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MX25U6435FM2I-10G: 产品描述IC FLASH 64M SPI 104MHZ 8SOP; 产品类别存储存储; 文件大小1MB，共92页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX25U6435FM2I-10G概述

IC FLASH 64M SPI 104MHZ 8SOP

MX25U6435FM2I-10G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	SOIC
包装说明	SOP, SOP8,.3
针数	8
Reach Compliance Code	unknown
Factory Lead Time	16 weeks
其他特性	CAN BE ORGANISED AS 64 MBIT X 1
备用内存宽度	2
最大时钟频率 (fCLK)	104 MHz
数据保留时间-最小值	10
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e3
长度	5.28 mm
内存密度	67108864 bit
内存集成电路类型	FLASH
内存宽度	4
湿度敏感等级	3
功能数量	1
端子数量	8
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	16MX4
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	1.8 V
编程电压	1.8 V
认证状态	Not Qualified
座面最大高度	2.16 mm
串行总线类型	SPI
最大待机电流	0.00002 A
最大压摆率	0.025 mA
最大供电电压 (Vsup)	2 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
类型	NOR TYPE
宽度	5.23 mm
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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MX25U6435F

DATASHEET

P/N: PM1978

REV. 1.5, August 04, 2016

MX25U6435F

Contents

1. FEATURES .............................................................................................................................................................. 4

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Additional Feature..........................................................................................................................7

3. PIN CONFIGURATIONS ......................................................................................................................................... 8

4. PIN DESCRIPTION .................................................................................................................................................. 8

5. BLOCK DIAGRAM................................................................................................................................................... 9

6. DATA PROTECTION.............................................................................................................................................. 10

Table 2. Protected Area Sizes ................................................................................................................... 11

Table 3. 4K-bit Secured OTP Definition

....................................................................................................12

7. MEMORY ORGANIZATION ................................................................................................................................... 13

Table 4. Memory Organization ..................................................................................................................13

8. DEVICE OPERATION ............................................................................................................................................ 14

8-1. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 16

9. COMMAND DESCRIPTION ................................................................................................................................... 17

9-1.

9-2.

9-3.

9-4.

9-5.

9-6.

9-7.

9-8.

9-9.

9-10.

9-11.

9-12.

9-13.

9-14.

9-15.

9-16.

9-17.

9-18.

9-19.

9-20.

9-21.

9-22.

9-23.

9-24.

9-25.

P/N: PM1978

Table 5. Command Set..............................................................................................................................17

Write Enable (WREN) .............................................................................................................................. 21

Write Disable (WRDI)............................................................................................................................... 22

Read Identification (RDID)

....................................................................................................................... 23

Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 24

Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 26

QPI ID Read (QPIID) ............................................................................................................................... 27

Table 6. ID Definitions

..............................................................................................................................27

Read Status Register (RDSR) ................................................................................................................. 28

Write Status Register (WRSR)................................................................................................................. 32

Table 7. Protection Modes.........................................................................................................................33

Read Data Bytes (READ) ........................................................................................................................ 36

Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 37

Dual Read Mode (DREAD) ...................................................................................................................... 39

2 x I/O Read Mode (2READ) ................................................................................................................... 40

Quad Read Mode (QREAD) .................................................................................................................... 41

4 x I/O Read Mode (4READ) ................................................................................................................... 42

Burst Read ............................................................................................................................................... 45

Performance Enhance Mode ................................................................................................................... 46

Sector Erase (SE) .................................................................................................................................... 49

Block Erase (BE32K) ............................................................................................................................... 50

Block Erase (BE) ..................................................................................................................................... 51

Chip Erase (CE) ....................................................................................................................................... 52

Page Program (PP) ................................................................................................................................. 53

4 x I/O Page Program (4PP) .................................................................................................................... 55

Deep Power-down (DP) ........................................................................................................................... 56

Enter Secured OTP (ENSO) .................................................................................................................... 57

Exit Secured OTP (EXSO) ....................................................................................................................... 57

REV. 1.5, August 04, 2016

MX25U6435F

9-26. Read Security Register (RDSCUR) ......................................................................................................... 57

Table 8. Security Register Definition

.........................................................................................................58

9-27. Write Security Register (WRSCUR)......................................................................................................... 58

9-28. Write Protection Selection (WPSEL)........................................................................................................ 59

9-29. Single Block Lock/Unlock Protection (SBLK/SBULK) .............................................................................. 62

9-30. Read Block Lock Status (RDBLOCK) ...................................................................................................... 64

9-31. Gang Block Lock/Unlock (GBLK/GBULK) ............................................................................................... 64

9-32. Program/ Erase Suspend/ Resume ......................................................................................................... 65

9-33. Erase Suspend ........................................................................................................................................ 65

