AH118 / ECG099
Product Features
•
60 – 3500 MHz
•
+24.7 dBm P1dB
•
+40.5 dBm Output IP3
•
20.4 dB Gain @ 900 MHz
•
16.5 dB Gain @ 1900 MHz
•
+5V Single Positive Supply
•
Available in lead-free / green
SOT-89 SMT Package Style
¼ Watt, High Linearity InGaP HBT Amplifier
Product Information
Product Description
The AH118 / ECG099 is a high dynamic range driver
amplifier in a low-cost surface mount package. The
InGaP/GaAs HBT is able to achieve high performance
across a broad range with +40.5 dBm OIP3 and +24.7 dBm
of compressed 1dB power. The AH118 / ECG099 is
available in a lead-free/green/RoHS-compliant SOT-89
package. All devices are 100% RF and DC tested.
The AH118 / ECG099 is targeted for use as a driver
amplifier in wireless infrastructure where high linearity and
medium power is required. Internal biasing allows the
AH118 to maintain high linearity over temperature and
operate directly off a single +5V supply. This combination
makes the device an excellent candidate for transceiver line
cards in current and next generation multi-carrier 3G base
stations.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Applications
•
Final stage amplifiers for
Repeaters
•
Mobile Infrastructure
•
DBS / WLL / W-LAN
•
Defense / Homeland Security
Function
Input / Base
Output / Collector
Ground
Pin No.
1
3
2, 4
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
IS-95A Channel Power
@ -45 dBc ACPR
Typical Performance
(3)
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dBm
dB
mA
V
140
Min
60
13.5
Typ
1900
16.5
12
18
+24.7
+40.5
+18
+16.7
4.3
160
+5
Max
3500
Parameter
Frequency
S21 - Gain
S11 - Input R.L.
S22 - Output R.L.
Output P1dB
Output IP3
IS-95A Channel Power
@ -45 dBc ACPR,
@ -45 dBc ACLR
Units
MHz
dB
dB
dB
dBm
dBm
dBm
dBm
dB
4.0
900
20.4
-15
-12
+24.2
+40
+18.2
Typical
1900
16.5
-12
-18
+24.7
+40.5
+18
+16.7
4.3
4.8
+5 V @ 160 mA
2140
16.3
-15
-16
+24.7
+40.5
+23
+39.5
W-CDMA Channel Power
Noise Figure
Supply Bias
175
W-CDMA Channel Power
@ -45 dBc ACLR, 2140 MHz
Noise Figure
Operating Current Range
Device Voltage
3. Typical parameters reflect performance in a tuned application circuit: Vsupply = +5 V, I = 160
mA, +25° C
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Ordering Information
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Junction Temperature
Part No.
AH118-89*
ECG099B*
AH118-89G
AH118-89PCB900
AH118-89PCB1900
AH118-89PCB2140
Description
High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
Rating
-40 to +85
°C
-65 to +150
°C
+15 dBm
+6 V
220 mA
+250
°C
High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
High Linearity InGaP HBTAmplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
900 MHz Evaluation Board
1900 MHz Evaluation Board
2140 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
Specifications and information are subject to change without notice
Page 1 of 7
June 2005
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
AH118 / ECG099
40
35
30
25
Gain (dB)
20
15
0
0. 2
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
Typical Device Data
S-Parameters (V
Device
= +5 V, I
CC
= 160 mA, 25° C, unmatched 50 ohm system)
1.0
0.8
0.8
6
0.
2.
0
0
3.
2.
0
DB(|S[2,1]|)
DB(GMax)
0.
4
6
0.
1.0
Gain / Maximum Stable Gain
S11
Swp Max
6GHz
S22
Swp Max
6GHz
0
4.
5.0
0. 2
10.0
10.0
0.2
1.0
0.8
2.0
3.0
10
5
0
-5
-10
0
0.5
1
1.5
Frequency (GHz)
2
2.5
5.0
0.4
0.6
4.0
0
10.0
0.8
3.0
0.2
1.0
2.0
5.0
0.4
0.6
4.0
.4
-0
.4
-0
.0
-2
-0
.6
Swp Min
0.01GHz
-0
.6
.0
-2
Swp Min
0.01GHz
-0.8
-1.0
-0.8
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The impedance plots are shown from 50 – 6000 MHz, with markers placed at 0.5 – 6.0 GHz in 0.5 GHz increments.
