MX555ABB850M000
Ultra-Low Jitter 850MHz LVDS XO
ClockWorks® FUSION
General Description
The MX555ABB850M000 is an ultra-low phase jitter
XO with LVDS output optimized for high line rate
applications.
Features
• 850MHz LVDS
• Typical phase noise:
- 100fs (Integration range: 1.875MHz-20MHz)
• ±50ppm total frequency stability
• -40°C to +85°C temperature range
• Industry standard 6-Pin 5mm x 3.2mm LGA
package
Absolute Maximum Ratings¹
Supply Voltage (VIN)..................................................+4.6V
Lead Temperature (soldering, 10s)..............................260°C
Case Temperature........................................................115°C
Storage Temperature (T )............................-65°C to +125°C
S
ESD Machine Model.....................................................200V
ESD Rating (HBM).........................................................2kV
Operating Ratings²
Supply Voltage (VIN).......................+2.375V to +3.63V
Ambient Temperature (TA)....................-40°C to +85°C
Junction Thermal Resistance
LGA (T ) Still Air.....................................58°C/W
JA
Electrical Characteristics
VDD = 2.375 - 3.63V, TA = -40°C to +85°C, outputs terminated with 100 Ohms between Q and /Q.³
Symbol
IDD
F0
Parameter
Supply Current
Center Frequency
Frequency Stability
Øj
Tstart
TR/TF
Phase Noise
Start-Up Time
Rise/Fall time
Duty Cycle
VOH
VOL
VOD
VCM
Output High Voltage
VOH max = VCM max + 1/2 VOD max
Output Low Voltage
VOL min = VCM min - 1/2 VOD max
Output Differential Voltage
Common Mode Output Voltage
LVDS output levels
LVDS output levels
100
45
1.248
0.898
247
1.125
1.375
1.025
350
1.2
Note 4
Integration Range (12kHz to 20MHz)
Integration Range (1.875MHz to 20MHz)
220
100
20
400
55
1.602
1.252
454
1.375
850
±50
Condition
Min.
Typ.
Max.
90
Units
mA
MHz
ppm
fsRMS
ms
ps
%
V
V
mV
V
Notes:
1. Exceeding the absolute maximum ratings may damage the device.
2. The device is not guaranteed to function outside its operating ratings.
3. Guaranteed after thermal equilibrium.
4. Inclusive of initial accuracy, temperature drift, aging, shock, vibration.
ClockWorks is a registered trademark of Microchip Technology Inc.
Microchip Technology Inc.
http://www.microchip.com
September 27, 2017
MX555AB1-5713
Revision 1.0
tcghelp@microchip.com
Microchip Technology Inc.
MX555ABB850M000
Ordering Information
Ordering Part Number
MX555ABB850M000
MX555ABB850M000-TR
Marking Line 1
MX555A
MX555A
Marking Line 3
BB8500
BB8500
Shipping
Tube
Tape and Reel
Package
6-Pin 5mm x 3.2mm LGA
6-Pin 5mm x 3.2mm LGA
Devices are Green and RoHS compliant. Sample material may have only a partial top mark.
Pin Configuration
OE
VDD
DNC
/Q
GND
Q
Pin Description
Pin Number
1
2
3
4, 5
6
Pin Name
OE
DNC
GND
Q, /Q
VDD
PWR
O, Diff
PWR
LVDS
Pin Type
I, SE
Pin Level
LVCMOS
Pin Function
Output Enable, disables output to tri-state,
0 = Disabled, 1 = Enabled, 50k Ohms Pull-Up
Make no connection, leave floating.
Power Supply Ground
Clock Output Frequency = 850MHz
Power Supply
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition C
MIL-STD-883, Method 2007, Condition B
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
September 27, 2017
MX555AB1-5713
2
Revision 1.0
tcghelp@microchip.com
Microchip Technology Inc.
MX555ABB850M000
Package Information and Recommended Land Pattern for 6-Pin LGA³
6-Pin LGA (5x3.2mm)
Note:
3. Package information is correct as of the publication date. For updates and most current information, go to
www.microchip.com.
Microchip Technology Inc.
http://www.microchip.com
Microchip makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
information is not intended as a warranty and Microchip does not assume responsibility for its use. Microchip reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in Microchip's terms and conditions of sale for such products, Microchip
assumes no liability whatsoever, and Microchip disclaims any express or implied warranty relating to the sale and/or use of Microchip products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right.
© 2017 Microchip Technology Inc.
September 27, 2017
MX555AB1-5713
3
Revision 1.0
tcghelp@microchip.com
单片机
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