9-34. Program Suspend .................................................................................................................................... 65

9-35. Write-Resume .......................................................................................................................................... 67

9-36. No Operation (NOP) ................................................................................................................................ 67

9-37. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 67

9-38. Read SFDP Mode (RDSFDP).................................................................................................................. 69

Table 9. Signature and Parameter Identification Data Values

..................................................................70

Table 10. Parameter Table (0): JEDEC Flash Parameter Tables ..............................................................71

Table 11. Parameter Table (1): Macronix Flash Parameter Tables............................................................73

10. RESET.................................................................................................................................................................. 75

Table 12. Reset Timing..............................................................................................................................75

11. POWER-ON STATE ............................................................................................................................................. 76

12. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 77

Table 13. Absolute Maximum Ratings .......................................................................................................77

Table 14. Capacitance...............................................................................................................................77

Table 15. DC Characteristics.....................................................................................................................79

Table 16. AC Characteristics ....................................................................................................................80

13. OPERATING CONDITIONS ................................................................................................................................. 82

Table 17. Power-Up Timing and VWI Threshold

.......................................................................................84

13-1. Initial Delivery State ................................................................................................................................. 84

14. ERASE AND PROGRAMMING PERFORMANCE .............................................................................................. 85

15. LATCH-UP CHARACTERISTICS ........................................................................................................................ 85

16. ORDERING INFORMATION ................................................................................................................................ 86

17. PART NAME DESCRIPTION ............................................................................................................................... 87

18. PACKAGE INFORMATION .................................................................................................................................. 88

19. REVISION HISTORY ........................................................................................................................................... 91

P/N: PM1978

REV. 1.5, August 04, 2016

MX25U6435FM2I-10G相似产品对比

	MX25U6435FM2I-10G	MX25U6435FZNI-10G	MX25U6435FBBI-10G
描述	IC FLASH 64M SPI 104MHZ 8SOP	IC FLASH 64M SPI 104MHZ 8WSON	IC FLASH 64MBIT
是否Rohs认证	符合	符合	-
厂商名称	Macronix	Macronix	-
零件包装代码	SOIC	QFN	-
包装说明	SOP, SOP8,.3	HVSON, SOLCC8,.25	-
针数	8	8	-
Reach Compliance Code	unknown	unknown	-
Factory Lead Time	16 weeks	16 weeks	-
其他特性	CAN BE ORGANISED AS 64 MBIT X 1	CAN BE ORGANISED AS 64 MBIT X 1	-
备用内存宽度	2	2	-
最大时钟频率 (fCLK)	104 MHz	104 MHz	-
数据保留时间-最小值	10	10	-
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-
JESD-30 代码	R-PDSO-G8	R-PDSO-N8	-
JESD-609代码	e3	e3	-
长度	5.28 mm	6 mm	-
内存密度	67108864 bit	67108864 bit	-
内存集成电路类型	FLASH	FLASH	-
内存宽度	4	4	-
湿度敏感等级	3	3	-
功能数量	1	1	-
端子数量	8	8	-
字数	16777216 words	16777216 words	-
字数代码	16000000	16000000	-
工作模式	SYNCHRONOUS	SYNCHRONOUS	-
最高工作温度	85 °C	85 °C	-
最低工作温度	-40 °C	-40 °C	-
组织	16MX4	16MX4	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	SOP	HVSON	-
封装等效代码	SOP8,.3	SOLCC8,.25	-
封装形状	RECTANGULAR	RECTANGULAR	-
封装形式	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-
并行/串行	SERIAL	SERIAL	-
峰值回流温度（摄氏度）	260	260	-
电源	1.8 V	1.8 V	-
编程电压	1.8 V	1.8 V	-
认证状态	Not Qualified	Not Qualified	-
座面最大高度	2.16 mm	0.8 mm	-
串行总线类型	SPI	SPI	-
最大待机电流	0.00002 A	0.00002 A	-
最大压摆率	0.025 mA	0.025 mA	-
最大供电电压 (Vsup)	2 V	2 V	-
最小供电电压 (Vsup)	1.65 V	1.65 V	-
标称供电电压 (Vsup)	1.8 V	1.8 V	-
表面贴装	YES	YES	-
技术	CMOS	CMOS	-
温度等级	INDUSTRIAL	INDUSTRIAL	-
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	-
端子形式	GULL WING	NO LEAD	-
端子节距	1.27 mm	1.27 mm	-
端子位置	DUAL	DUAL	-
处于峰值回流温度下的最长时间	40	40	-
类型	NOR TYPE	NOR TYPE	-
宽度	5.23 mm	5 mm	-
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-
Base Number Matches	1	1	-

MX25U6435FM2I-10G

MX25U6435FM2I-10G概述

MX25U6435FM2I-10G规格参数

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