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ISL6613IRZ-T

产品描述IC MOSFET DRVR SYNC BUCK 10-DFN
产品类别模拟混合信号IC    驱动程序和接口   
文件大小674KB,共12页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
标准
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ISL6613IRZ-T概述

IC MOSFET DRVR SYNC BUCK 10-DFN

ISL6613IRZ-T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Renesas(瑞萨电子)
零件包装代码DFN
包装说明HVSON, SOLCC10,.11,20
针数10
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time1 week
高边驱动器YES
接口集成电路类型HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码S-PDSO-N10
JESD-609代码e3
长度3 mm
湿度敏感等级1
功能数量1
端子数量10
最高工作温度85 °C
最低工作温度-40 °C
标称输出峰值电流3 A
封装主体材料PLASTIC/EPOXY
封装代码HVSON
封装等效代码SOLCC10,.11,20
封装形状SQUARE
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源5/12,12 V
认证状态Not Qualified
座面最大高度1 mm
最大供电电压12 V
最小供电电压5 V
电源电压1-最大13.2 V
电源电压1-分钟10.8 V
电源电压1-Nom12 V
表面贴装YES
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度3 mm

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DATASHEET
ISL6612, ISL6613
Advanced Synchronous Rectified Buck MOSFET Drivers with Protection Features
The ISL6612 and ISL6613 are high frequency MOSFET
drivers specifically designed to drive upper and lower power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. These drivers combined with HIP63xx or
ISL65xx Multi-Phase Buck PWM controllers and N-Channel
MOSFETs form complete core-voltage regulator solutions for
advanced microprocessors.
The ISL6612 drives the upper gate to 12V, while the lower
gate can be independently driven over a range from 5V to
12V. The ISL6613 drives both upper and lower gates over a
range of 5V to 12V. This drive-voltage provides the flexibility
necessary to optimize applications involving trade-offs
between gate charge and conduction losses.
An advanced adaptive zero shoot-through protection is
integrated to prevent both the upper and lower MOSFETs from
conducting simultaneously and to minimize the dead time.
These products add an overvoltage protection feature
operational before VCC exceeds its turn-on threshold, at which
the PHASE node is connected to the gate of the low side
MOSFET (LGATE). The output voltage of the converter is then
limited by the threshold of the low side MOSFET, which
provides some protection to the microprocessor if the upper
MOSFET(s) is shorted during startup. The over-temperature
protection feature prevents failures resulting from excessive
power dissipation by shutting off the outputs when its junction
temperature exceeds +150°C (typically). The driver resets once
its junction temperature returns to +108°C (typically).
These drivers also feature a three-state PWM input which,
working together with Intersil’s multi-phase PWM controllers,
prevents a negative transient on the output voltage when the
output is shut down. This feature eliminates the Schottky
diode that is used in some systems for protecting the load
from reversed output voltage events.
FN9153
Rev 9.00
June 15, 2010
Features
• Pin-to-pin Compatible with HIP6601 SOIC family for Better
Performance and Extra Protection Features
• Dual MOSFET Drives for Synchronous Rectified Bridge
• Advanced Adaptive Zero Shoot-Through Protection
- Body Diode Detection
- Auto-zero of r
DS(ON)
Conduction Offset Effect
• Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
• 36V Internal Bootstrap Schottky Diode
• Bootstrap Capacitor Overcharging Prevention
• Supports High Switching Frequency (up to 2MHz)
- 3A Sinking Current Capability
- Fast Rise/Fall Times and Low Propagation Delays
• Three-State PWM Input for Output Stage Shutdown
• Three-State PWM Input Hysteresis for Applications With
Power Sequencing Requirement
• Pre-POR Overvoltage Protection
• VCC Undervoltage Protection
• Over Temperature Protection (OTP) with +42°C
Hysteresis
• Expandable Bottom Copper Pad for Enhanced Heat
Sinking
• Dual Flat No-Lead (DFN) Package
- Near Chip-Scale Package Footprint; Improves PCB
Efficiency and Thinner in Profile
• Pb-Free Available (RoHS Compliant)
Applications
• Core Regulators for Intel® and AMD® Microprocessors
• High Current DC/DC Converters
• High Frequency and High Efficiency VRM and VRD
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB417 for Power Train Design, Layout
Guidelines, and Feedback Compensation Design
FN9153 Rev 9.00
June 15, 2010
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