Si7057/8/9-A10
D
IGITA L
I
2
C T
EMPERATURE
S
ENSOR
Features
High Accuracy Temperature
Sensor
Si7057:
Low Power Consumption
50
nA, standby current
2
–40 to +125 °C operating range
Pin-selectable I C addresses
2x2 mm QFN package
Low Voltage Operation (1.8 V)
Excellent long term stability
14-bit resolution
±0.35 °C (max), 0 to 70 °C
Factory-calibrated
Si7058: ±0.5 °C (max), 0 to 70 °C
2
I C Interface
Si7059: ±1.0 °C (max), 0 to 70 °C
Applications
Mobile smartphones and tablets
Consumer electronics
HVAC/R
White goods
Asset and goods tracking
Thermostats
Micro-environments/data centers
Indoor weather stations
Ordering Information:
See page 17.
Pin Assignments
Description
The Si7057/8/9 I
2
C Temperature Sensors are monolithic CMOS ICs that
integrate temperature sensor elements, an analog-to-digital converter,
signal processing, calibration data, and an I
2
C interface.
The temperature sensors are factory-calibrated and the calibration data is
stored in the on-chip non-volatile memory. This ensures that the sensors
are fully interchangeable, with no calibration or software changes
required.
The Si7057/8/9 devices are available in a 2x2 mm DFN package and are
reflow solderable. The Si7057/8/9 sensors offer an accurate, low-power,
factory-calibrated digital solution ideal for measuring temperature in
applications ranging from HVAC/R and asset tracking to industrial and
consumer platforms.
VDD
1
DNC
6
5
GND
SCL
2
3
4
SDA
ADD
Top View
Patent Protected. Patents pending
Rev. 1.1 4/17
Copyright © 2017 by Silicon Laboratories
Si7057/8/9-A10
Si7057/8/9-A10
Functional Block Diagram
Vdd
Si705x
1.25V
Ref
Calibration
Memory
Temp
Sensor
ADC
Control Logic
I
2
C Interface
SDA
SCL
GND
ADD
2
Rev. 1.1
Si7057/8/9-A10
T
ABLE O F
C
ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2. Measuring Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.4. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
6. Pin Descriptions: Si7057/8/9 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1. Package Outline: 2x2 6-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
10.1. Si7057/8/9 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
11. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Rev. 1.1
3
Si7057/8/9-A10
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter
Power Supply
Operating Temperature
Symbol
V
DD
T
A
Test Condition
Min
1.67
–40
Typ
—
—
Max
1.98
+125
Unit
V
°C
Table 2. General Specifications
Parameter
Input Voltage High
Input Voltage Low
Input Voltage Range
Symbol
V
IH
VIL
VIN
1.67
V
DD
1.98 V; T
A
= –40 to +125 °C unless otherwise noted.
Test Condition
ADD, SCL, SDA pins
ADD, SCL, SDA pins
SCL, SDA pins with respect to GND
ADD pin with respect to GND
Min
0.7xVDD
—
0.0
0.0
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
—
—
245
106
0.05
0.05
4
3.5
11.6
Max
—
0.3xVDD
VDD+2
VDD+0.3
1
0.4
288
145
0.56
5.2
5.1
4
17
Unit
V
V
V
V
μA
V
μA
μA
μA
μA
mA
mA
µA
Input Leakage
Output Voltage Low
Current Consumption
IIL
VOL
I
DD
ADD, SCL, SDA pins
SDA pin; IOL = 1.5 mA
Normal Mode, Temperature conver-
sion in progress, first step
1
Normal Mode, Temperature conver-
sion in progress, second step
1
Standby, –40 to +85 °C
2
Standby, –40 to +125 °C
2
Peak IDD during powerup
3
Peak IDD during I
2
C operations
4
After writing to user registers
5
Notes:
1.
Total conversion time is first-step time plus second-step time.
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100
μs
when I
2
C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
4
Rev. 1.1
Si7057/8/9-A10
Table 2. General Specifications (Continued)
Parameter
Conversion Time
1
Symbol
t
CONV
1.67
V
DD
1.98 V; T
A
= –40 to +125 °C unless otherwise noted.
Test Condition
Normal Mode,
Temperature conversion first step
Fast Mode,
Temperature conversion first step
Normal or Fast Mode,
Temperature conversion second step
Min
Typ
3.7
0.9
2.5
Max
6
1.5
4.0
15
50
2.0
Unit
ms
ms
ms
ms
ms
ms
Powerup Time
t
PU
From VDD
≥
1.67 V to ready for a
conversion, 25 °C
From VDD
≥
1.67 V to ready for a
conversion, full temperature range
After issuing a software reset
command
—
—
—
10
—
1.2
Notes:
1.
Total conversion time is first-step time plus second-step time.
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100
μs
when I
2
C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
Rev. 1.1
5
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