电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HQDP-080-40.00-STR-SED-1

产品描述Interconnection Device, ROHS COMPLIANT
产品类别连接器   
文件大小784KB,共6页
制造商SAMTEC
官网地址http://www.samtec.com/
标准  
下载文档 详细参数 全文预览

HQDP-080-40.00-STR-SED-1概述

Interconnection Device, ROHS COMPLIANT

HQDP-080-40.00-STR-SED-1规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
Is SamacsysN
连接器类型INTERCONNECTION DEVICE
Base Number Matches1

文档预览

下载PDF文档
REVISION G
TABLE 4
END TO END
DV TO DV
DV TO EM (-TEX)
DV TO EM (-SEX)
EM (-TEX) TO EM (-TEX)
EM (-TEX) TO EM (-SEX)
EM (-SEX) TO EM (-SEX)
DV-N TO DV-N
DV-N TO EM-N (-TEX)
DV-N TO EM-N (-SEX)
"L"
1.150[28.21]
1.065[27.05]
1.036[26.31]
.980[24.89]
.951[24.16]
.922[23.42]
1.050[26.67]
1.015[25.78]
.986[25.04]
FIG. 1
VERTICAL
(HQDP-040-XX.XX-STR-STR-1 SHOWN)
HQDP-XXX-XX.XX-XXX-XXX-X-X
No OF POSITIONS
-020, -040, -060, -080
(PER ROW)
LENGTH
-XX.XX (INCHES)
(3.75[95.3] MIN -
40.00[1016.0] MAX)
(SEE NOTE 2)
FIRST END
-TTR: TERMINAL, TOP, RIGHT
-TTL: TERMINAL, TOP, LEFT
-TBR: TERMINAL, BOTTOM, RIGHT
-TBL: TERMINAL, BOTTOM, LEFT
-STR: SOCKET, TOP, RIGHT
-STL: SOCKET, TOP, LEFT
-SBR: SOCKET, BOTTOM, RIGHT
-SBL: SOCKET, BOTTOM, LEFT
(SEE TABLE 1 & SHEET 2)
-TEU: TERMINAL, EDGE MOUNT, UP
-TED: TERMINAL, EDGE MOUNT, DOWN
-SEU: SOCKET, EDGE MOUNT, UP
-SED: SOCKET, EDGE MOUNT, DOWN
(SEE TABLE 5 & SHEET 4)
END OPTION
-F: SCREW OPTION FIRST END ONLY
-S: SCREW OPTION SECOND END ONLY
-B: SCREW OPTION BOTH ENDS
-N: NO CAPS
(SEE FIG. 3, SHEET 5 FOR EDGE MOUNT
END OPTIONS)
(SEE FIG. 4, SHEET 5 FOR DOUBLE
VERTICAL END OPTIONS)
(SEE FIG. 5, SHEET 5 FOR NO CAPS OPTIONS)
(LEAVE BLANK FOR STANDARD CAPS
BOTH ENDS)
WIRING OPTION
-1: PIN 1 TO PIN 1
-2: PIN 1 TO PIN 2
-3: PIN 1 TO PIN N-1
-4: PIN 1 TO PIN N
(SEE TABLE 9, SHEET 6)
SECOND END
-TTR: TERMINAL, TOP, RIGHT
-TTL: TERMINAL, TOP, LEFT
-TBR: TERMINAL, BOTTOM, RIGHT
-TBL: TERMINAL, BOTTOM, LEFT
-STR: SOCKET, TOP, RIGHT
-STL: SOCKET, TOP, LEFT
-SBR: SOCKET, BOTTOM, RIGHT
-SBL: SOCKET, BOTTOM, LEFT
(SEE TABLE 1 & SHEET 3)
-TEU: TERMINAL, EDGE MOUNT, UP
-TED: TERMINAL, EDGE MOUNT, DOWN
-SEU: SOCKET, EDGE MOUNT, UP
-SED: SOCKET, EDGE MOUNT, DOWN
(SEE TABLE 5 & SHEET 4)
C1
DO NOT
SCALE FROM
THIS PRINT
LENGTH: XX.XX + "L" REF (SEE TABLE 4)
LENGTH: XX.XX .050[1.27]
02
02
G
SUB-HQDP-X-
XXX-XX-XX
01
"A" REF
(TYP)
'A'
01
"B" REF
(TYP)
SUB-HQDP-X-XXX-XX-XX
N
(SEE TABLE 3)
HDRL-11
(SEE NOTE 5)
STS-01
(TIGHTEN TO 1.4 - 1.7 IN-LBS)
(4 PLCS)
HQDP-XX-01
G
N-1
(SEE TABLE 3)
N-1
(SEE TABLE 3)
N
(SEE TABLE 3)
.875 22.23 REF (TYP)
LENGTH REF
TABLE 3
No. OF
POSITIONS
-020
-040
-060
-080
N
40
80
120
160
N-1
39
79
119
159
