Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
ESD Classification - HBM ..................................... Class 6
Test Procedures And Requirements For Model MF-NSML Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin
≤
R
≤
R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T
≤
max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
cUL File Number ................................................... E174545
http://www.ul.com/ Follow link to Online Certificates Directory, then enter cUL File No.
E174545, or
click here
TÜV Certificate Number ....................................... R 50302873
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50302873,
or
click here
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
MF-NSML Series - Low Ohmic PTC Resettable Fuses
MF-NSMF Series - PTC Resettable Fuses
Product Dimensions
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
MF-NSML450
MF-NSML500
MF-NSML550
MF-NSML600
Min.
A
Max.
Min.
B
Max.
Min.
C
Max.
D
Min.
Min.
E
Max.
3.00
(0.118)
3.50
(0.138)
1.40
(0.055)
1.80
(0.071)
0.30
(0.012)
0.60
(0.024)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
3.00
(0.118)
3.50
(0.138)
1.40
(0.055)
1.80
(0.071)
0.60
(0.024)
1.20
(0.047)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
Packaging:
MF-NSML150~MF-NSML400 = 5000 pcs. per reel
MF-NSML450~MF-NSML500 = 3500 pcs. per reel
MF-NSML550~MF-NSML600 = 3000 pcs. per reel
Top View
A
Side View
C
Bottom View
D
E
Recommended Pad Layout
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
1.6 ± 0.1
(.063 ± .004)
2.0 ± 0.1
(.079 ± .004)
DIMENSIONS:
MM
(INCHES)
B
Terminal material:
ENIG-plated terminals
(Tin-plated terminals available upon
request).
Termination pad solderability:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Thermal Derating Chart - Ihold (Amps)
Model
MF-NSML150
MF-NSML175
-40 °C
2.67
2.57
2.89
3.30
3.71
-20 °C
2.32
2.33
2.58
2.90
3.42
0 °C
1.95
2.07
2.25
2.50
3.01
Ambient Operating Temperature
23 °C
40 °C
50 °C
1.50
1.15
0.96
1.75
1.49
1.34
1.90
2.00
2.60
1.54
1.62
2.08
1.36
1.39
1.72
60 °C
0.78
1.24
1.21
1.16
1.49
70 °C
0.64
1.00
0.94
0.90
1.30
85 °C
0.52
0.91
0.77
0.52
0.89
MF-NSML550
MF-NSML600
MF-NSML400
MF-NSML450
MF-NSML500
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML190
MF-NSML200
MF-NSML260
8.09
8.82
5.71
6.62
7.35
4.41
5.51
5.59
7.32
7.98
5.26
5.99
6.66
3.99
4.66
5.05
6.49
7.08
4.63
5.31
5.90
3.54
4.13
4.48
5.50
6.00
4.00
4.50
5.00
3.00
3.50
3.80
4.68
5.10
3.20
3.83
4.25
2.55
2.98
3.23
4.27
4.66
2.70
3.50
3.88
2.32
2.71
2.95
3.91
4.26
2.29
3.20
3.55
2.13
2.49
2.70
3.41
3.43
2.00
2.57
2.85
1.71
2.00
2.17
2.86
3.12
1.37
2.34
2.60
1.56
1.82
1.98
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
MF-NSML Series - Low Ohmic PTC Resettable Fuses
3312 - 2 mm SMD Trimming Potentiometer
Solder Reflow Recommendations
TP
RAMP-UP
TL
tL
TS MAX.
RAMP-DOWN
TS MIN.
tp
CRITICAL ZONE
T L TO TP
Notes:
•
•
•
•
•
•
MF-NSML models cannot be wave soldered or hand soldered. Please
contact Bourns for soldering recommendations.
All temperatures refer to topside of the package, measured on the
package body surface.
Temperature
If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC Soldering
Recommendation guidelines.
Designed for single solder reflow operations.
PREHEAT
25
ts
t 25 *C TO PEAK
8 MINS.
Time
Profile Feature
Average Ramp-Up Rate (TS
max
to T
p
)
PREHEAT:
Temperature Min. (TS
min
)
Temperature Max. (TS
max
)
Time (ts
min
to ts
max
)
3 °C / second max.
