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MM74HC259SJX

产品描述IC DCDR/3:8L LATCH 8BIT 16-SOP
产品类别逻辑    逻辑   
文件大小75KB,共7页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
下载文档 详细参数 选型对比 全文预览

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MM74HC259SJX概述

IC DCDR/3:8L LATCH 8BIT 16-SOP

MM74HC259SJX规格参数

参数名称属性值
是否Rohs认证符合
厂商名称ON Semiconductor(安森美)
包装说明SOP,
Reach Compliance Codecompliant
其他特性1:8 DMUX FOLLOWED BY LATCH
系列HC/UH
JESD-30 代码R-PDSO-G16
JESD-609代码e3
长度10.1 mm
逻辑集成电路类型D LATCH
湿度敏感等级1
位数1
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
传播延迟(tpd)250 ns
认证状态Not Qualified
座面最大高度2.1 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型LOW LEVEL
宽度5.3 mm

文档预览

下载PDF文档
MM74HC259 8-Bit Addressable Latch/3-to-8 Line Decoder
September 1983
Revised February 1999
MM74HC259
8-Bit Addressable Latch/3-to-8 Line Decoder
General Description
The MM74HC259 device utilizes advanced silicon-gate
CMOS technology to implement an 8-bit addressable latch,
designed for general purpose storage applications in digital
systems.
The MM74HC259 has a single data input (D), 8 latch out-
puts (Q1–Q8), 3 address inputs (A, B, and C), a common
enable input (G), and a common CLEAR input. To operate
this device as an addressable latch, data is held on the D
input, and the address of the latch into which the data is to
be entered is held on the A, B, and C inputs. When
ENABLE is taken LOW the data flows through to the
addressed output. The data is stored when ENABLE transi-
tions from LOW-to-HIGH. All unaddressed latches will
remain unaffected. With enable in the HIGH state the
device is deselected, and all latches remain in their previ-
ous state, unaffected by changes on the data or address
inputs. To eliminate the possibility of entering erroneous
data into the latches, the enable should be held HIGH
(inactive) while the address lines are changing.
If enable is held HIGH and CLEAR is taken LOW all eight
latches are cleared to a LOW state. If enable is LOW all
latches except the addressed latch will be cleared. The
addressed latch will instead follow the D input, effectively
implementing a 3-to-8 line decoder.
All inputs are protected from damage due to static dis-
charge by diodes to V
CC
and ground.
Features
s
Typical propagation delay: 18 ns
s
Wide supply range: 2–6V
s
Low input current: 1
µA
maximum
s
Low quiescent current: 80
µA
maximum (74HC Series)
Ordering Code:
Order Number
MM74HC259M
MM74HC259SJ
MM74HC259MTC
MM74HC259N
Package Number Package Description
M16A
M16D
MTC16
N16E
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Latch Selection Table
Select Inputs
C
L
L
L
L
H
H
H
H
B
L
L
H
H
L
L
H
H
A
L
H
L
H
L
H
L
H
Latch
Addressed
0
1
2
3
4
5
6
7
Top View
H
=
HIGH level, L
=
LOW level
D
=
the level at the data input
Q
i0
the level of Q
i
(i
=
0, 1 ...7, as appropriate)
before the indicated steady-state input
conditions were established.
© 1999 Fairchild Semiconductor Corporation
DS005006.prf
www.fairchildsemi.com

MM74HC259SJX相似产品对比

MM74HC259SJX MM74HC259MTC MM74HC259SJ MM74HC259N MM74HC259MX MM74HC259M
描述 IC DCDR/3:8L LATCH 8BIT 16-SOP IC DCDR/3:8L LATCH 8BIT 16-TSSOP IC DCDR/3:8L LATCH 8BIT 16-SOP IC LATCH ADDRESS 8BIT 16-DIP IC DCDR/3:8L LATCH 8BIT 16-SOIC IC LATCH ADDRESS 8BIT 16-SOIC
逻辑类型 - D 型,可寻址 D 型,可寻址 D 型,可寻址 D 型,可寻址 D 型,可寻址
电路 - 1:8 1:8 1:8 1:8 1:8
输出类型 - 标准 标准 标准 标准 标准
电压 - 电源 - 2 V ~ 6 V 2 V ~ 6 V 2 V ~ 6 V 2 V ~ 6 V 2 V ~ 6 V
独立电路 - 1 1 1 1 1
延迟时间 - 传播 - 17ns 17ns 17ns 17ns 17ns
电流 - 输出高,低 - 5.2mA,5.2mA 5.2mA,5.2mA 5.2mA,5.2mA 5.2mA,5.2mA 5.2mA,5.2mA
工作温度 - -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
安装类型 - 表面贴装 表面贴装 通孔 表面贴装 表面贴装
封装/外壳 - 16-TSSOP(0.173",4.40mm 宽) 16-SOIC(0.209",5.30mm 宽) 16-DIP(0.300",7.62mm) 16-SOIC(0.154",3.90mm 宽) 16-SOIC(0.154",3.90mm 宽)
供应商器件封装 - 16-TSSOP 16-SOP 16-DIP 16-SOIC 16-SOIC

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