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PA5003.122NLT

产品描述FIXED IND 1.2UH 11A 9.7MOHM SMD
产品类别无源元件    电感器   
文件大小886KB,共5页
制造商Pulse_Electronics_Power
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PA5003.122NLT概述

FIXED IND 1.2UH 11A 9.7MOHM SMD

PA5003.122NLT规格参数

参数名称属性值
厂商名称Pulse_Electronics_Power
Reach Compliance Codecompliant
Factory Lead Time12 weeks 1 day
电感器类型GENERAL PURPOSE INDUCTOR
Base Number Matches1

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SMT Power Inductor
High Current Molded Power Inductor - PA5003.XXXNLT Series
Height:
3.1mm Max
Footprint:
5.7mm x 5.5mm Max
Current Rating:
up to 36Apk
Inductance Range:
0.15uH to 4.7uH
High current, low DCR, and high efficiency
High reliability
Minimized acoustic noise and minimized leakage flux noise
Electrical Specifications @ 25°C - Operating Temperature -40°C to +125°C
Part
Number
PA5003.151NLT
PA5003.161NLT
PA5003.331NLT
PA5003.471NLT
PA5003.561NLT
PA5003.601NLT
PA5003.801NLT
PA5003.821NLT
PA5003.102NLT
PA5003.122NLT
PA5003.152NLT
PA5003.182NLT
PA5003.222NLT
PA5003.332NLT
PA5003.472NLT
Inductance
100KHz, 0.1V
uH±20%
0.15
0.16
0.33
0.47
0.56
0.60
0.80
0.82
1.00
1.20
1.50
1.80
2.20
3.30
4.70
Rated
Current
A
22.20
22.20
19.20
18.40
17.70
17.70
13.10
12.90
12.20
11.00
10.50
10.10
9.70
8.10
5.90
DC
Resistance
TYP.
mΩ
2.10
2.12
3.20
3.75
4.05
4.11
5.14
5.25
6.90
8.80
10.10
11.50
13.20
21.00
33.00
MAX.
mΩ
2.31
2.33
3.52
4.13
4.52
4.52
5.65
5.78
7.60
9.70
11.20
12.70
14.50
23.10
36.30
Saturation
Current
(25C)
A
36
35
28
26
22.2
22.0
20.0
19.7
16.5
15.0
14.0
12.3
10.0
9.5
8.2
Notes:
1. Actual temperature of the component during system operation (ambient plus
temperature rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops ap-
proximately 30% at the stated ambient temperature. This current is determined by
placing the compnent in the specified ambient environment and applying a short
duration pulse current (to eliminate self-heating effect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40½C. Take note that the components’ performanc varies depending
4.
on the system condition. It is suggested that the component be tested at the system
level, to verify the temperature rise of the component during system operation.
The part temperature (ambient+temp rise) should not exceed 125½C under worst
case operating conditions. Circuit design, PCB trace size and thickness, airflow and
other cooling provisions all affect the part temperature. Part temperature should be
verified in the end application.
1
power.pulseelectronics.com
P808. A (02/18)
http://www.power.pulseelectronics.com/contact
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