150 °C
200 °C
60~180 seconds
Pb-Free Assembly
Process
TIME MAINTAINED ABOVE:
Materials
Description
Temperature (T
L
)
1. Apply solder paste to
• Sn 96.5 / Ag 3.0 / Cu 0.5
Time (t
L
)
test board (8 - 10 mil thick)
Temperature
Time
Interval
Room temperature
Alloy water soluble or no
clean solder
(T )
Peak / Classification Temperature
paste
P
(see note 1)
• single sided epoxy glass
Time within 5 °C of Actual Peak Temperature (t
p
)
(G10) (UL approved)
Ramp-Down Rate
• PC board approx. 4x4x.06 in.
Convection oven
(see note 2)
150 °C to 190 °C
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
217 °C
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
60~150 seconds
260 °C
A) Acceptable (see Figure 1)
20~40 seconds
component and solder to PCB termination)
6 °C / second max.
2.5 °C ± 0.5 °/sec.
90 ± 30 sec.
does not exceed 90 °.
electrical clearances and are attached
8 minutes max.
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(2) Solder balls that do not violate minimum
(1) The solder connection wetting angle (solder to
2.
Time
test units
25 °C to Peak Temperature
Place
within
onto board 6 units/board
3. Ramp up
4. Preheat (TS)
6. Peak temperature (TP)
5. Time above liquidus (TL)
How to Order
MF - NSML 200 - 2
Multifuse
®
Product
7. Ramp down
Designator
Series
NSML = 1206 Low Ohmic
8. Cleaning water clean profile High pressure deionized
Surface Mount Component
65 PSI max.
water
Hold Current, Ihold
150 - 600 (1.50 Amps - 6.00 Amps)
Packaging
Temperature of Lead/Pad Junction
Packaged per EIA 481-1
(Derived
= Tape and
Convection Oven)
-2
using 6-zone
Reel
(1) Solder connection wetting angle exceeding
220 °C
Typical Part
60-90 sec.
Marking
90 °.
250 °C +0 °/-5 °
(2)
vary.
Represents total content. Layout may
Incomplete reflow of solder paste.
10-20 sec. within
Asia-Pacific:
5 °C of peak
(3) Dewetting.
PART IDENTIFICATION:
Tel: +886-2 2562-4117
Room temperature 3 °C ± 0.5 °C/sec.
If unacceptable, determine cause and correct prior to
MF-NSML150 = NG
Email: asiacus@bourns.com
(see note 2)
next
MF-NSML175 = NH
run.
MF-NSML190 = NI
72 °F to 160 °F
As required
NOTES:
Europe:
MF-NSML200 = NJ
(22 °C to 71 °C)
Tel: +36 88
1. Water soluble solder paste only above 100K.
520 390
MF-NSML260 = NN
NJ
MF-NSML300 = NP
2.
MF-NSML350 = NS
MF-NSML380 = NV
MF-NSML400 = NU
3.
MF-NSML450 = NX
MF-NSML500 = NY
MF-NSML550 = N5
MF-NSML600 = NZ
Email: eurocus@bourns.com
Refer to ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
Units that are board mounted for environmental
Tel: +1-951 781-5500
testing must see a peak temperature in the reflow
Email: americus@bourns.com
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
www.bourns.com
The Americas:
150 °C.
MANUFACTURING DATE CODE IS
LOCATED ON PACKING LABEL.
4. Ramp down rate to be measured from 245 °C to
5. Process Description 8 does not apply to open
frame trimmers.
MF-NSML SERIES, REV. I, 02/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
MF-NSML Series -
Low Ohmic PTC Resettable Fuses
Tape Dimensions
W
P0
P1
P2
A0 (MF-NSML150~MF-NSML500)
A0 (MF-NSML550~MF-NSML600)
B0 (MF-NSML150~MF-NSML500)
B0 (MF-NSML550~MF-NSML600)
B1 max.
D0
F
E1
E2 typ.
T max.
T1 max.
K0 (MF-NSML150~MF-NSML400)
K0 (MF-NSML450~MF-NSML500)
K0 (MF-NSML550~MF-NSML600)
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
P0
MF-NSML Series
per EIA 481-2
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
1.90 ± 0.10
(0.075 ± 0.004)
2.0 ± 0.05
(0.078 ± 0.002)
3.50 ± 0.10
(0.138 ± 0.004)
3.60 ± 0.10
(0.142 ± 0.004)
4.5
(0.177)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.216 + 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
0.65 ± 0.10
(0.026 ± 0.004)
1.10 ± 0.10
(0.043 ± 0.004)
1.35 ± 0.10
(0.053 ± 0.004)
390
(15.35)
160
(6.30)
185
(7.283)
50
(1.97)
12.4 + 1/-0
(0.488 + 0.039/-0)
15.4
(0.606)
DIMENSIONS:
E1
MM
(INCHES)
T
COVER
TAPE
D0
P2
W2(MEASURED
AT HUB)
F
B1
B0
K0
T1
A0
P1
E2 W
A
N(HUB DIA.)
