IC ADC 10-BIT 80MSPS 3V 32-QFN
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC32,.2SQ,20 |
针数 | 32 |
制造商包装代码 | UH |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大模拟输入电压 | 1 V |
最小模拟输入电压 | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N32 |
JESD-609代码 | e3 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0488% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3 V |
认证状态 | Not Qualified |
采样速率 | 80 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 5 mm |
LTC2239IUH#PBF | DC782A-L | LTC2239IUH#TRPBF | LTC2239CUH#TRPBF | LTC2239CUH#PBF | |
---|---|---|---|---|---|
描述 | IC ADC 10-BIT 80MSPS 3V 32-QFN | board eval ltc2239iuh | IC ADC 10BIT 80MSPS 3V 32-QFN | IC ADC 10BIT 80MSPS 3V 32-QFN | IC ADC 10-BIT 80MSPS 3V 32-QFN |
Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | QFN | - | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC32,.2SQ,20 | - | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
针数 | 32 | - | 32 | 32 | 32 |
制造商包装代码 | UH | - | UH | UH | UH |
Reach Compliance Code | compliant | - | compliant | compliant | compliant |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 1 V | - | 1 V | 1 V | 1 V |
最小模拟输入电压 | -1 V | - | -1 V | -1 V | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N32 | - | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
JESD-609代码 | e3 | - | e3 | e3 | e3 |
长度 | 5 mm | - | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.0488% | - | 0.0488% | 0.0488% | 0.0488% |
湿度敏感等级 | 1 | - | 1 | 1 | 1 |
模拟输入通道数量 | 1 | - | 1 | 1 | 1 |
位数 | 10 | - | 10 | 10 | 10 |
功能数量 | 1 | - | 1 | 1 | 1 |
端子数量 | 32 | - | 32 | 32 | 32 |
最高工作温度 | 85 °C | - | 85 °C | 70 °C | 70 °C |
输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | - | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 |
电源 | 3 V | - | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 80 MHz | - | 80 MHz | 80 MHz | 80 MHz |
采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3 V | - | 3 V | 3 V | 3 V |
表面贴装 | YES | - | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 |
宽度 | 5 mm | - | 5 mm | 5 mm | 5 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved