Heat Sink Fan Combinations
HSF Series
Wakefield-Vette’s
Heat Sink Fan Series (HSF) are for Chipset can
match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI,
AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many
more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many
more Industries.
Material:
AL 6063
Finish:
Black Anodize
Series- Chip Size- Height-
Chip Height-
Fan
48
B-Blue (2.2-3.4mm) F (Fan)
HSF
mm
50
Y- Yellow (.9-2.1mm) N (No Fan)
55
WKV Part Number
HSF-48-19-B-F
HSF-48-19-Y-F
HSF-48-22-B-F
HSF-48-22-Y-F
HSF-48-25-B-F
HSF-48-25-Y-F
HSF-48-28-B-F
HSF-48-28-Y-F
HSF-48-30-B-F
HSF-48-30-Y-F
HSF-48-35-B-F
HSF-48-35-Y-F
HSF-48-40-B-F
HSF-48-40-Y-F
HSF-50-19-B-F
HSF-50-19-Y-F
HSF-50-22-B-F
HSF-50-22-Y-F
HSF-50-25-B-F
HSF-50-25-Y-F
HSF-50-28-B-F
HSF-50-28-Y-F
HSF-50-30-B-F
HSF-50-30-Y-F
HSF-50-35-B-F
HSF-50-35-Y-F
HSF-50-40-B-F
HSF-50-40-Y-F
HSF-55-24-B-F
HSF-55-24-Y-F
HSF-55-27-B-F
HSF-55-27-Y-F
HSF-55-30-B-F
HSF-55-30-Y-F
HSF-55-33-B-F
HSF-55-33-Y-F
HSF-55-35-B-F
HSF-55-35-Y-F
HSF-55-40-B-F
HSF-55-40-Y-F
HSF-55-45-B-F
HSF-55-45-Y-F
Chip Size
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
47.5 x 47.5mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
50 x 50mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
55 x 55mm
Height (mm)
18.5
18.5
21.5
21.5
24.5
24.5
27.5
27.5
29.5
29.5
34.5
34.5
39.5
39.5
18.5
18.5
21.5
21.5
24.5
24.5
27.5
27.5
29.5
29.5
34.5
34.5
39.5
39.5
24.1
24.1
27.1
27.1
30.1
30.1
33.1
33.1
35.1
35.1
40.1
40.1
45.1
45.1
C/W
1.41
1.41
1.14
1.14
0.98
0.98
0.88
0.88
0.83
0.83
0.77
0.77
0.72
0.72
1.31
1.31
1.06
1.06
0.91
0.91
0.82
0.82
0.77
0.77
0.71
0.71
0.67
0.67
1
1
0.81
0.81
0.7
0.7
0.63
0.63
0.59
0.59
0.55
0.55
0.51
0.51
Chip Height
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
2.2-3.4mm
.9-2.1mm
Fan
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
5.9CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
13.8CFM
www.wakefield-vette.com
Heat Sink Fan Combinations
HSF Series
Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and
the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.
Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage
chip. Contact area is the edge of chip.
ASSEMBLY INSTRUCTION:
Step 1:
Hook the
clip under one
side of the BGA
chip set.
Step 2:
Rotate
assembly down
until opposite
side clip engages
substrate edge of
BGA chip set.
Step 3:
Make sure
the sop rods are
clearing from edges
of BGA chip set.
Step 4:
Press firmly
down to make sure
clips fully engage
edges of chip set.
Heat Sink should not
move around easily.
Random Vibration Test
Frequency
：5
Hz to 500 Hz
Acceleration
：3.13
grms
P.S.D
：0.01
g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis
：X,
Y, Z axis
Test Time
：10
mins (Each axis)
Total Test Time
：30
mins
SHOCK TEST SPECIFICATION：
Wave Form
：Half
sine wave
Acceleration
：50
g
Duration Time
：11
ms
No. of Shock
：Each
axis 3 times
Shock Direction
：±X,
±Y, ±Z axis
Reliability & Communication
Testing Instruments
FPGA/CPLD
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