IC REG CTRLR BUCK 16QFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 |
| 制造商包装代码 | UD |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE FREQUENCY MODULATION |
| 最大输入电压 | 38 V |
| 最小输入电压 | 4 V |
| 标称输入电压 | 15 V |
| JESD-30 代码 | S-PQCC-N16 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 表面贴装 | YES |
| 切换器配置 | PUSH-PULL |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |

| LTC3879IUD#TRPBF | DC1289A | LTC3879IMSE#TRPBF | LTC3879IMSE#PBF | LTC3879EMSE#PBF | LTC3879EMSE#TRPBF | LTC3879EUD#TRPBF | LTC3879IUD#PBF | LTC3879EUD#PBF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC REG CTRLR BUCK 16QFN | board eval for ltc3879eud | IC REG CTRLR BUCK 16MSOP | IC REG CTRLR BUCK 16MSOP | IC REG CTRLR BUCK 16MSOP | IC REG CTRLR BUCK 16MSOP | IC REG CTRLR BUCK 16QFN | IC REG CTRLR BUCK 16QFN | IC REG CTRLR BUCK 16QFN |
| Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | QFN | - | MSOP | MSOP | MSOP | MSOP | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 | - | TSSOP, TSSOP16,.19,20 | TSSOP, TSSOP16,.19,20 | TSSOP, TSSOP16,.19,20 | TSSOP, TSSOP16,.19,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | UD | - | MSE | MSE | MSE | MSE | UD | UD | UD |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE FREQUENCY MODULATION | - | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION |
| 最大输入电压 | 38 V | - | 38 V | 38 V | 38 V | 38 V | 38 V | 38 V | 38 V |
| 最小输入电压 | 4 V | - | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
| 标称输入电压 | 15 V | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| JESD-30 代码 | S-PQCC-N16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | - | 4.039 mm | 4.039 mm | 4.039 mm | 4.039 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | TSSOP | TSSOP | TSSOP | TSSOP | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 | - | TSSOP16,.19,20 | TSSOP16,.19,20 | TSSOP16,.19,20 | TSSOP16,.19,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 切换器配置 | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | OTHER | OTHER | OTHER | INDUSTRIAL | OTHER |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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