MAX6782TEB+,MAX6782TEB+ pdf中文资料,MAX6782TEB+引脚图,MAX6782TEB+电路-Datasheet-电子工程世界

MAX6782TEB+: 产品描述4-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16; 产品类别电源电路; 文件大小1MB，共24页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/; 标准

下载文档详细参数选型对比全文预览

MAX6782TEB+概述

4-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16

MAX6782TEB+规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Rochester Electronics
零件包装代码	QFN
包装说明	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16
针数	16
Reach Compliance Code	unknown
Is Samacsys	N
可调阈值	NO
模拟集成电路 - 其他类型	POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码	S-XQCC-N16
JESD-609代码	e3
长度	3 mm
湿度敏感等级	1
信道数量	4
功能数量	1
端子数量	16
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	UNSPECIFIED
封装代码	VQCCN
封装形状	SQUARE
封装形式	CHIP CARRIER, VERY THIN PROFILE
峰值回流温度（摄氏度）	260
座面最大高度	0.8 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.2 V
标称供电电压 (Vsup)	1.6 V
表面贴装	YES
技术	BICMOS
温度等级	INDUSTRIAL
端子面层	TIN
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	3 mm
Base Number Matches	1

MAX6782TEB+相似产品对比

	MAX6782TEB+	MAX6782TEC+	MAX6785TCC+	MAX6785TCB+	MAX6786TA+	MAX6787TA+	MAX6788TA+	MAX6789TB+	MAX6790TB+
描述	4-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16	4-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16	3-CHANNEL POWER SUPPLY SUPPORT CKT, QCC12, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12	3-CHANNEL POWER SUPPLY SUPPORT CKT, QCC12, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12	2-CHANNEL POWER SUPPLY SUPPORT CKT, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	2-CHANNEL POWER SUPPLY SUPPORT CKT, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	2-CHANNEL POWER SUPPLY SUPPORT CKT, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	4-CHANNEL POWER SUPPLY SUPPORT CKT, DSO10, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEED-3, TDFN-10	4-CHANNEL POWER SUPPLY SUPPORT CKT, DSO10, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEED-3, TDFN-10
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
零件包装代码	QFN	QFN	QFN	QFN	DFN	DFN	DFN	DFN	DFN
包装说明	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-1, TQFN-12	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEEC, TDFN-8	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEED-3, TDFN-10	3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO229/WEED-3, TDFN-10
针数	16	16	12	12	8	8	8	10	10
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
可调阈值	NO	NO	NO	NO	NO	NO	NO	NO	NO
模拟集成电路 - 其他类型	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT	POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码	S-XQCC-N16	S-XQCC-N16	S-XQCC-N12	S-XQCC-N12	S-XDSO-N8	S-XDSO-N8	S-XDSO-N8	S-XDSO-N10	S-XDSO-N10
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3	e3
长度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
湿度敏感等级	1	1	1	1	1	1	1	1	1
信道数量	4	4	3	3	2	2	2	4	4
功能数量	1	1	1	1	1	1	1	1	1
端子数量	16	16	12	12	8	8	8	10	10
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	VQCCN	VQCCN	VQCCN	VQCCN	VSON	VSON	VSON	VSON	VSON
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
座面最大高度	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
标称供电电压 (Vsup)	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN	TIN	TIN	TIN	TIN	TIN	TIN	MATTE TIN	TIN
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm

MAX6782TEB+

MAX6782TEB+概述

MAX6782TEB+规格参数

MAX6782TEB+相似产品对比

推荐资源