
IC RF TXRX+MCU ISM<1GHZ 42-VFLGA
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Silicon Laboratories Inc |
| 包装说明 | LGA-42 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 其他特性 | ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY. |
| JESD-30 代码 | R-XBGA-B42 |
| 长度 | 7 mm |
| 端子数量 | 42 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HLGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 座面最大高度 | 0.95 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 1.8 V |
| 标称供电电压 | 1.9 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BUTT |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
| Base Number Matches | 1 |
| SI1005-E-GM2 | SI1003-E-GM2 | SI1001-E-GM2 | SI1002-E-GM2 | SI1000-E-GM2 | SI1004-E-GM2 | |
|---|---|---|---|---|---|---|
| 描述 | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | 符合 |
| 厂商名称 | Silicon Laboratories Inc | - | - | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
| 包装说明 | LGA-42 | - | - | HLGA, | LGA-42 | HLGA, |
| Reach Compliance Code | compliant | - | - | compliant | compliant | compliant |
| 其他特性 | ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY. | - | - | ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY. | ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY. | ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY. |
| JESD-30 代码 | R-XBGA-B42 | - | - | R-XBGA-B42 | R-XBGA-B42 | R-XBGA-B42 |
| 长度 | 7 mm | - | - | 7 mm | 7 mm | 7 mm |
| 端子数量 | 42 | - | - | 42 | 42 | 42 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HLGA | - | - | HLGA | HLGA | HLGA |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG | - | - | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 0.95 mm | - | - | 0.95 mm | 0.95 mm | 0.95 mm |
| 最大供电电压 | 3.6 V | - | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 | 1.9 V | - | - | 1.9 V | 1.9 V | 1.9 V |
| 表面贴装 | YES | - | - | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BUTT | - | - | BUTT | BUTT | BUTT |
| 端子节距 | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | - | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | - | - | 5 mm | 5 mm | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | - | - | microcontroller | MICROPROCESSOR | microcontroller |
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