HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx,
HSMS-Cxxx, HSMY-Cxxx,
Surface Mount Chip LEDs
Data Sheet
HSMx-C110/ HSMx-C120/HSMx-C150/HSMx-C170/HSMx-C177/
HSMx-C190/HSMx-C191/HSMx-C197/HSMx-C265
Description
These chip LEDs are designed in an industry standard
package for ease of handling and use. Various different
LED colors are available in nine compact, single color
packages.
The HSMx-C150 has the industry standard 3.2 x 1.6
mm footprint that is excellent for all around use. The
HSMx-C170 has the widely used 2.0 x 1.25 mm foot-print
with 0.8 mm profile. The HSMx-C177 has the widely
used 2.0 x 1.25 mm footprint with 0.4 mm profile. The
HSMx-C19x series has the industry standard 1.6 x 0.8 mm
footprint with varying profile to suit designers needs,
the HSMx-C190 has 0.8 mm profile, the HSMx-C191 has a
low profile of 0.6 mm, and the HSMx-C197 has the ultra
low profile of 0.4 mm. This family with its thin profile and
wide viewing angle makes this LED exceptional for back-
lighting applications.
The HSMx-C110 is a right angle package with the uni-
versally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The
HSMx-C120 is a smaller right angle package with industry
standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse
mount package with dimensions of 3.4 x 1.25 x 1.1 mm.
These devices are ideal for LCD backlighting and side-
lighting applications.
In order to facilitate pick and place operation, these
chip LEDs are shipped in tape and reel with 4000 units
per reel for HSMx-C120, C170, C177, C190, C191, C197
packages, and 3000 units per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with IR reflow solder
processes. The small size and wide viewing angle make
these LEDs prime choices for backlighting applications
and front panel illumination especially where space is a
premium.
Features
Small size
Industry standard footprint
Compatible with IR solder
Diffused optics
Operating temperature range of -40°C to +85°C
Right angle & reverse mount package available
Various colors available
Available in 8 mm tape on 7 in. (178 mm) diameter
reels
Applications
Keypad backlighting
Push-button backlighting
LCD backlighting
Symbol backlighting
Front panel indicator
Absolute Maximum Ratings for GaP at T
A
=25°C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
=100 μA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
C110/150/265
25
65
5
95
-40 to +85
-40 to +85
C120/170/177/190/191/197
20
52
5
95
-40 to +85
-40 to +85
Units
mA
mW
V
°C
°C
°C
See reflow soldering profile (Figure 9 & 10)
Absolute Maximum Ratings for AlGaAs at T
A
=25°C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
=100μA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
C110/150
30
78
5
95
-40 to +85
-40 to +85
C120/170/190/191/265
25
65
5
95
-40 to +85
-40 to +85
Units
mA
mW
V
°C
°C
°C
See reflow soldering profile (Figure 9 & 10)
Note:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
Electrical Characteristics at T
A
=25°C
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Typ.
Max.
2.1
2.6
Part Number
Color
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100 μA
Min.
5
Capacitance
C(pF),
@ V
F
= 0 V,
f = 1 MHz
Typ.
5
Thermal
Resistance
R
J-P
(°C/W)
Typ.
400
350
250
400
350
250
400
250
400
350
250
460
400
300
HSMS-C110/150
HSMS-C120
HSMS-C170/177/190/191/197
HSMD-C110/150
HSMD-C120
HSMD-C170/177/190/191/197
HSMY-C110/150
HSMY-C170/177/190/191/197
HSMG-C110/150
HSMG-C120
HSMG-C170/177/190191/197/265
HSMH-C110/150
HSMH-C120
HSMH-C170/190/191/265
HER
Orange
2.2
2.6
5
7
Yellow
Green
2.1
2.2
2.6
2.6
5
5
6
9
AlGaAs
1.8
2.6
5
18
5
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