TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFN |
包装说明 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
针数 | 48 |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 代码 | S-XQCC-N48 |
JESD-609代码 | e3 |
长度 | 7 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 48 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | COMMERCIAL |
座面最大高度 | 0.8 mm |
标称供电电压 | 2.8 V |
表面贴装 | YES |
电信集成电路类型 | RF AND BASEBAND CIRCUIT |
温度等级 | INDUSTRIAL |
端子面层 | TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7 mm |
Base Number Matches | 1 |
MAX2363ETM+ | MAX2363ETM | MAX2361EGM | MAX2361ETM | MAX2363EGM | MAX2365EGM | |
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描述 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN |
包装说明 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 | 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
针数 | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Is Samacsys | N | N | N | N | N | N |
JESD-30 代码 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 |
JESD-609代码 | e3 | e0 | e0 | e0 | e0 | e0 |
长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
湿度敏感等级 | 1 | 1 | 3 | 1 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 240 | 245 | 240 | 245 | 245 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 0.8 mm | 0.8 mm | 1 mm | 0.8 mm | 1 mm | 1 mm |
标称供电电压 | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
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