NCV7430
Automotive LIN RGB LED
Driver
The NCV7430 is a single−chip RGB driver intended for dedicated
multicolor LED applications. The RGB LED driver contains a LIN
interface (slave) for parametric programming of LED color and intensity.
The device receives instructions through the LIN bus and
subsequently drives the LEDs independently.
The NCV7430 acts as a slave on the LIN bus and the master can
request specific status information (parameter values and error flags).
The LIN address of the NCV7430 can be programmed in the internal
memory of the device.
The NCV7430 is fully compatible with automotive requirements.
PRODUCT FEATURES
LED Driver
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MARKING
DIAGRAM
14
1
SOIC−14
D2 SUFFIX
CASE 751A
14
NCV7430−0
AWLYWWG
1
•
3 Independent LED Current Regulators
•
LED Currents Adjustable with External Resistors
•
Power Dissipation Option with External Ballast Transistor
Controller with One−Time−Programmable Memory (OTP)
•
LED Modulation Controller for 3 LEDs
•
Full LED Calibration Support
♦
♦
♦
NCV7430 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
Internal LED Color Calibration via Matrix Calculation
Intensity Control (linear or logarithmic)
Dimming and Color Transition (linear) Function
with Programmable Transition Time
ANODE
VBIAS
PIN CONNECTIONS
1
2
3
4
LIN
5
GND
6
TST2
7
GND
8
LED3R
9
LED1R
NCV7430
VBB
14
13
LED1C
12
LED2C
11
TST1
10
LED2R
LED3C
LIN Interface
•
•
•
•
•
•
•
•
•
•
LIN Physical Layer according to LIN 2.1/ SAE J2602
OTP−programmable Device Node Number
OTP−programmable Group Address
Diagnostics and Status Information
LIN Bus Short Circuit Protection to Supply and Ground
Overcurrent Detection
Short Circuit Detection to GND and VBB
Open LED Detection
High Temperature Warning and Shutdown
Retry Mode on Error Detection
Protection and Diagnostics
Power Saving
ORDERING INFORMATION
Device
NCV7430D20G
NCV7430D20R2G
Package
SOIC−14
(Pb−Free)
SOIC−14
(Pb−Free)
Shipping
†
55 Units / Tube
3000 / Tape &
Reel
•
Sleep Mode Supply Current 10
mA
•
Compliant with 14 V Automotive Systems
EMI Compatibility
•
LIN Bus Integrated Slope Control
•
EMC Reduced LED Modulation Mode
Quality
•
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free and are RoHS Compliant
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2015
1
June, 2017 − Rev. 10
Publication Order Number:
NCV7430/D
NCV7430
BLOCK DIAGRAM
VBB
LIN
LIN
Communication
and
Programming
Optional Ballast Control
Error
Detection
LEDxC
LEDxR
VBIAS
ANODE
LED1C
LED2C
LED3C
modulator
325 mV
325 mV
325 mV
GND GND LED1R
LED2R
LED3R
Figure 1. Simple Block Diagram
NCV7430
ANODE ERROR
LED1
Analog
Error
Handler
Modulator
LED1C
Vref1
Vref2
OPA
D
Current−reg−
−Fet
ANODE
LIN
BUS
Interface
TST1
Main Control Processor,
Registers
OTP memory
OPEN
ERROR
LED1R
TST2
LED2
LED2C
LED2R
Oscillator
LED3
Vref
Temp
sense
VBIAS
LED3C
Voltage
Regulator
VRef
LED3R
VBB
GND
GND
Figure 2. Detailed Block Diagram
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2
NCV7430
VBAT
C2
Optional
D1
10 nF
MRA4003T3G
C1 100 nF
Optional
VBB
3
2
1
13
NCV7430
VBIAS
470 R1
Q1
ANODE
LED1C
LED2C
NJD2873T4G*
12
LIN bus
C3
LIN
4
11
6
TST1 TST2
5
GND
7
GND
LED3C
14
LED3R
8 LED2R
10
LED1R
9
Figure 3. Typical Application with Ballast Transistor
VBAT
C2
Optional
D1
10 nF
MRA4003T3G
C1
100 nF
3
VBB
2 VBIAS
1
13
NCV7430
12
LIN bus
C3
LIN
4
11
TST1 TST2
6
GND
5
7
GND
LED3C
14
8 LED3R
LED2R
10
LED1R
9
Rsense
Figure 4. Typical Application without Ballast Transistor
NOTES:
C
1
must be close to pins V
BB
and GND
C
2
and C
3
is placed for EMC reasons; value depends on EMC requirements of the application
R1 and Q1 and reverse polarity protection D1 and C2 are optional.
