CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| Reach Compliance Code | unknown |
| 转换器类型 | A/D CONVERTER |
| JESD-30 代码 | R-XDIP-T28 |
| JESD-609代码 | e0 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 输出位码 | OFFSET BINARY |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| AD7571BQ | AD7571 | AD7571AQ | AD7571SD | AD7571JN | AD7571TD | AD7571KN | |
|---|---|---|---|---|---|---|---|
| 描述 | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC | CMOS uP-COMPATIBLE 10-BIT PLUS SIGN ADC |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown | unknown |
| 转换器类型 | A/D CONVERTER | - | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
| JESD-30 代码 | R-XDIP-T28 | - | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 位数 | 10 | - | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | - | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | - | 85 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| 最低工作温度 | -25 °C | - | -25 °C | -55 °C | - | -55 °C | - |
| 输出位码 | OFFSET BINARY | - | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| 封装主体材料 | CERAMIC | - | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | - | NO | NO | NO | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | - | OTHER | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
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