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns
®
products manufactured by or on behalf of Bourns, Inc. and
its affiliates (collectively, “Bourns”).
Unless otherwise expressly indicated in writing, Bourns
®
products and data sheets relating thereto are subject to change
without notice. Users should check for and obtain the latest relevant information and verify that such information is current
and complete before placing orders for Bourns
®
products.
The characteristics and parameters of a Bourns
®
product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
requirements in generic applications. The characteristics and parameters of a Bourns
®
product in a user application may vary
from the data sheet characteristics and parameters due to (i) the combination of the Bourns
®
product with other components
in the user’s application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns
®
product also can and do vary in different applications and actual performance may vary over time. Users should always verify
the actual performance of the Bourns
®
product in their specific devices and applications, and make their own independent
judgments regarding the amount of additional test margin to design into their device or application to compensate for
differences between laboratory and real world conditions.
Unless Bourns has explicitly designated an individual Bourns
®
product as meeting the requirements of a particular industry
standard (e.g., ISO/TS 16949) or a particular qualification (e.g., UL listed or recognized), Bourns is not responsible for any
failure of an individual Bourns
®
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®
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their devices or applications.
Bourns
®
products are not recommended, authorized or intended for use in nuclear, lifesaving, life-critical or life-sustaining
applications, nor in any other applications where failure or malfunction may result in personal injury, death, or severe property
or environmental damage. Unless expressly and specifically approved in writing by two authorized Bourns representatives
on a case-by-case basis, use of any Bourns
®
products in such unauthorized applications might not be safe and thus is at
the user’s sole risk. Life-critical applications include devices identified by the U.S. Food and Drug Administration as Class III
devices and generally equivalent classifications outside of the United States.
Bourns expressly identifies those Bourns
®
standard products that are suitable for use in automotive applications on such
products’ data sheets in the section entitled “Applications.” Unless expressly and specifically approved in writing by two
authorized Bourns representatives on a case-by-case basis, use of any other Bourns
®
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expressly identifies a sub-category of automotive application in the data sheet for its standard products (such as infotainment
or lighting), such identification means that Bourns has reviewed its standard product and has determined that if such Bourns
®
standard product is considered for potential use in automotive applications, it should only be used in such sub-category of
automotive applications. Any reference to Bourns
®
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or “automotive grade” does not by itself mean that Bourns has approved such product for use in an automotive application.
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®
standard products are not tested to comply with United States Federal Aviation Administration standards generally
or any other generally equivalent governmental organization standard applicable to products designed or manufactured for
use in aircraft or space applications. Bourns expressly identifies Bourns
®
standard products that are suitable for use in aircraft
or space applications on such products’ data sheets in the section entitled “Applications.” Unless expressly and specifically
approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any other Bourns
®
standard
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the user’s sole risk.
The use and level of testing applicable to Bourns
®
custom products shall be negotiated on a case-by-case basis by Bourns
and the user for which such Bourns
®
custom products are specially designed. Absent a written agreement between Bourns
and the user regarding the use and level of such testing, the above provisions applicable to Bourns
®
standard products shall
also apply to such Bourns
®
custom products.
Users shall not sell, transfer, export or re-export any Bourns
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products or technology for use in activities which involve the
design, development, production, use or stockpiling of nuclear, chemical or biological weapons or missiles, nor shall they use
Bourns
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products or technology in any facility which engages in activities relating to such devices. The foregoing restrictions
apply to all uses and applications that violate national or international prohibitions, including embargos or international
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®
products and Bourns technology and technical data may not under any circumstance be
exported or re-exported to countries subject to international sanctions or embargoes. Bourns
®
products may not, without
prior authorization from Bourns and/or the U.S. Government, be resold, transferred, or re-exported to any party not eligible
to receive U.S. commodities, software, and technical data.
To the maximum extent permitted by applicable law, Bourns disclaims (i) any and all liability for special, punitive, consequential,
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For your convenience, copies of this Legal Disclaimer Notice with German, Spanish, Japanese, Traditional Chinese and Simplified Chinese
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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