When Q1 is not used, connect VBB to the ANODE pin. VBIAS output is kept open in this case.
Rsense_1, Rsense_2 and Rsense_3 have to be calculated for LED current settings.
“R”, “G”, “B” designators refer to the ON Semiconductor evaluation board software associations.
* For lower power applications, a PZT3904T1G device can be substituted.
RGB LED, OSRAM MULTILED LRTB GVSG or DOMINANT Multi DomiLED D6RTB−PJG
Table 1. OPERATING RANGES
Parameter
V
BB
T
J
Supply voltage
Operating temperature range
Min
+5.5
−40
Max
+18
+125
Unit
V
°C
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ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
R
G
B
Rsense
R
1
G
2
B
3
10 ohm for 30 mA
ANODE
LED1C
R
LED2C
G
B
R
1
G
2
B
3
10 ohm for 30 mA
C4
1 nF
NCV7430
Table 2. PIN FUNCTION DESCRIPTION
(14 LEAD SON Package)
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Label
ANODE
VBIAS
VBB
LIN
GND
TST2
GND
LED3R
LED1R
LED2R
TST1
LED2C
LED1C
LED3C
Anode input for LED fault detection
Bias output for ballast transistor
VBB (14 V) Supply Voltage
LIN−bus connection
Supply GND
Test pin (ground pin)
Supply GND
Current program resistor to ground for LED3C
Current program resistor to ground for LED1C
Current program resistor to ground for LED2C
Test pin (float pin) (Note 1)
Channel 2 regulated current output to LED cathode
Channel 1 regulated current output to LED cathode
Channel 3 regulated current output to LED cathode
Pin Description
1. Floating pin 11 eliminates the possibility of a short to ground of the adjacent pin (LED2C).
Table 3. MAXIMUM RATINGS
Parameter
V
BB
Supply voltage
Supply voltage
Vlin
VVBIAS
IBIAS
VANODE
VLEDC
VLEDR
T
J
Tflw
Bus input voltage (LIN)
Ballast Transistor Drive Voltage Pin (VBIAS)
Ballast Output Drive (VBIAS)
LED Fault Sense Pin (ANODE) voltage
LED Current Pin (LEDxC) voltage (Note 7)
Program Current Pin (LEDxR) voltage (Note 4)
Junction temperature range (Note 5)
Peak Reflow Soldering Temperature: Pb−Free
60 to 150 seconds at 217°C (Note 6)
Min
−0.3
−0.3
−45
−0.3
−
−0.3
−0.3
−0.3
−50
−
Max
+43 (Note 2)
28 (Note 3)
+45
VANODE
10
VBB
VBB
3.6
+175
260 peak
Unit
V
V
V
V
mA
V
V
V
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. For limited time: t < 0.5 s.
