew Rate Derating ................................................................................................................................ 51

Commands .................................................................................................................................................... 64

Truth Tables ............................................................................................................................................... 64

DESELECT ................................................................................................................................................. 68

NO OPERATION (NOP) .............................................................................................................................. 69

LOAD MODE (LM) ..................................................................................................................................... 69

ACTIVATE .................................................................................................................................................. 69

READ ......................................................................................................................................................... 69

WRITE ....................................................................................................................................................... 69

PRECHARGE .............................................................................................................................................. 70

REFRESH ................................................................................................................................................... 70

SELF REFRESH ........................................................................................................................................... 70

Mode Register (MR) ........................................................................................................................................ 70

Burst Length .............................................................................................................................................. 71

Burst Type ................................................................................................................................................. 72

Operating Mode ......................................................................................................................................... 72

DLL RESET ................................................................................................................................................. 72

Write Recovery ........................................................................................................................................... 73

Power-Down Mode .................................................................................................................................... 73

CAS Latency (CL) ........................................................................................................................................ 74

Extended Mode Register (EMR) ....................................................................................................................... 75

DLL Enable/Disable ................................................................................................................................... 76

Output Drive Strength ................................................................................................................................ 76

DQS# Enable/Disable ................................................................................................................................. 76

RDQS Enable/Disable ................................................................................................................................. 76

Output Enable/Disable ............................................................................................................................... 76

On-Die Termination (ODT) ........................................................................................................................ 77

Contents

PDF: 09005aef8117c187

256MbDDR2.pdf - Rev. M 7/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 77

Posted CAS Additive Latency (AL) ............................................................................................................... 77

Extended Mode Register 2 (EMR2) .................................................................................................................. 79

Extended Mode Register 3 (EMR3) .................................................................................................................. 80

Initialization .................................................................................................................................................. 81

ACTIVATE ...................................................................................................................................................... 85

READ ............................................................................................................................................................. 87

READ with Precharge ................................................................................................................................. 91

READ with Auto Precharge .......................................................................................................................... 93

WRITE ........................................................................................................................................................... 98

PRECHARGE ................................................................................................................................................. 108

REFRESH ...................................................................................................................................................... 109

SELF REFRESH .............................................................................................................................................. 110

Power-Down Mode ....................................................................................................................................... 112

Precharge Power-Down Clock Frequency Change .......................................................................................... 119

Reset ............................................................................................................................................................. 120

CKE Low Anytime ...................................................................................................................................... 120

ODT Timing .................................................................................................................................................. 122

MRS Command to ODT Update Delay ........................................................................................................ 124

PDF: 09005aef8117c187

256MbDDR2.pdf - Rev. M 7/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 DDR2 SDRAM

Table 1: Key Timing Parameters ...................................................................................................................... 1

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 60-Ball – x4, x8 and 84-Ball – x16 Descriptions .......................................................................... 15

Table 4: Input Capacitance ............................................................................................................................ 19

Table 5: Absolute Maximum DC Ratings ........................................................................................................ 20

Table 6: Temperature Limits .......................................................................................................................... 21

Table 7: Thermal Impedance ......................................................................................................................... 22

Table 8: General I

Parameters .................................................................................................................... 23

Table 9: I

DD7

Timing Patterns (4-Bank Interleave READ Operation) ................................................................ 23

Table 10: DDR2 I

Specifications and Conditions ......................................................................................... 24

Table 11: AC Operating Specifications and Conditions .................................................................................... 26

Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 37

Table 13: ODT DC Electrical Characteristics ................................................................................................... 38

Table 14: Input DC Logic Levels ..................................................................................................................... 39

Table 15: Input AC Logic Levels ..................................................................................................................... 39

Table 16: Differential Input Logic Levels ........................................................................................................ 40

Table 17: Differential AC Output Parameters .................................................................................................. 42

Table 18: Output DC Current Drive ................................................................................................................ 42

Table 19: Output Characteristics .................................................................................................................... 43

Table 20: Full Strength Pull-Down Current (mA) ............................................................................................ 44

Table 21: Full Strength Pull-Up Current (mA) ................................................................................................. 45

Table 22: Reduced Strength Pull-Down Current (mA) ..................................................................................... 46

Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 47

Table 24: Input Clamp Characteristics ........................................................................................................... 48

Table 25: Address and Control Balls ............................................................................................................... 49

Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 49

Table 27: AC Input Test Conditions ................................................................................................................ 50

Table 28: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) ................................................... 52

Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) .......................................... 53

Table 30: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ..................................................... 56

Table 31: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................ 57

Table 32: Single-Ended DQS Slew Rate Derating Values Using

and

.................................................. 58

Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ..................................... 58

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ..................................... 59

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ..................................... 59

Table 36: Truth Table – DDR2 Commands ..................................................................................................... 64

Table 37: Truth Table – Current State Bank

– Command to Bank

............................................................... 65

Table 38: Truth Table – Current State Bank

– Command to Bank

.............................................................. 67

Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 68

Table 40: Burst Definition .............................................................................................................................. 72

Table 41: READ Using Concurrent Auto Precharge ......................................................................................... 93

Table 42: WRITE Using Concurrent Auto Precharge ........................................................................................ 99

Table 43: Truth Table – CKE ......................................................................................................................... 114

List of Tables

PDF: 09005aef8117c187

256MbDDR2.pdf - Rev. M 7/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H16M16FG-3:B

MT47H16M16FG-3:B概述

MT47H16M16FG-3:B规格参数

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