NVMFD5C470NL
Power MOSFET
40 V, 11.5 mW, 36 A, Dual N−Channel
Features
•
•
•
•
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFD5C470NLWF − Wettable Flank Option for Enhanced Optical
Inspection
•
AEC−Q101 Qualified and PPAP Capable
•
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
qJC
(Notes 1, 2, 3)
Power Dissipation
R
qJC
(Notes 1, 2)
Continuous Drain
Current R
qJA
(Notes 1, 2, 3)
Power Dissipation
R
qJA
(Notes 1 & 2)
Pulsed Drain Current
T
C
= 25°C
Steady
State
T
C
= 100°C
T
C
= 25°C
T
C
= 100°C
T
A
= 25°C
Steady
State
T
A
= 100°C
T
A
= 25°C
T
A
= 100°C
T
A
= 25°C, t
p
= 10
ms
I
DM
T
J
, T
stg
I
S
E
AS
T
L
P
D
I
D
P
D
Symbol
V
DSS
V
GS
I
D
Value
40
±20
36
23
24
12
W
Unit
V
V
A
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V
(BR)DSS
40 V
R
DS(ON)
MAX
11.5 mW @ 10 V
I
D
MAX
36 A
17.8 mW @ 4.5 V
Dual N−Channel
D1
D2
G1
S1
G2
S2
11
8.0
3.0
1.5
110
−55 to
+ 175
15
49
260
A
W
MARKING
DIAGRAM
D1 D1
1
A
°C
A
mJ
°C
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (T
J
= 25°C, I
L(pk)
= 2 A)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
DFN8 5x6
(SO8FL)
CASE 506BT
A
Y
W
ZZ
S1
G1
S2
G2
XXXXXX
AYWZZ
D2 D2
D1
D1
D2
D2
= Assembly Location
= Year
= Work Week
= Lot Traceability
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
Symbol
R
qJC
R
qJA
Value
5.3
49
Unit
°C/W
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
©
Semiconductor Components Industries, LLC, 2015
1
June, 2017 − Rev. 1
Publication Order Number:
NVMFD5C470NL/D
NVMFD5C470NL
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise specified)
Parameter
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
V
(BR)DSS
V
(BR)DSS
/
T
J
I
DSS
V
GS
= 0 V,
V
DS
= 40 V
T
J
= 25
°C
T
J
= 125°C
V
GS
= 0 V, I
D
= 250
mA
40
24
10
100
100
V
mV/°C
mA
nA
Symbol
Test Condition
Min
Typ
Max
Unit
Gate−to−Source Leakage Current
ON CHARACTERISTICS
(Note 4)
Gate Threshold Voltage
Negative Threshold Temperature Coefficient
Drain−to−Source On Resistance
I
GSS
V
DS
= 0 V, V
GS
= 20 V
V
GS(TH)
V
GS(TH)
/T
J
R
DS(on)
V
GS
= V
DS
, I
D
= 20
mA
1.2
−4.5
2.2
V
mV/°C
V
GS
= 10 V
V
GS
= 4.5 V
I
D
= 5 A
I
D
= 5 A
9.2
14.6
30
11.5
17.8
mW
S
Forward Transconductance
g
FS
V
DS
= 15 V, I
D
= 15 A
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Total Gate Charge
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Plateau Voltage
SWITCHING CHARACTERISTICS
(Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 15 A
T
J
= 25°C
T
J
= 125°C
1.0
0.8
20
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 15 A
10
10
9
nC
ns
1.2
V
t
d(ON)
t
r
t
d(OFF)
t
f
V
GS
= 4.5 V, V
DS
= 32 V,
I
D
= 15 A, R
G
= 1.0
W
9.3
55
20
36
ns
C
ISS
C
OSS
C
RSS
Q
G(TOT)
Q
G(TOT)
Q
G(TH)
Q
GS
Q
GD
V
GP
V
GS
= 4.5 V, V
DS
= 32 V; I
D
= 15 A
V
GS
= 4.5 V, V
DS
= 32 V; I
D
= 15 A
V
GS
= 10 V, V
DS
= 32 V; I
D
= 15 A
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
590
200
8.0
4.0
9.0
1.1
2.2
1.6
3.2
V
nC
pF
Reverse Recovery Time
Charge Time
Discharge Time
Reverse Recovery Charge
t
RR
t
a
t
b
Q
RR
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width
v
300
ms,
duty cycle
v
2%.