3. t < 3 minutes
4. VLEDR cannot exceed VLEDC.
5. The circuit functionality is not fully guaranteed outside operating temperature range.
6. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
7. Capacitive loading on LEDxC pins is limited to < 200 pF for proper functionality.
Table 4. ATTRIBUTES
Characteristics
ESD Capability
(Note 8)
Human Body Model (LIN Pin)
Human Body Model (All Remaining Pins)
Machine Model
Value
>
±
4 kV
>
±
2 kV
>
±
200 V
MSL 2
−55°C to 150°C
100°K/W
53°K/W
Moisture Sensitivity Level (Note 6)
Storage Temperature
Package Thermal Resistance
Junction−to−Ambient (R
qJA
) (2S2P) (Note 9)
Junction−to−Pin (R
yJL
) (Pins 4 & 11)
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
8. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 kW) and MM according to AEC−Q100: EIA−JESD22−A115−A.
9. Simulated conform JEDEC JESD51
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NCV7430
Table 5. ELECTRICAL CHARACTERISTICS
(5.5 V < V
BB
< 18 V, −40°C < T
J
< 125°C, R
sense
= 10
W
TWPROG = TWPROG2 =
0, unless otherwise specified).
Symbol
LED DRIVER
I
LEDmax
I
LEDmaxTotal
I
LEDxC
LED1C
LED2C
LED3C
Single LED current in nor-
mal operation
All LED currents in normal
operation
LED current
V
BB
= 14 V
For individual LED driven
V
BB
= 14 V
For all LEDs driven
Uncalibrated Max ON Duty
Cycle
R
SENSE
= 10
W
R
SENSE
= 100
W
Calibrated
V
BB
= 14 V,
3 mA < I
LEDxC
< 30 mA
R
SENSE
= 10
W
R
SENSE
= 100
W
V
BB
= 14 V
−
−
−
−
32
96
mA
mA
mA
28
2.8
30.5
3.05
32
3.2
%
−1
−3
−
−
−
325
1
3
−
mV
Pin(s)
Characteristic
Conditions
Min
Typ
Max
Unit
I
MSabs
Absolute error on LED
current
V
Vref1
Reference voltage for cur-
rent regulators (High)
state
Reference voltage for cur-
rent regulators (Low) state
V
Vref2
LIN TRANSMITTER
I
bus_off
I
bus_off
I
bus_lim
R
slave
LIN RECEIVER
V
bus_dom
V
bus_rec
V
bus_hys
Vrec_th_wake
LIN
LIN
V
BB
= 14 V
−
20
−
mV
Dominant state, driver off
Recessive state, driver off
Current limitation
Pull−up resistance
V
linbus
= 0 V,
V
BB
= 8 V & 18 V
V
linbus
= V
bat
,
V
BB
= 8 V & 18 V
V
BB
= 8 V & 18 V
V
BB
= 8 V & 18 V
−1
−
40
20
−
−
75
30
−
20
200
47
mA
mA
mA
kW
Receiver dominant state
Receiver recessive state
Receiver hysteresis
LIN wake−up threshold
V
BB
= 8 V & 18 V
V
BB
= 8 V & 18 V
V
BB
= 8 V & 18 V
V
BB
= 8 V & 18 V
0
0.6 * V
BB
0.05 * V
BB
V
BB
− 1.1
−
−
−
−
0.4 * V
BB
V
BB
0.175 * V
BB
V
BB
− 3.3
V
V
V
V
°C
THERMAL WARNING & SHUTDOWN
T
tw
T
twhyst
T
tsd
THERMAL CONTROL
TH_Ired_step
LED Drive Current change
at Thermal Warning
−
−6.25
−
%
per
step
Thermal warning
(Notes 10, 11)
Thermal warning hyster-
esis
Thermal shutdown
(Note 10)
107
−
147
115
10
155
123
−
163
°C
VBIAS OUTPUT
V
bias
VBB SUPPLY
VBB_UV
VBB Undervoltage
for LIN Communication
5.40
5.8
6.0
V
Output voltage
V
BB
= 14 V, I
bias
= 5 mA
7.3
−
8.3
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
10. Parameter guaranteed by trimming in production test.
11. No more than 2000 cumulative hours in life time above Tw.
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