HI5767
NOT RECOMMENDED FOR NEW DESIGNS
NO RECOMMENDED REPLACEMENT
contact our Technical Support Center at
1-888-INTERSIL or www.intersil.com/tsc
DATASHEET
FN4319
Rev 6.00
March 30, 2005
10-Bit, 20/40/60MSPS A/D Converter with Internal Voltage Reference
The HI5767 is a monolithic, 10-bit, analog-to-digital
converter fabricated in a CMOS process. It is designed for
high speed applications where wide bandwidth and low
power consumption are essential. Its high sample clock
rate is made possible by a fully differential pipelined
architecture with both an internal sample and hold and
internal band-gap voltage reference.
The 250MHz Full Power Input Bandwidth and superior high
frequency performance of the HI5767 converter make it an
excellent choice for implementing Digital IF architectures in
communications applications.
The HI5767 has excellent dynamic performance while
consuming only 310mW power at 40MSPS. Data output
latches are provided which present valid data to the output
bus with a latency of 7 clock cycles.
The HI5767 is offered in 20MSPS, 40MSPS and 60MSPS
sampling rates.
Features
• Sampling Rate . . . . . . . . . . . . . . . . . . . . . . 20/40/60MSPS
• 8.8 Bits at f
IN
= 10MHz, f
S
= 40MSPS
• Low Power at 40MSPS . . . . . . . . . . . . . . . . . . . . .310mW
• Wide Full Power Input Bandwidth . . . . . . . . . . . . 250MHz
• On-Chip Sample and Hold
• Internal 2.5V Band-Gap Voltage Reference
• Fully Differential or Single-Ended Analog Input
• Single Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . .+5V
• TTL/CMOS Compatible Digital Inputs
• CMOS Compatible Digital Outputs. . . . . . . . . . . 3.0V/5.0V
• Offset Binary or Two’s Complement Output Format
• Pb-Free Available (RoHS Compliant)
Applications
Pinout
HI5767 (SOIC, SSOP)
TOP VIEW
DV
CC1
1
DGND 2
DV
CC1
3
DGND 4
AV
CC
5
AGND 6
V
REFIN
7
V
REFOUT
8
V
IN
+ 9
V
IN
- 10
V
DC
11
AGND 12
AV
CC
13
OE 14
28 D0
27 D1
26 D2
25 D3
24 D4
23 DV
CC2
22 CLK
21 DGND
20 D5
19 D6
18 D7
17 D8
16 D9
15 DFS
• Digital Communication Systems
• QAM Demodulators
• Professional Video Digitizing
• Medical Imaging
• High Speed Data Acquisition
FN4319 Rev 6.00
March 30, 2005
Page 1 of 15
HI5767
Ordering Information
PART
NUMBER
HI5767/2CB
HI5767/2CBZ
(See Note)
HI5767/4CB*
HI5767/4CBZ*
(See Note)
HI5767/6CB*
HI5767/6CBZ*
(See Note)
HI5767/6IB
HI5767/6IBZ
(See Note)
HI5767/2CA
HI5767/2CAZ
(See Note)
HI5767/2IA
HI5767/2IAZ
(See Note)
HI5767/4CA
HI5767/4CAZ
(See Note)
HI5767/6CA
HI5767/6CAZ
(See Note)
HI5767EVAL1
HI5767EVAL2
TEMP.
RANGE
(
o
C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
PACKAGE
28 Ld SOIC
28 Ld SOIC
(Pb-free)
28 Ld SOIC
28 Ld SOIC
(Pb-free)
28 Ld SOIC
28 Ld SOIC
(Pb-free)
SAMPLING
RATE
PKG.
DWG. # (MSPS)
M28.3
M28.3
M28.3
M28.3
M28.3
M28.3
M28.3
M28.3
M28.15
M28.15
M28.15
M28.15
M28.15
M28.15
M28.15
M28.15
20
20
40
40
60
60
60
60
20
20
20
20
40
40
60
60
60
60
-40 to 85 28 Ld SOIC
-40 to 85 28 Ld SOIC
(Pb-free)
0 to 70
0 to 70
28 Ld SSOP
28 Ld SSOP
(Pb-free)
-40 to 85 28 Ld SSOP
-40 to 85 28 Ld SSOP
(Pb-free)
0 to 70
0 to 70
0 to 70
0 to 70
25
25
28 Ld SSOP
28 Ld SSOP
(Pb-free)
28 Ld SSOP
28 Ld SSOP
(Pb-free)
Evaluation Board
Evaluation Board
* Add “-T” suffix for tape and reel.
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
FN4319 Rev 6.00
March 30, 2005
Page 2 of 15
HI5767
Functional Block Diagram
V
DC
V
IN
-
V
IN
+
S/H
REFERENCE
V
REFOUT
V
REFIN
BIAS
CLOCK
CLK
STAGE 1
DFS
2-BIT
FLASH
2-BIT
DAC
OE
+
-
DV
CC2
X2
D9 (MSB)
D8
D7
D6
STAGE 8
DIGITAL DELAY
AND
DIGITAL ERROR
CORRECTION
D5
D4
D3
2-BIT
FLASH
2-BIT
DAC
D2
D1
+
D0 (LSB)
-
X2
DGND2
STAGE 9
2-BIT
FLASH
AV
CC
AGND
DV
CC1
DGND1
FN4319 Rev 6.00
March 30, 2005
Page 3 of 15
HI5767
Typical Application Schematic
HI5767
V
REFIN
(7)
V
REFOUT
(8)
(LSB) (28) D0
(27) D1
AGND (12)
AGND (6)
DGND1 (2)
DGND1 (4)
DGND2 (21)
(26) D2
(25) D3
(24) D4
(20) D5
(19) D6
(18) D7
(17) D8
(MSB) (16) D9
V
IN
+
V
IN
+ (9)
V
DC
(11)
V
IN
-
V
IN
- (10)
(1) DV
CC1
(3) DV
CC1
(23) DV
CC2
0.1F
CLOCK
CLK (22)
DFS (15)
OE (14)
(13) AV
CC
(5) AV
CC
0.1F
+
10F
+5V
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
10F AND 0.1F CAPS
ARE PLACED AS CLOSE
TO PART AS POSSIBLE
+
10F
+5V
DGND
AGND
BNC
0.1F
Pin Descriptions
PIN NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NAME
DV
CC1
DGND1
DV
CC1
DGND1
AV
CC
AGND
V
REFIN
V
REFOUT
V
IN
+
V
IN
-
V
DC
AGND
AV
CC
OE
DESCRIPTION
Digital Supply (+5.0V)
Digital Ground
Digital Supply (+5.0V)
Digital Ground
Analog Supply (+5.0V)
Analog Ground
+2.5V Reference Voltage Input
+2.5V Reference Voltage Output
Positive Analog Input
Negative Analog Input
DC Bias Voltage Output
Analog Ground
Analog Supply (+5.0V)
Digital Output Enable Control Input
PIN NO.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
NAME
DFS
D9
D8
D7
D6
D5
DGND2
CLK
DV
CC2
D4
D3
D2
D1
D0
DESCRIPTION
Data Format Select Input
Data Bit 9 Output (MSB)
Data Bit 8 Output
Data Bit 7 Output
Data Bit 6 Output
Data Bit 5 Output
Digital Ground
Sample Clock Input
Digital Output Supply (+3.0V or +5.0V)
Data Bit 4 Output
Data Bit 3 Output
Data Bit 2 Output
Data Bit 1 Output
Data Bit 0 Output (LSB)
FN4319 Rev 6.00
March 30, 2005
Page 4 of 15
HI5767
Absolute Maximum Ratings
T
A
= 25
o
C
Supply Voltage, AV
CC
or DV
CC
to AGND or DGND . . . . . . . . . . .6V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V
Digital I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND to DV
CC
Analog I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND to AV
CC
Thermal Information
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
Operating Conditions
Temperature Range
HI5767/xCx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
HI5767/xIx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
o
C
Maximum Storage Temperature Range
. . . . . . . . . -
65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
AV
CC
= DV
CC1
= 5.0V, DV
CC2
= 3.0V; V
REFIN
= V
REFOUT
; f
S
= 40MSPS at 50% Duty Cycle;
C
L
= 10pF; T
A
= 25
o
C; Differential Analog Input; Typical Values are Test Results at 25
o
C,
Unless Otherwise Specified
TEST CONDITIONS
MIN
TYP
MAX
UNITS
PARAMETER
ACCURACY
Resolution
Integral Linearity Error, INL
Differential Linearity Error, DNL
(Guaranteed No Missing Codes)
Offset Error, V
OS
Full Scale Error, FSE
DYNAMIC CHARACTERISTICS
Minimum Conversion Rate
Maximum Conversion Rate
HI5767/2
HI5767/4
HI5767/6
Effective Number of Bits, ENOB
HI5767/2
HI5767/4
HI5767/6
Signal to Noise and Distortion Ratio, SINAD
RMS Signal
= -------------------------------------------------------------
-
RMS Noise + Distortion
HI5767/2
HI5767/4
HI5767/6
Signal to Noise Ratio, SNR
RMS Signal
= ------------------------------
-
RMS Noise
HI5767/2
HI5767/4
HI5767/6
Total Harmonic Distortion, THD
HI5767/2
10
f
IN
= 1MHz Sinewave
f
IN
= 1MHz Sinewave
f
IN
= DC
f
IN
= DC
No Missing Codes
No Missing Codes
No Missing Codes
No Missing Codes
f
S
= 20MSPS, f
IN
= 10MHz
f
S
= 40MSPS, f
IN
= 10MHz
f
S
= 60MSPS, f
IN
= 10MHz
-
-
-40
-
-
0.75
0.35
-
4
-
1.75
1.0
40
-
Bits
LSB
LSB
LSB
LSB
-
20
40
60
8.7
8.55
8.1
0.5
-
-
-
9
8.8
8.4
1
-
-
-
-
-
-
MSPS
MSPS
MSPS
MSPS
Bits
Bits
Bits
f
S
= 20MSPS, f
IN
= 10MHz
f
S
= 40MSPS, f
IN
= 10MHz
f
S
= 60MSPS, f
IN
= 10MHz
-
-
-
55.9
54.7
53.8
-
-
-
dB
dB
dB
f
S
= 20MSPS, f
IN
= 10MHz
f
S
= 40MSPS, f
IN
= 10MHz
f
S
= 60MSPS, f
IN
= 10MHz
f
S
= 20MSPS, f
IN
= 10MHz
-
-
-
-
55.9
55
54
-71
-
-
-
-
dB
dB
dB
dBc
FN4319 Rev 6.00
March 30, 2005
Page 5 of 15
嵌入式系统
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