5. Switching characteristics are independent of operating junction temperatures.
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2
NVMFD5C470NL
TYPICAL CHARACTERISTICS
33
30
I
D
, DRAIN CURRENT (A)
27
24
21
18
15
12
9
6
3
0
0
0.5
1.0
1.5
2.0
2.5
3.0
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
3.4 V
3.2 V
3.6 V
3.8 V
80
V
DS
= 10 V
70
I
D
, DRAIN CURRENT (A)
60
50
40
30
20
10
0
0
0.5
1.0
T
J
= 125°C
1.5
2.0
2.5
3.0
T
J
= −55°C
3.5
4.0
4.5 5.0
T
J
= 25°C
V
GS
= 10 to 5 V
4.5 V
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
40
35
30
25
20
15
10
5
0
3
4
5
6
7
8
9
10
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
I
D
= 5 A
T
J
= 25°C
Figure 2. Transfer Characteristics
20
T
J
= 25°C
18
16
14
12
10
8
6
4
4
5
6
7
8
9
10
11
12
13
14 15
I
D
, DRAIN CURRENT (A)
V
GS
= 10 V
V
GS
= 4.5 V
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (NORMALIZED)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
−50 −25
0
25
50
75
100
125
150
175
I
D
= 5 A
V
GS
= 10 V
I
DSS
, LEAKAGE (nA)
10K
1K
100
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
T
J
= 150°C
T
J
= 125°C
T
J
= 85°C
10
1
0.1
0.01
10
15
20
25
30
35
40
T
J
= 25°C
T
J
, JUNCTION TEMPERATURE (°C)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
NVMFD5C470NL
TYPICAL CHARACTERISTICS
1K
10
9
8
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
Q
g
, TOTAL GATE CHARGE (nC)
V
DS
= 32 V
I
D
= 15 A
Q
gs
Q
gd
T
J
= 25°C
C
iss
C
oss
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
QT
C, CAPACITANCE (pF)
100
10
T
J
= 25°C
V
GS
= 0 V
f = 1 MHz
1
0
5
10
15
20
25
30
35
40
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
C
rss
Figure 7. Capacitance Variation
100
t
r
t
f
t, TIME (ns)
t
d(off)
10
t
d(on)
I
S
, SOURCE CURRENT (A)
10
Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
V
GS
= 0 V
T
J
= 25°C
V
GS
= 4.5 V
V
DS
= 32 V
I
D
= 15 A
1
1
10
R
G
, GATE RESISTANCE (W)
100
T
J
= 125°C
1
0.5 0.6 0.7
0.8
0.9
T
J
= −55°C
1.0
1.1
1.2
1.3
1.4 1.5
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
1000
T
C
= 25°C
V
GS
≤
10 V
Single Pulse
100
Figure 10. Diode Forward Voltage vs. Current
I
D
, DRAIN CURRENT (A)
100
10
10
I
PEAK
(A)
T
J(initial)
= 25°C
10
ms
1
1
R
DS(on)
Limit
Thermal Limit
Package Limit
0.1
1
10
0.5 ms
1 ms
10 ms
0.1
100
1000
T
J(initial)
= 100°C
0.1
1.0E−05
1.0E−04
1.0E−03
1.0E−02
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
TIME IN AVALANCHE (s)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
Figure 12. Maximum Drain Current vs. Time in
Avalanche
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NVMFD5C470NL
TYPICAL CHARACTERISTICS
100
50% Duty Cycle
10
R(t) (°C/W)
20%
10%
5%
2%
1
1%
0.1 Single Pulse
0.01
0.000001
0.00001
0.0001
0.001
0.01
PULSE TIME (sec)
0.1
1
10
100
1000
Figure 13. Thermal Response
DEVICE ORDERING INFORMATION
Device
NVMFD5C470NLT1G
NVMFD5C470NLWFT1G
Marking
5C470L
470LWF
Package
DFN8
(Pb−Free)
DFN8
(Pb−Free, Wettable Flanks)
Shipping
†
1500 / Tape & Reel
1500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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