.665 16.89 REF (TYP)
.248 6.30 REF (TYP)
FIRST END
SECOND END
G
DETAIL 'A'
SCALE 2.5 : 1
* "C" REF
G
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. SUB-TTF LENGTH IS EQUAL TO HQDP LENGTH.
3. ALL ASSEMBLIES TO BE 100% ELECTRICALLY TESTED
FOR SHORTS AND OPENS.
4. ALL ASSEMBLIES TO BE 100% HI-POT TESTED AT 300V.
5. TOP SUB-TTF NOT SHOWN IN THIS VIEW FOR CLARITY; HDRL-11
TO BE CENTERED ON LOWER SUB-TTF AS SHOWN; HDRL-11 IS
TO CONTAIN PART NUMBER, SHOP NUMBER, LINE NUMBER &
DATE CODE.
6. PACKAGE ASSEMBLIES IN STATIC DISSIPATIVE BAGS.
7. PARTS TO BE PROCESSED PER SAMTEC ACCEPTABLILITY REQUIREMENTS:
HDR-PI-01 "CABLE ASSEMBLY WORKMANSHIP STANDARDS".
TABLE 1
No. OF
POSITIONS
-020
-040
-060
-080
"A"
1.325[33.66]
2.250[57.15]
3.175[80.65]
4.100[104.14]
"B"
1.128[28.65]
2.053[52.15]
2.978[75.64]
3.903[99.14]
HQDP-XX-01
HQDP-01-01
HQDP-02-01
HQDP-03-01
HQDP-04-01
HQDP-XX-02
HQDP-01-02
HQDP-02-02
HQDP-03-02
HQDP-04-02
QTY OF
SUB-TTF
2
4
6
8
SUB-HQDP-X-XXX-XX-XX
SUB-HQDP-X-020-XX-XX
SUB-HQDP-X-040-XX-XX
SUB-HQDP-X-060-XX-XX
SUB-HQDP-X-080-XX-XX
SUB-TTF-30100-10-XX
(SEE TABLE 1 FOR QTY)
HQDP-XX-02
G
TABLE 2
END
-TXX
-SXX
* "C"
.332[8.43]
.296[7.52]
C2
C3
Pb
THIS PRODUCT MANUFACTURED
WITH LEAD-FREE PROCESSING
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
* -DV END OPTIONS ONLY
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
MATERIAL:
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Ma il: info @SAMTEC.c o m
c o d e: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 1:1
0.5mm HIGH-SPEED TWIN-AX CABLE ASSEMBLY
DWG. NO.
G
F:\DWG\MISC\MKTG\HQDP-XXX-XX.XX-XXX-XXX-X-X-MKT.SLDDRW
HQDP-XXX-XX.XX-XXX-XXX-X-X
BY:
BRATCHER 11/18/03
SHEET
1
OF
6
CC3200LaunchPad改装红外温度计
本帖最后由 Jacktang 于 2019-10-16 15:19 编辑 CC3200LaunchPad,如图,就不多评价了,性能啥的应该还可以,不过8266的性价比大家都懂(尤其是价格),一般玩wifi都玩8266,手里这块CC32 ......
Jacktang 无线连接
实验室仪器仪表使用静电仪器的一般常识
静电仪器通常是在高电压(104V数量级)、微电量(10-6库仑数量级)条件下工作,因此,对绝缘性能的要求很高。可以说,静电实验成败的关键是绝缘问题。绝缘的目的是尽量减少电荷的流散。   ......
ESD技术咨询 工业自动化与控制
安卓培训哪家强?
求大神指点,厦门安卓培训去哪里好?:Cry:...
xmzy123 Linux开发
EEWORLD大学堂----直播回放: ST 意法半导体 资料中心与通讯网路电源管理解决方案
直播回放: ST 意法半导体 资料中心与通讯网路电源管理解决方案:https://training.eeworld.com.cn/course/5832...
hi5 聊聊、笑笑、闹闹
【学习心得】 DLP微型投影技术
DLP微型投影技术 TI的《DLP微型投影业务及技术应用介绍》课程深入浅出的从DPL原理出发,分析了DLP物理结构,光源,驱动电路,微投影的应用,以及TI专用芯片在开发DLP应用方面的用途。课程 ......
louyj TI技术论坛
自定义u-boot启动logo的方法
此文是对早期文章《U-boot开机logo的制作方法》的更新。 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ 如果在uboot中实现了LCD等显示设备的驱动 ......
Wince.Android 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1699  2177  2673  653  1127  52  3  11  22  54 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved