IC ADC DUAL 10BIT 80MSPS 64QFN
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 符合 |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 |
制造商包装代码 | UP |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Is Samacsys | N |
最大模拟输入电压 | 1 V |
最大模拟输出电压 | 1.9 V |
最小模拟输出电压 | 1 V |
转换器类型 | A/D CONVERTER |
输入位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输入格式 | PARALLEL |
JESD-30 代码 | S-PQCC-N64 |
JESD-609代码 | e3 |
长度 | 9 mm |
最大线性误差 (EL) | 0.0586% |
湿度敏感等级 | 1 |
位数 | 10 |
功能数量 | 2 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
标称安定时间 (tstl) | 0.0059 µs |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 9 mm |
Base Number Matches | 1 |
LTC2289IUP#PBF | DC851A-O | LTC2289IUP#TRPBF | LTC2289CUP#PBF | LTC2289CUP#TRPBF | |
---|---|---|---|---|---|
描述 | IC ADC DUAL 10BIT 80MSPS 64QFN | board eval ltc2289iup | IC ADC DUAL 10BIT 80MSPS 64QFN | IC ADC DUAL 10BIT 80MSPS 64QFN | IC ADC DUAL 10BIT 80MSPS 64QFN |
Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
零件包装代码 | QFN | - | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 | - | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 | - | 64 | 64 | 64 |
制造商包装代码 | UP | - | UP | UP | UP |
Reach Compliance Code | compliant | - | compliant | compliant | compliant |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
Is Samacsys | N | - | N | N | N |
最大模拟输入电压 | 1 V | - | 1 V | 1 V | 1 V |
最大模拟输出电压 | 1.9 V | - | 1.9 V | 1.9 V | 1.9 V |
最小模拟输出电压 | 1 V | - | 1 V | 1 V | 1 V |
转换器类型 | A/D CONVERTER | - | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
输入位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | - | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输入格式 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
JESD-30 代码 | S-PQCC-N64 | - | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 |
JESD-609代码 | e3 | - | e3 | e3 | e3 |
长度 | 9 mm | - | 9 mm | 9 mm | 9 mm |
最大线性误差 (EL) | 0.0586% | - | 0.0586% | 0.0586% | 0.0586% |
湿度敏感等级 | 1 | - | 1 | 1 | 1 |
位数 | 10 | - | 10 | 10 | 10 |
功能数量 | 2 | - | 2 | 2 | 2 |
端子数量 | 64 | - | 64 | 64 | 64 |
最高工作温度 | 85 °C | - | 85 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 | - | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 |
电源 | 3 V | - | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
标称安定时间 (tstl) | 0.0059 µs | - | 0.0059 µs | 0.0059 µs | 0.0059 µs |
标称供电电压 | 3 V | - | 3 V | 3 V | 3 V |
表面贴装 | YES | - | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 |
宽度 | 9 mm | - | 9 mm | 9 mm | 9 mm |
Base Number Matches | 1 | - | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved