Telecom Circuit, 1-Func, CMOS, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | CML Microcircuits |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.6 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 31.75 mm |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -30 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.84 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | OTHER |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| MX365J | MX365LH | MX365P | MX355LH | |
|---|---|---|---|---|
| 描述 | Telecom Circuit, 1-Func, CMOS, CDIP24, CERAMIC, DIP-24 | Telecom Circuit, 1-Func, CMOS, PQCC24, PLASTIC, LCC-24 | Telecom Circuit, 1-Func, CMOS, PDIP24, PLASTIC, DIP-24 | Telecom Circuit, 1-Func, CMOS, PQCC24, PLASTIC, LCC-24 |
| 厂商名称 | CML Microcircuits | CML Microcircuits | CML Microcircuits | CML Microcircuits |
| 零件包装代码 | DIP | LCC | DIP | LCC |
| 包装说明 | DIP, DIP24,.6 | QCCJ, LDCC24,.44SQ | DIP, DIP24,.6 | QCCJ, LDCC24,.44SQ |
| 针数 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-GDIP-T24 | S-PQCC-J24 | R-PDIP-T24 | S-PQCC-J24 |
| 长度 | 31.75 mm | 10.16 mm | 31.37 mm | 10.16 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | DIP | QCCJ |
| 封装等效代码 | DIP24,.6 | LDCC24,.44SQ | DIP24,.6 | LDCC24,.44SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.84 mm | 3.7 mm | 5.59 mm | 3.7 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 15.24 mm | 10.16 mm | 15.24 mm | 10.16 mm |
| Is Samacsys | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | - |
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