S-Parameters (V
Device
= +5 V, I
CC
= 160 mA, 25°C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
-2.69
-2.16
-1.91
-1.77
-1.60
-1.45
-1.40
-1.25
-1.20
-1.17
-1.13
-1.11
-1.05
-0.99
-0.93
-0.95
-0.92
-173.38
-177.19
178.30
172.47
166.83
161.09
155.39
149.59
143.79
137.57
132.05
126.72
121.50
115.58
110.41
105.30
100.11
21.74
19.63
18.22
17.13
15.99
14.97
13.84
12.76
11.71
10.63
9.75
8.88
8.00
7.31
6.52
5.73
5.05
153.70
150.82
148.19
135.41
121.91
109.02
97.28
86.83
76.95
68.15
59.55
52.22
45.09
37.40
30.66
23.51
17.07
-31.02
-30.31
-29.87
-29.83
-29.49
-29.18
-28.70
-28.63
-28.30
-27.94
-27.63
-27.51
-27.06
-27.02
-26.78
-26.66
-26.61
11.24
7.90
5.01
4.07
2.79
2.11
1.64
-0.09
-1.34
-4.47
-7.00
-8.43
-11.00
-14.19
-18.24
-20.10
-23.28
-7.02
-5.57
-5.06
-4.77
-4.60
-4.44
-4.26
-4.14
-3.97
-4.00
-3.86
-3.84
-3.62
-3.55
-3.46
-3.34
-3.30
-1.0
-148.17
-162.45
-173.51
177.87
171.65
166.08
160.40
155.01
149.63
144.03
139.02
134.24
129.30
124.42
119.42
114.26
109.29
Application Circuit PC Board Layout
Circuit Board Material: .062” total thickness with a .014” Getek top RF layer, 4 layers (other layers added for rigidity),
1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 7
June 2005
-4
.0
-5.
0
-3
.0
-4
.0
-5.
0
2
-0 .
2
-0 .
- 10.0
0.
4
0
3.
0
4.
5.0
1 0.0
- 10.0
-3
.0
AH118 / ECG099
Typical RF Performance at 25°C
°
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
900 MHz Application Circuit (AH118-89PCB900)
900 MHz
20.4 dB
-15 dB
-12 dB
+24.2 dBm
+40 dBm
+18.2 dBm
4 dB
+5 V
160 mA
CAP
ID= C6
C= 6.8 pF
SUBCKT
ID=U1
NET="AH118"
C6 should be placed at the silk screen
marker 'F' on the WJ evaluation board.
The capacitor should be placed
13.7° @ 0.9GHz from pin 1 of the AH118
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
Component R1 is shown in the silkscreen but is not used for this
configuration.
L2 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
PORT
P= 1
Z=50 Ohm
CAP
ID= C4
C=56 pF
RES
ID=L2
R=0 Ohm
DIODE1
ID= D1
5.6 V
IND
ID=L1
L=33 nH
CAP
ID=C1
C=1e5 pF
size 1206
CAP
ID=C2
C= 56 pF
CAP
ID= C3
C= 1000 pF
size 0805
CAP
ID=C5
C= 56 pF
PORT
P= 2
Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
IND
ID=L3
L= 3.3 nH
CAP
ID=C9
C= 2.4 pF
C9 should be placed between
silk screen markers '8' and '9'
on the WJ evaluation board.
The capacitor should be placed
19.9° @ 0.9GHz from pin 3
of the AH118.
Noise Figure
Device / Supply Voltage
Quiescent Current
Gain
Return Loss
ACPR vs. Channel Power
S22
22
21
20
19
18
17
800
850
900
Frequency (MHz)
950
1000
0
-5
-10
-15
-20
-25
800
850
900
S11
-40
IS-95, 9 Ch. Fwd, ±885 kHz offset, 30 kHz Meas BW 900 MHz
,
-50
-60
-70
950
1000
12
13
14
15
16
17
18
19
Frequency (MHz)
Output Channel Power (dBm)
1900 MHz Application Circuit (AH118-89PCB1900)
Typical RF Performance at 25°C
°
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
1900 MHz
16.5 dB
-12 dB
-18 dB
+24.7 dBm
+40.5 dBm
+18 dBm
4.3 dB
+5 V
160 mA
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
Component R1 is shown in the silkscreen but is not used for this
configuration.
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
PORT
P= 1
Z=50 Ohm
CAP
ID= C4
C=56 pF
DIODE1
ID= D1
5.6 V
IND
ID=L1
L=18 nH
CAP
ID=C1
C=1e5 pF
size 1206
CAP
ID=C2
C= 56 pF
CAP
ID= C3
C= 1000 pF
size 0805
CAP
ID=C5
C= 56 pF
PORT
P= 2
Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
Noise Figure
Device / Supply Voltage
Quiescent Current
Gain
IND
ID=L2
L=4.7 nH
CAP
ID= C7
C=2.7 pF
C7 should be placed at the silk screen
marker 'A' on the WJ evaluation board.
