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HIP2100IR4ZT

产品描述IC DRIVER HALF BRIDGE 100V 12DFN
产品类别模拟混合信号IC    驱动程序和接口   
文件大小659KB,共13页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
标准
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HIP2100IR4ZT概述

IC DRIVER HALF BRIDGE 100V 12DFN

HIP2100IR4ZT规格参数

参数名称属性值
Brand NameIntersil
是否Rohs认证符合
厂商名称Renesas(瑞萨电子)
零件包装代码DFN, QFN, SOIC
包装说明HVSON, SOLCC12,.12,20
针数12, 16, 8
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time1 week
高边驱动器YES
接口集成电路类型HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码S-PDSO-N12
JESD-609代码e3
长度4 mm
湿度敏感等级3
功能数量1
端子数量12
最高工作温度125 °C
最低工作温度-40 °C
标称输出峰值电流2 A
封装主体材料PLASTIC/EPOXY
封装代码HVSON
封装等效代码SOLCC12,.12,20
封装形状SQUARE
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源12 V
认证状态Not Qualified
座面最大高度0.9 mm
最大供电电压14 V
最小供电电压9 V
标称供电电压12 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn) - annealed
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
断开时间0.045 µs
接通时间0.045 µs
宽度4 mm
Base Number Matches1

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DATASHEET
HIP2100
100V/2A Peak, Low Cost, High Frequency Half Bridge Driver
The HIP2100 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. The low-side and
high-side gate drivers are independently controlled and
matched to 8ns. This gives the user maximum flexibility in
dead-time selection and driver protocol. Undervoltage
protection on both the low-side and high-side supplies force
the outputs low. An on-chip diode eliminates the discrete
diode required with other driver ICs. A new level-shifter
topology yields the low-power benefits of pulsed operation
with the safety of DC operation. Unlike some competitors,
the high-side output returns to its correct state after a
momentary undervoltage of the high-side supply.
FN4022
Rev 15.00
August 31, 2015
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1 Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
• 3 Driver Output Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package Footprint, which Improves
PCB Efficiency and has a Thinner Profile
-
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC/DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
Ordering Information
PART NUMBER
(Note 1)
HIP2100IB
(No longer available,
recommended replacements: HIP2100IBZ, HIP2100IBZT)
HIP2100IBZ (Note 2)
HIP2100EIBZ (Note 2)
HIP2100IRZ (Note 2)
HIP2100IR4Z (Note 2)
(No longer available,
recommended replacements: HIP2100IRZ, HIP2100IRZT)
NOTES:
1. Add “T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
PART
MARKING
2100 IB
2100 IBZ
2100 EIBZ
HIP 2100IRZ
21 00IR4Z
TEMP. RANGE
(°C)
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
PACKAGE
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld EPSOIC (Pb-free)
16 Ld 5x5 QFN (Pb-free)
12 Ld 4x4 DFN (Pb-free)
PKG.
DWG. #
M8.15
M8.15
M8.15C
L16.5x5
L12.4x4A
FN4022 Rev 15.00
August 31, 2015
Page 1 of 13

 
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