4A HALF BRDG BASED MOSFET DRIVER, PQCC8, 3 X 3 MM, PLASTIC, MO-220VEEC, QFN-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC8,.12SQ,25 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 高边驱动器 | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | S-PQCC-N8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 100 °C |
| 最低工作温度 | -10 °C |
| 标称输出峰值电流 | 4 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC8,.12SQ,25 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 接通时间 | 0.03 µs |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| ISL6209CR | ISL6209CRZ-T | ISL6209CRZ | ISL6209CR-T | |
|---|---|---|---|---|
| 描述 | 4A HALF BRDG BASED MOSFET DRIVER, PQCC8, 3 X 3 MM, PLASTIC, MO-220VEEC, QFN-8 | 4A HALF BRDG BASED MOSFET DRIVER, PQCC8, LEAD FREE, 3 X 3 MM, PLASTIC, MO-220VEEC, QFN-8 | 4A HALF BRDG BASED MOSFET DRIVER, PQCC8, LEAD FREE, 3 X 3 MM, PLASTIC, MO-220VEEC, QFN-8 | 4A HALF BRDG BASED MOSFET DRIVER, PQCC8, 3 X 3 MM, PLASTIC, MO-220VEEC, QFN-8 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC8,.12SQ,25 | HVQCCN, LCC8,.12SQ,25 | HVQCCN, LCC8,.12SQ,25 | HVQCCN, LCC8,.12SQ,25 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N |
| 高边驱动器 | YES | YES | YES | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | S-PQCC-N8 | S-PQCC-N8 | S-PQCC-N8 | S-PQCC-N8 |
| JESD-609代码 | e0 | e3 | e3 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 3 | 3 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 100 °C | 100 °C | 100 °C | 100 °C |
| 最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C |
| 标称输出峰值电流 | 4 A | 4 A | 4 A | 4 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC8,.12SQ,25 | LCC8,.12SQ,25 | LCC8,.12SQ,25 | LCC8,.12SQ,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED |
| 接通时间 | 0.03 µs | 0.012 µs | 0.012 µs | 0.03 µs |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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