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Datasheet> 器件分类 > 模拟混合信号IC> 转换器> LTC2356CMSE-14#PBF

LTC2356CMSE-14#PBF: 产品描述IC ADC 14BIT 3.5MSPS 10-MSOP; 产品类别模拟混合信号IC 转换器; 文件大小498KB，共20页; 制造商Linear ( ADI ); 官网地址http://www.analog.com/cn/index.html; 标准

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LTC2356CMSE-14#PBF概述

IC ADC 14BIT 3.5MSPS 10-MSOP

LTC2356CMSE-14#PBF规格参数

参数名称	属性值
Brand Name	Linear Technology
是否Rohs认证	符合
厂商名称	Linear ( ADI )
零件包装代码	MSOP
包装说明	HTSSOP, TSSOP10,.19,20
针数	10
制造商包装代码	MSE
Reach Compliance Code	compliant
ECCN代码	3A991.C.3
最大模拟输入电压	-1.25 V
最小模拟输入电压	1.25 V
最长转换时间	0.285 µs
转换器类型	ADC, PROPRIETARY METHOD
JESD-30 代码	S-PDSO-G10
JESD-609代码	e3
长度	3 mm
最大线性误差 (EL)	0.0244%
湿度敏感等级	1
模拟输入通道数量	1
位数	14
功能数量	1
端子数量	10
最高工作温度	70 °C
最低工作温度
输出位码	2\'S COMPLEMENT BINARY
输出格式	SERIAL
封装主体材料	PLASTIC/EPOXY
封装代码	HTSSOP
封装等效代码	TSSOP10,.19,20
封装形状	SQUARE
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	3.3 V
认证状态	Not Qualified
采样速率	3.5 MHz
采样并保持/跟踪并保持	SAMPLE
座面最大高度	1.1 mm
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	3 mm

LTC2356CMSE-14#PBF相似产品对比

	LTC2356CMSE-14#PBF	LTC2356IMSE-12#TRPBF	LTC2356IMSE-14#TRPBF	LTC2356IMSE-12#PBF	LTC2356CMSE-14#TRPBF	LTC2356CMSE-12#PBF	LTC2356CMSE-12#TRPBF	LTC2356IMSE-14#PBF
描述	IC ADC 14BIT 3.5MSPS 10-MSOP	IC ADC 12BIT 3.5MSPS 10-MSOP	IC ADC 14BIT 3.5MSPS 10-MSOP	IC ADC 12BIT 3.5MSPS 10-MSOP	IC ADC 14BIT 3.5MSPS 10-MSOP	IC ADC 12BIT 3.5MSPS 10-MSOP	IC ADC 12BIT 3.5MSPS 10-MSOP	IC ADC 14BIT 3.5MSPS 10-MSOP
Brand Name	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )
零件包装代码	MSOP	MSOP	MSOP	MSOP	MSOP	MSOP	MSOP	MSOP
包装说明	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20	HTSSOP, TSSOP10,.19,20
针数	10	10	10	10	10	10	10	10
制造商包装代码	MSE	MSE	MSE	MSE	MSE	MSE	MSE	MSE
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.C.3	EAR99	3A991.C.3	EAR99	3A991.C.3	EAR99	EAR99	3A991.C.3
最大模拟输入电压	-1.25 V	-1.25 V	-1.25 V	-1.25 V	-1.25 V	-1.25 V	-1.25 V	-1.25 V
最小模拟输入电压	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V
最长转换时间	0.285 µs	0.285 µs	0.285 µs	0.285 µs	0.285 µs	0.285 µs	0.285 µs	0.285 µs
转换器类型	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD
JESD-30 代码	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3
长度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
最大线性误差 (EL)	0.0244%	0.0488%	0.0244%	0.0488%	0.0244%	0.0488%	0.0488%	0.0244%
湿度敏感等级	1	1	1	1	1	1	1	1
模拟输入通道数量	1	1	1	1	1	1	1	1
位数	14	12	14	12	14	12	12	14
功能数量	1	1	1	1	1	1	1	1
端子数量	10	10	10	10	10	10	10	10
最高工作温度	70 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C
输出位码	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY	2\'S COMPLEMENT BINARY
输出格式	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP	HTSSOP
封装等效代码	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20	TSSOP10,.19,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
采样速率	3.5 MHz	3.5 MHz	3.5 MHz	3.5 MHz	3.5 MHz	3.5 MHz	3.5 MHz	3.5 MHz
采样并保持/跟踪并保持	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE
座面最大高度	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30
宽度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm

LTC2356CMSE-14#PBF

LTC2356CMSE-14#PBF概述

LTC2356CMSE-14#PBF规格参数

LTC2356CMSE-14#PBF相似产品对比

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