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MAX9323EUP+T

产品描述Clock Driver, 4 True Output(s), 0 Inverted Output(s), BICMOS, PDSO20, 4.40 MM, TSSOP-20
产品类别逻辑   
文件大小267KB,共11页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准  
下载文档 详细参数 选型对比 全文预览

MAX9323EUP+T概述

Clock Driver, 4 True Output(s), 0 Inverted Output(s), BICMOS, PDSO20, 4.40 MM, TSSOP-20

MAX9323EUP+T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码TSSOP
包装说明TSSOP,
针数20
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time24 weeks
Is SamacsysN
输入调节MUX
JESD-30 代码R-PDSO-G20
JESD-609代码e3
长度6.5 mm
逻辑集成电路类型CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量20
实输出次数4
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)0.6 ns
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.03 ns
座面最大高度1.1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.4 mm
最小 fmax1500 MHz
Base Number Matches1

文档预览

下载PDF文档
19-2575; Rev 0; 10/02
One-to-Four LVCMOS-to-LVPECL
Output Clock and Data Driver
General Description
The MAX9323 low-skew, low-jitter, clock and data dri-
ver distributes one of two single-ended LVCMOS inputs
to four differential LVPECL outputs. A single logic con-
trol signal (CLK_SEL) selects the input signal to distrib-
ute to all outputs. The device operates from 3.0V to
3.6V, making the device ideal for 3.3V systems, and
consumes only 25mA (max) of supply current.
The MAX9323 features low 150ps part-to-part skew, low
11ps output-to-output skew, and low 1.7ps RMS jitter,
making the device ideal for clock and data distribution
across a backplane or board. All outputs are enabled
and disabled synchronously with the clock input to pre-
vent partial output clock pulses.
The MAX9323 is available in space-saving 20-pin
TSSOP and ultra-small 20-pin 4mm
4mm thin QFN
packages and operates over the extended (-40°C to
+85°C) temperature range. The MAX9323 is pin com-
patible with Integrated Circuit Systems’ ICS8535-01.
o
1.7ps
RMS
Added Random Jitter
o
150ps (max) Part-to-Part Skew
o
11ps Output-to-Output Skew
o
450ps Propagation Delay
o
Pin Compatible with ICS8535-01
o
Consumes Only 25mA (max) Supply Current
(50% Less than ICS8535-01)
o
Synchronous Output Enable/Disable
o
Two Selectable LVCMOS Inputs
o
3.0V to 3.6V Supply Voltage Range
o
-40°C to +85°C Operating Temperature Range
Features
MAX9323
Ordering Information
PART
MAX9323EUP
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
20 TSSOP
Applications
Precision Clock Distribution
Low-Jitter Data Repeater
Data and Clock Driver and Buffer
Central-Office Backplane Clock Distribution
DSLAM Backplane
Base Station
Hubs
MAX9323ETP*
-40°C to +85°C
20 Thin QFN-EP**
*Future
product—Contact factory for availability.
**EP
= Exposed paddle.
Functional Diagram and Typical Operating Circuit appear at
end of data sheet.
Pin Configurations
CLK_SEL
CLK_EN
GND
Q0
17
Q0
16
GND 1
CLK0 1
N.C. 2
CLK1 3
N.C. 4
N.C. 5
15 V
CC
14 Q1
CLK_EN 2
CLK_SEL 3
CLK0 4
N.C. 5
12 Q2
11 Q2
CLK1 6
N.C. 7
N.C. 8
6
N.C.
7
V
CC
8
Q3
9
Q3
10
V
CC
N.C. 9
V
CC
10
12 Q3
11 Q3
20 Q0
19 Q0
18 V
CC
17 Q1
TOP VIEW
20
19
18
MAX9323
**EXPOSED PADDLE
13 Q1
MAX9323
16 Q1
15 Q2
14 Q2
13 V
CC
THIN QFN-EP** (4mm x 4mm)
**CONNECT EXPOSED PADDLE TO GND.
TSSOP
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9323EUP+T相似产品对比

MAX9323EUP+T MAX9323ETP-T
描述 Clock Driver, 4 True Output(s), 0 Inverted Output(s), BICMOS, PDSO20, 4.40 MM, TSSOP-20 Low Skew Clock Driver, 4 True Output(s), 0 Inverted Output(s), BICMOS, EXPOSED PAD, QFN-20
是否无铅 不含铅 含铅
是否Rohs认证 符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 TSSOP QFN
包装说明 TSSOP, VQCCN,
针数 20 20
Reach Compliance Code compliant compliant
输入调节 MUX MUX
JESD-30 代码 R-PDSO-G20 S-XQCC-N20
JESD-609代码 e3 e0
长度 6.5 mm 4 mm
逻辑集成电路类型 CLOCK DRIVER LOW SKEW CLOCK DRIVER
湿度敏感等级 1 1
功能数量 1 1
端子数量 20 20
实输出次数 4 4
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY UNSPECIFIED
封装代码 TSSOP VQCCN
封装形状 RECTANGULAR SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 240
传播延迟(tpd) 0.6 ns 0.6 ns
认证状态 Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.03 ns 0.03 ns
座面最大高度 1.1 mm 0.8 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) TIN LEAD
端子形式 GULL WING NO LEAD
端子节距 0.65 mm 0.5 mm
端子位置 DUAL QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 4.4 mm 4 mm
最小 fmax 1500 MHz 1500 MHz

 
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