The capacitor should be placed
4.6° @ 1.9GHz from pin 1 of the AH118
SUBCKT
ID=U1
NET="AH118"
RES
ID=L3
R=0 Ohm
CAP
ID=C9
C= 1.5 pF
C9 should be placed at
silk screen marker '4'
on the WJ evaluation board.
The capacitor should be placed
18.4° @ 1.9GHz from pin 3
of the AH118.
Return Loss
ACPR vs. Channel Power
S22
-40
IS-95, 9 Ch. Fwd, ±885 kHz offset, 30 kHz Meas BW 1900 MHz
,
18
17
16
15
14
13
1800
1850
1900
Frequency (MHz)
1950
2000
0
-5
-10
-15
-20
-25
1800
1850
1900
S11
-50
-60
-70
1950
2000
12
13
14
15
16
17
18
19
Frequency (MHz)
Output Channel Power (dBm)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 7
June 2005
AH118 / ECG099
Typical RF Performance at 25°C
°
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
2140 MHz Application Circuit (AH118-89PCB2140)
2140 MHz
16.3 dB
-15 dB
-16 dB
+24.7 dBm
+40.5 dBm
+16.7 dBm
4.8 dB
+5 V
160 mA
CAP
ID= C6
C= 1.8 pF
SUBCKT
ID=U1
NET="AH118"
C6 should be placed at the silk screen
marker 'F' on the WJ evaluation board.
The capacitor should be placed
32.6° @ 2.14GHz from pin 1 of the AH118
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
Component R1 is shown in the silkscreen but is not used for this
configuration.
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
PORT
P= 1
Z=50 Ohm
CAP
ID= C4
C=56 pF
CAP
ID= L2
C= 1.5 pF
DIODE1
ID= D1
5.6 V
IND
ID=L1
L=18 nH
CAP
ID=C1
C=1e5 pF
size 1206
CAP
ID=C2
C= 56 pF
CAP
ID= C3
C= 1000 pF
size 0805
CAP
ID=C5
C= 56 pF
PORT
P= 2
Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
RES
ID=L3
R=0 Ohm
Noise Figure
Device / Supply Voltage
Quiescent Current
Gain
CAP
ID=C9
C= 1.2 pF
C9 should be placed at
silk screen marker '5'
on the WJ evaluation board.
The capacitor should be placed
26.7° @ 2.14G Hz from pin 3
of the AH118.
Return Loss
ACLR vs. Channel Power
S22
-35
-40
-45
-50
-55
-60
3GPP W
-CDMA, Test Model 1+64 DPCH, ±5 MHz offset, 2140 MHz
18
17
16
15
14
13
2110
2130
2150
2170
Frequency (MHz)
0
-5
-10
-15
-20
-25
2110
2130
S11
2150
2170
12
13
14
15
16
17
18
Frequency (MHz)
Output Channel Power (dBm
)
3500 MHz Application Circuit
Typical RF Performance at 25°C
°
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
3500 MHz
8.5 dB
-12 dB
-12 dB
+23.5 dBm
+38.5 dBm
5.0 dB
+5 V
160 mA
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
Component R1 is shown in the silkscreen but is not used for this
configuration.
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
PORT
P=1
Z=50 Ohm
CAP
ID=C4
C=27 pF
DIODE1
ID=D1
5.6 V
IND
ID=L1
L=15 nH
CAP
ID=C1
C=1e5 pF
size 1206
CAP
ID=C2
C=56 pF
CAP
ID=C3
C=1000 pF
size 0805
CAP
ID=C5
C=27 pF
PORT
P=2
Z=50 Ohm
Noise Figure
Device / Supply Voltage
Quiescent Current
IND
ID=L2
L=5.6 nH
CAP
ID=C7
C=0.2 pF
SUBCKT
ID=U1
NET="AH118"
RES
ID=L3
R=0 Ohm
CAP
ID=C9
C=0.2 pF
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 4 of 7
June 2005
AH118 / ECG099
Outline Drawing
The Communications Edge
TM
Product Information
¼ Watt, High Linearity InGaP HBT Amplifier
AH118-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Product Marking
The component will be marked with an
“AH118” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance
(1)
Junction Temperature
(2)
Rating
-40 to +85° C
92° C / W
159° C
100000
MTTF vs. GND Tab Temperature
10000
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 160 mA at an 85° C ground tab temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C.
1000
100
60
70
80
90
100
110
120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 5 of 7
June 2005
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